Showing papers on "Anodic bonding published in 1968"
Patent•
07 Mar 1968TL;DR: In this paper, a FLUOROCARBON RESIN to the surface of a SILICATE GLASS HAVING FREE, AVAILABLE SILANOL GROUPS by means of an INTERMEDIATE AMINO-FUNCTIONAL SILANE COUPLING AGENT and the PRODUCT FORMED thereby.
Abstract: METHOD OF BONDING A FLUOROCARBON RESIN TO THE SURFACE OF A SILICATE GLASS HAVING FREE, AVAILABLE SILANOL GROUPS BY MEANS OF AN INTERMEDIATE AMINO-FUNCTIONAL SILANE COUPLING AGENT AND THE PRODUCT FORMED THEREBY.
24 citations
Patent•
21 Nov 1968TL;DR: In this paper, an apparatus for alternately or sequentially connecting electrical leads of a beam-lead device to a carrier is described, where a bonding tool is mounted in a housing and is pivoted about a focal point at the working face of the tool to alternately engage the electrical leads connecting the tool and the carrier.
Abstract: An apparatus for alternately or sequentially connecting electrical leads of a beam-lead device to a carrier. A bonding tool is mounted in a housing and is pivoted about a focal point at the working face of the tool to alternately engage the electrical leads connecting the tool and the carrier.
15 citations
Patent•
16 Oct 1968
TL;DR: In this paper, the authors discussed a process of metallurgically bonding a PLATINUM COATING to a base metal by applying to the base METAL an EASILY REDUCED METAL WHICH will not OXIDIZE and thereafter APPLYING MOLTEN PlatinUM in DROPLETFORM ONTO the REDUCed METAL.
Abstract: THERE IS DISCLOSED A PROCESS OF METALLURGICALLY BONDING A PLATINUM COATING TO A BASE METAL BY APPLYING TO THE BASE METAL AN EASILY REDUCED METAL WHICH WILL NOT OXIDIZE AND THEREAFTER APPLYING MOLTEN PLATINUM IN DROPLET FORM ONTO THE REDUCED METAL. THE CONTEMPLATED BASE METALS INCLUDE IRON OR NICKEL BASE ALLOYS SUCH AS INCONEL, NICHROME, AND THE LIKE. THE CONTEMPLATED REDUCED METAL IS GOLD, SILVER, OR COPPER. THE APPLICATION OF THE MOLTEN PLATINUM IN DROPLET FORM MAY BE BY A FLAME-SPRAY OR PLASMA-JET SPRAY TECHNIQUE.
11 citations
Patent•
26 Jun 19688 citations
TL;DR: In this article, a new technique for attaching external package leads to metallized substrates is presented, which consists of a base for positioning the substrate and a bonding tip which applies the necessary pressure and temperature to produce a bond.
Abstract: A new technique for attaching external package leads to metallized substrates is presented. Gold-plated copper lead frames and gold-plated headed leads of various compositions are thermocompression bonded to metallized alumina substrates. The generated patterns on the substrates consist of an evaporated layer of gold over an evaporated layer of titanium. The leads are bonded simultaneously to form gold diffusion bonds between the leads and the metallized substrate. The lead frames are stamped from 0.005 inch and 0.010 inch thick copper. The headed leads range in size from 0.017 inch in diameter to 0.025 inch square. The various problems encountered in the development of this technique and their related solutions will be discussed. The bonding tool consists of a base for positioning the substrate and a bonding tip which applies the necessary pressure and temperature to produce a bond. The base and bonding tip for lead frames can compensate for camber and nonuniform thickness in the ceramic while the base and bonding tip for headed leads are noncompensating. The various parameters of bonding time, bonding temperature, bonding force, and bond strengths will be presented. In addition, hermetic seal evaluations will be discussed. A comparative cost analysis will be made between attaching leads individually by welding versus attaching all package leads simultaneously by the thermocompression bonding technique. This investigation has opened additional avenues toward determining the full scope and capability of thermocompression bonding in an area previously dominated by brazing and the sealing of metal to glass and/or ceramics.
1 citations