What is heat sink in amplifier?
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01 Jun 1993 16 Citations | Thus, both adhesives and associated processes are used to cover a wide spectrum of heat sink bonding to electronic components.<<ETX>> |
59 Citations | This new design of micro-channel heat sink have the potential to be employed for developing new generations of heat sinks with higher heat rejection capabilities for microelectronic devices. |
5 Citations | This simplified model can be used to determine the heat transfer performance of a heat sink embedded with a typical heat pipe or vapor chamber. |
39 Citations | This paper demonstrates that utilizing the proper layout can improve the comprehensive coefficient of a heat sink. |
52 Citations | This model will find utility in characterizing heat sinks and in allowing for quick assessments of the effect of varying heat sink properties. |
170 Citations | It is thus recommended for the design of the heat sink. |
46 Citations | This method can be used in the following research about the heat sink. |
Related Questions
Heat sink testing?4 answersHeat sink testing involves evaluating the performance and heat dissipation capabilities of different heat sink designs. Various factors such as operating conditions, heat transfer performance, and manufacturability are considered in the testing process. Wang et al. developed five new piezoelectric heatsinks and investigated their design types and operating conditions, finding that the heatsink should be placed between 10 and 20 mm from the heat source for optimal cooling effect. Jourdan et al. explored the use of additively manufactured topology-based lattice structures for liquid-cooled heat sinks, which showed promising results in terms of heat transfer performance and manufacturability. Xiang et al. developed a miniaturized phase change heat sink that demonstrated better heat transfer performance compared to traditional metal solid heat sinks, making it suitable for high power LED packaging. Cermak et al. compared the performance of graphite and aluminum heat sinks using thermocouples and a transient thermal tester, finding that both methods yielded similar results. Hung-Chou and Xiao-Feng developed a test device for heat sink testing, which involved measuring the temperature change of a heater with a temperature sensor.
How do heatsink profiles affect heat transfer?5 answersHeatsink profiles have a significant impact on heat transfer. The use of filet profiles at the top and bottom edges of conical protuberances in a liquid jet impingement on a cone heat sink enhances the average Nusselt number and overall heat transfer. Phase Change Materials (PCMs) embedded in metal-foam heatsinks under pulse heating conditions improve the cooling rate and provide a uniform and constant efficiency during the pulse. Heat transfer profiles with coaxial cylindrical inner and outer peripheries, along with blade-like heat transfer flanges, enhance heat transfer by creating a second space that is open to the exterior. The heat transfer characteristics of conduction, convection, and radiation for heatsinks are studied for power electronics, and an optimized heatsink model is proposed for temperature rise. The use of a layer of metal foam in a composite metal foam - phase change heatsink improves the cooling efficiency, with the location of the porous layer having minimal effect on the heatsink efficiency.
What is heatsink?3 answersA heatsink is a device used for cooling heat sources in electronic circuits or devices. It typically consists of a base plate and cooling fins. The base plate is attached to the heat source, and the cooling fins extend from it. The heatsink can be made of various materials, including carbon-based material with a metallic base at one end of the fins. Some heatsinks also incorporate phase change materials (PCM) contained in vessels to absorb heat produced by the heat-producing elements of the circuitry. In addition, heatsinks may have inserts made from materials with higher thermal conductivity than the base plate, which enhance heat transfer. Heatsinks can also serve as holders for components and provide space for electronic circuitry or electrical components. The material of the heatsink can influence its heat distribution, with higher thermal conductivity materials resulting in better heat distribution.
How does an amplifier works?5 answersAn amplifier works by taking an input signal and increasing its amplitude to produce an amplified output signal. It achieves this through various components and circuits. The amplifying circuit is connected to the input circuit and power supply circuit, allowing it to receive and amplify the input signal using an amplifying gain. The amplifier circuit includes an amplification transistor, bias circuit, inductor, and variable resistance circuit. The amplification transistor amplifies the high-frequency signal, while the bias circuit supplies a bias current to control the transistor. The inductor and variable resistance circuit are connected to the transistor to further enhance the amplification. Another amplifier design includes a biasing unit, amplifying unit, and Schmitt trigger. The biasing unit generates a bias current independent of the power supply, increasing power supply rejection ratio. The amplifying unit receives an input voltage and generates an amplified voltage based on the biasing current. The Schmitt trigger then generates and outputs a modified voltage. Additionally, an amplifier circuit can have two-stage amplifiers that provide high gain in high-gain mode and switch to single-stage amplification in low-gain mode by turning off the second-stage amplifier and coupling the first-stage amplifier to the output end through a signal isolation element. Finally, an amplifier circuit may include a voltage offset providing circuit and a voltage control capacitor to compensate for the amplifier circuit. The voltage offset providing circuit creates an offset voltage, and the voltage control capacitor adjusts the capacitance value based on the output voltage of the amplifier.
HOW A HEAT SINK BE effected by ram air?5 answersA heat sink can be affected by ram air by utilizing a heat exchanger that includes ram air layers and liquid pass layers. The ram air layers direct air flow and consist of ram air fins in fluid communication with the ram air flow. The liquid pass layers, on the other hand, consist of liquid pass fins in fluid communication with the liquid flow. These liquid pass layers are positioned adjacent to the ram air layers, allowing for heat exchange between the ram air flow and the liquid flow.
Additionally, a heat sink for a RAM can incorporate a chimney effect to create its own airflow. This heat sink includes pipes attached to a base, with air flow inlets formed by removing material from each pipe. The heat sink draws air in through these inlets, passes the air over a heated base, and then releases the heated air through outlets in the pipes. This process utilizes the cooling benefits of the chimney effect, allowing for heat dissipation without the need for a fan or air flow passageway.
Why thermal runaway is important in power amplifier?6 answers