Topic
Antimony
About: Antimony is a research topic. Over the lifetime, 11450 publications have been published within this topic receiving 155660 citations. The topic is also known as: Sb & element 51.
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TL;DR: In this paper, a new type of the antimony electrode based on a carbon paste bulk-modified with antimony powder (Sb-CPE) was presented for the determination of cadmium(II) and lead(II), when using square-wave anodic stripping voltammetric or stripping chronopotentiometric protocol.
52 citations
TL;DR: In this article, a comprehensive process for separating and recovering antimony from a complex stibnite concentrate is introduced, where antimony is first leached through a chlorination-oxidation procedure to obtain SbCl3 solution.
52 citations
TL;DR: In this paper, Antimony doped tin oxide (ATO) nanoparticles were prepared by coprecipitation reaction in methanol solution of tin(IV) chloride pentahydrate and antimony(III) chloride.
52 citations
52 citations
TL;DR: In this article, the effects of a third element, namely silver, copper, zinc, or antimony, on the microstructure and mechanical properties of eutectic tin-bismuth (Sn-Bi) solder were investigated.
Abstract: The effects of a third element, namely silver, copper, zinc, or antimony, on the microstructure and mechanical properties of eutectic tin-bismuth (Sn–Bi) solder were investigated. The investigation showed that, except for zinc, the addition of a trace amount of the third element improves the ductility of the Sn–Bi solder owing to the formation of a fine, homogeneous ternary eutectic microstructure. In particular, the antimony addition is the most effective in improving solder ductility. That is to say, the addition of 0.5 wt% antimony minimizes the grain size of the eutectic microstructure and increases the elongation up to about 40%. Moreover, an intermetallic compound, namely, SnSb, precipitated finely from the solid tin solution near the grain boundaries with bismuth. This fine precipitated intermetallic compound suppresses the coarsening of the eutectic structure and thus improves solder ductility.
51 citations