Amorphous silicon

About: Amorphous silicon is a research topic. Over the lifetime, 26777 publications have been published within this topic receiving 423234 citations.

Threshold switching in hydrogenated amorphous silicon

Abstract: Threshold switching is observed in n+‐i‐n+ sandwich structures of hydrogenated amorphous silicon after an initial forming process. At the threshold voltage the device switches from a low conductance to a high conductance state. The devices remain stable after more than 109 switching operations at a pulse frequency of 10 kHz. It is suggested that in the high conductance state filamentary conduction occurs in a permanent altered region created during the forming process.

The structure and property characteristics of amorphous/nanocrystalline silicon produced by ball milling

Abstract: The structural transformation of polycrystalline Si induced by high energy ball milling has been studied. The structure and property characteristics of the milled powder have been investigated by x-ray diffraction, scanning electron microscopy, high-resolution electron microscopy, differential scanning calorimetry, Raman scattering, and infrared absorption spectroscopy. Two phase amorphous and nanocrystalline Si has been produced by ball milling of polycrystalline elemental Si. The nanocrystalline components contain some defects such as dislocations, twins, and stacking faults which are typical of defects existing in conventional coarse-grained polycrystalline materials. The volume fraction of amorphous Si is about 15% while the average size of nanocrystalline grains is about 8 nm. Amorphous elemental Si without combined oxygen can be obtained by ball milling. The distribution of amorphous Si and the size of nanocrystalline Si crystallites is not homogeneous in the milled powder. The amorphous Si formed is concentrated near the surface of milled particles while the grain size of nanocrystalline Si ranges from 3 to 20 nm. Structurally, the amorphous silicon component prepared by ball milling is similar to that obtained by ion implantation or chemical vapor deposition. The amorphous Si formed exhibits a crystallization temperature of about 660 °C at a heating rate of 40 K/min and crystallization activation energy of about 268 kJ/mol. Two possible amorphization mechanisms, i.e., pressure-induced amorphization and crystallite-refinement-induced amorphization, are proposed for the amorphization of Si induced by ball milling.

Gate-bias stress in amorphous oxide semiconductors thin-film transistors

Abstract: A quantitative study of the dynamics of threshold-voltage shifts with time in gallium-indium zinc oxide amorphous thin-film transistors is presented using standard analysis based on the stretched exponential relaxation. For devices using thermal silicon oxide as gate dielectric, the relaxation time is 3×105 s at room temperature with activation energy of 0.68 eV. These transistors approach the stability of the amorphous silicon transistors. The threshold voltage shift is faster after water vapor exposure suggesting that the origin of this instability is charge trapping at residual-water-related trap sites.

Absorption enhancement using photonic crystals for silicon thin film solar cells

Abstract: We propose a design that increases significantly the absorption of a thin layer of absorbing material such as amorphous silicon. This is achieved by patterning a one-dimensional photonic crystal (1DPC) in this layer. Indeed, by coupling the incident light into slow Bloch modes of the 1DPC, we can control the photon lifetime and then, enhance the absorption integrated over the whole solar spectrum. Optimal parameters of the 1DPC maximize the integrated absorption in the wavelength range of interest, up to 45% in both S and P polarization states instead of 33% for the unpatterned, 100 nm thick amorphous silicon layer. Moreover, the absorption is tolerant with respect to fabrication errors, and remains relatively stable if the angle of incidence is changed.

Selective area crystallization of amorphous silicon films by low-temperature rapid thermal annealing

Abstract: We report the first demonstration of selective area crystallization of amorphous silicon films using low‐temperature rapid thermal annealing. Crystallization temperatures as low as 500 °C were achieved with the help of a thermally evaporated ultrathin metal layer. The selective area crystallization was accomplished by using this ultrathin metal layer to define the region to be crystallized. The edge between two regions, that which has been crystallized and that which has not, is found to be very sharp.