Balun

About: Balun is a research topic. Over the lifetime, 5375 publications have been published within this topic receiving 52256 citations. The topic is also known as: Telephone balance unit.

Investigation on Current Reduction Effects of Baluns for Measurement of a Small Antenna

Abstract: When connected to a small antenna that is undergoing testing, metal cables, such as coaxial cables, sometimes cause significant errors. This effect can be large when the antenna and ground plane are small and asymmetric. A balun is proposed for use in antenna measurement to reduce the influence of measurement cables. Baluns were originally utilized for a transformer set between unbalanced and balanced lines to feed a balanced antenna, such as a dipole antenna. Many types of baluns are used to transform unbalanced lines into balanced lines, and vice versa. However, when it comes to the utilization of baluns for antenna measurement, it is not clear whether all types of baluns can reduce the influence of the measurement cable. In this paper, baluns are sorted into two groups with regard to their effect on the reduction in unbalanced current when measuring a small antenna. Furthermore, the effect of a balun on improving the accuracy of impedance and radiation pattern measurements is also investigated.

3d mmic balun and methods of making the same

Abstract: A three dimensional (3D) monolithic integrated circuit (MMIC) balun and methods of making the same are provided. A primary spiral winding is spaced apart from a secondary primary winding by a gap in a substantially aligned stacked configuration forming a balun. The gap medium can be a low dielectric constant material if employing a multi-metal process or air if employing a wafer level packaging process.

Dual-chip GaAs monolithic integration Ku-band phase-locked-loop microwave synthesizer

Abstract: Two novel multifunction monolithic chips, GaAs microwave monolithic integrated circuit (MMIC) and large-scale integration (LSI) chips, have been developed to realize an extremely small and lightweight microwave synthesizer. The MMIC includes a voltage-controlled oscillator, a dual-output buffer amplifier, a balun, and dynamic/static prescalers. To integrate these functions on a single chip, each circuit has been drastically reduced in size by utilizing a uniplanar MMIC configuration. The LSI includes a dual-modulus prescalar, programmable counters, and a phase/frequency comparator. By incorporating these two monolithic chips in the structure, a Ku-band microwave synthesizer has been fabricated in an 11-mm*23-mm flat package. The synthesizer to which these multifunction chips were applied had a tuning range broader than 1 GHz in the Ku-band with a flatness within 2 dB/sub pp/. In spite of low-Q monolithic circuitry, single-sideband (SSB) phase noise was as low as -70 dBc/Hz. >

Single-Chip 60 GHz Transmitter and Receiver MMICs in a GaAs mHEMT Technology

Abstract: Single-chip 60 GHz transmitter (TX) and receiver (RX) MMICs have been designed and characterized in a 0.15 mum, ~120 GHz fT/> 200 GHz fMAX GaAs mHEMT MMIC process. This paper describes the second generation of single-chip TX and RX MMICs developed in our group. Compared to our first designs in a commercial pHEMT technology, the MMICs presented in this paper show the same high level of integration but occupy smaller chip area and have higher gain and output power at only half of the DC power consumption. The system operates with an LO signal in the range 7-8 GHz. This LO signal is multiplied in an integrated multiply-by-eight (times8) LO chain, resulting in an IF center frequency of 2.5 GHz. The single chip TX MMIC consists of a balanced resistive mixer with an integrated ultra wideband IF balun, a three-stage amplifier and the times8 LO chain. The times8 is a multifunction design by itself consisting of a quadrupler, a feed back amplifier, a doubler, and a buffer amplifier. The TX chip delivers 4.1 plusmn 1.5 dBm over an RF frequency range of 56.5 to 64.5 GHz. The peak output power is 5.6 dBm measured at 60 GHz and the overall TX chip consumes 420 mW of DC power. The single chip RX MMIC contains a three-stage low noise amplifier, an image reject mixer with an integrated ultra wideband IF hybrid and the same times8 as used in the TX chip. The RX chip has more than 10.7 dB gain between 54.5 and 64.5 GHz and more than 13 dB of image rejection ratio between 57.5 and 67.5 GHz with a peak image rejection ratio of 22.5 dB at 64 GHz. The input referred third order intercept point, IIP3 is measured to -10 dBm at 60 GHz and the overall RX chip consumes 450 mW of DC power

Analysis and design of multi-octave MMIC active baluns using a distributed amplifier gate line termination technique

Abstract: The analysis and design of a multi-octave MMIC active balun is described in this paper. The technique employed uses the gate-line 'termination' of a distributed amplifier topology as a non-inverting output. Closed-form expressions for the two output signals have been derived. The MMIC prototype has achieved balun operation over 0.5 to 20 GHz with a 10/spl deg/ maximum phase error. >