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Open accessProceedings ArticleDOI
24 Sep 2005
47 Citations
On the other hand, a further increase in the number of transistors on a single chip enables integrated hardware support for functions that formerly were restricted to the software domain.
Consequently, these reduce the number of transistors used for a BIST circuit.
The results demonstrate a new scheme of building nanometer-scale transistors.
Proceedings ArticleDOI
01 Jan 1977
11 Citations
Measurement of these devices reveals superior thermal characteristic and assures a larger ASO than that of conventional bipolar transistors of the same chip size.
Proceedings ArticleDOI
R. Heald, P. Wang 
07 Nov 2004
131 Citations
Hence, the small transistors in SRAM cells are particularly sensitive to these variations.
The chip has a novel wiring structure in which all pixels are connected through the channel of MOS transistors, which simplifies a wiring structure compared with conventional resistive networks.
Two transistors next to each other on the chip with exactly the same geometries and strain distributions may have characteristics from each end of a wide statistical distribution.
The developed design strategy statistically sizes different transistors of the SRAM cell and optimizes the number of redundant columns to be used in the SRAM array, to minimize the failure probability of a memory chip under area and leakage constraints.

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What is the number of studies on memcapacitor emulator in the literature?
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What are the current distance ranges of RFID technology updated during 2023-2024?
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In recent advancements in RFID technology during 2023-2024, significant progress has been made in extending the distance ranges of RFID systems. Various techniques have been developed to enhance the positioning capabilities of RFID tags. These include utilizing Received Signal Phase (RSP) methods on 5.8 GHz backscatter tunneling tags, achieving distances up to 35 meters from the reader with minimal distance errors. Additionally, the deployment of RFID technology for indoor positioning has seen improvements through techniques like phase difference of arrival (PDOA), overcoming limitations of phase differences and enabling accurate range estimation even with significant Round Trip Time of Flight (RTTF) measurement errors. Furthermore, advancements in long-range RFID readers have demonstrated ranges of up to 22 meters, particularly suitable for applications like electronic toll gates.
How transparent oxides can be used as gate dielectric?
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Transparent oxides can be utilized as gate dielectrics in various applications. For instance, in the study by Alshammari et al., a novel process was developed to fabricate thin film transistors (TFTs) using a binary oxide, Hf x Zn1- x O2- δ (HZO), for all transistor layers, including the gate and dielectric layers. This approach allowed for tuning the electronic properties of the oxide from conducting to insulating by adjusting the chemical precursors' flow ratio. Additionally, the work by ViolBarbosa et al. demonstrated that ionic liquid gating can induce a metallic phase in insulating films of WO3, altering the material's conductivity while maintaining transparency in the visible range. These studies highlight the versatility of transparent oxides in serving as gate dielectrics with tunable electronic properties for various electronic devices.
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Students face specific challenges when learning digital circuits, including the fear of errors in practical implementation, the need to adapt skills to rapid technological advancements, lack of interest in hardware-related courses, and constraints in online learning processes.These challenges highlight the importance of bridging theoretical knowledge with practical applications through simulation, reducing system size and energy consumption, increasing talent pools, and enhancing engagement experiences in digital learning. Overcoming these obstacles requires innovative teaching methods like structured inquiry-based learning, aligning course outcomes with program outcomes, and incorporating hands-on experiences and project-based learning to improve students' knowledge, creativity, and practical thinking in the field of digital circuits.
Is there an article about a led-array with individually addressable electrodes?
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Yes, there are multiple articles discussing LED arrays with individually addressable electrodes. One article presents a novel approach using GaN micro-light-emitting diodes (LEDs) with individually addressed n-electrodes, allowing for faster modulation and compatibility with NMOS transistor-based drivers. Another study introduces GaN-based micro-LED arrays with a reversed electrode structure, featuring a common p-electrode and individually addressable n-electrodes, enabling high-performance characteristics and compatibility with NMOS drivers for faster modulation. Additionally, a different research paper describes the fabrication of individually addressable GaN microdisk LED arrays, showcasing ultrahigh resolution and stable operation in free-standing and flexible forms. These articles collectively highlight advancements in LED array technology with individually addressable electrodes for various applications.
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Yes, there are articles discussing LED arrays with individually addressable cathodes and individually addressable anodes. One study presents a novel inverted, vertical microdisplay prototype device with individually addressing cathodes, demonstrating the use of silicon-based vertical Micro-LEDs with this configuration. Another article showcases a GaN-based micro-LED array with a common p-electrode and individually addressable n-electrodes, designed for faster modulation and visible light communication applications. These innovative LED array designs offer improved performance characteristics, such as enhanced brightness, heat dissipation, and modulation bandwidth, making them suitable for high-resolution displays, wearables, and VR/AR headsets.
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The common fabrication steps in producing bipolar junction transistors involve several key processes. These include implantation procedures to form different regions with varying dopant concentrations, creating extrinsic collector and base regions buried in the semiconductor substrate, forming surface-doped regions and insulating layers on the semiconductor substrate, and patterning photoresists to define openings for implantation processes with varying dopant concentrations. Additionally, steps such as forming well regions with different concentrations in the base and emitter regions, defining trenches and openings for silicon and silicon-germanium regions, and establishing a composite base region with specific dopant concentration levels are crucial in the fabrication process of bipolar junction transistors.
Forward rection coefficient of Surface Conjugation Parameter in ISFET biosensor ?
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Are there led arrays with individual addressable p and n contacts?
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LED arrays with individual addressable p and n contacts have been developed. These arrays feature a unique structure where each LED element has its own n-electrode while sharing a common p-electrode. This design minimizes series-resistance differences and enables compatibility with n-type metal-oxide-semiconductor (NMOS) transistor-based drivers for faster modulation. The individual addressability of the n-electrodes allows for precise control over each LED element in the array, enhancing performance characteristics such as optical power and modulation bandwidth. These advancements in LED array technology offer promising applications in areas like visible light communication, where high-speed data transmission without errors has been achieved using these individually addressable LED arrays.
Problems that need to be solved with memristors?
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