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Showing papers on "Anodic bonding published in 1972"


Patent
17 Jan 1972
TL;DR: In this paper, a fluid epitaxially active crystalline primary layer is applied to a glass plate consisting of a glass inclined to crystallization, which is subjected to a temperature treatment to cause a reaction between the glass plate and the primary layer.
Abstract: The mechanical strength of glass is improved by applying a fluid epitaxially active crystalline primary layer to a glass plate consisting of a glass inclined to crystallization. The glass plate with the mentioned fluid layer thereon is subjected to a temperature treatment to cause a reaction between the glass plate and the primary layer. During this reaction, the primary layer is effective to cause in and near the surface of the glass plate an elimination of at least a portion of the crystals which have a smaller thermic expansion coefficient than the starting glass of the glass plate.

14 citations


Journal ArticleDOI
TL;DR: In this paper, the theoretical explosive bonding mechanism is supported by experimental data and a large variety of similar and dissimilar metal pairs were joined reliably and repeatedly with bond strengths greater than those of the parent metals.
Abstract: Primary explosive systems, as described, are now being used as a safe and predictable energy source to bond metals on a size scale comparable to microcircuit electrical interconnections. Basic primary explosive reaction characteristics have been analyzed and related to effective bond mechanisms for solid-phase explosive bonding of several metal combinations. Methods and materials systems were devised to accurately deposit a specific quantity and configuration of explosive with predetermined reaction characteristics. This has permitted a significant advance in use of explosive bonding on a microscale. The theoretical explosive bonding mechanism is supported by experimental data. Included in considerations are surface jetting characteristics which influence interface structures and are responsible for removing surface oxides and contaminants. A large variety of similar and dissimilar metal pairs was joined reliably and repeatedly with bond strengths greater than those of the parent metals. Explceive bonding advantages and disadvantages considering materials and bonding equipment requirements are cited.

2 citations