Topic
Balun
About: Balun is a research topic. Over the lifetime, 5375 publications have been published within this topic receiving 52256 citations. The topic is also known as: Telephone balance unit.
Papers published on a yearly basis
Papers
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TL;DR: A quad-band GSM/GPRS/EDGE receiver, implemented in 65 nm CMOS, complies with the ETSI standard without the need of external SAW filters by exploring the properties of passive mixers and current-mode operation from RF to baseband to achieve a SAW-filter-like selectivity.
Abstract: A quad-band GSM/GPRS/EDGE receiver, implemented in 65 nm CMOS, complies with the ETSI standard without the need of external SAW filters. By exploring the properties of passive mixers and current-mode operation from RF to baseband, the receiver can achieve a SAW-filter-like selectivity with inexpensive on-chip components such as resistors and capacitors. In addition, to alleviate the linearity bottleneck at the LNA input stage, Class-AB self-bias LNTA is employed to break the conventional trade-off's among NF, linearity and power consumption. For single-to-differential conversion, external LC-CL baluns (instead of on-chip baluns) are used to balance the on-chip die and external BOM cost. This receiver solution is embedded as a part of a cellular phone SoC and achieves ; +1 dBm Out-of-Band Pι dB and consumes 58.9 mA. In FTA test, the receiver passes out-of-band blocker test with >; 4 dB margin.
47 citations
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TL;DR: In this article, a broadband dual-polarized notched-band antenna is proposed for the application of 2/3/4/5G base stations, which is composed of a pair of crossed printed dipoles and is fed by both broadband baluns.
Abstract: A broadband dual-polarized notched-band antenna is proposed for the application of 2/3/4/5G base stations. The radiator of the antenna is composed of a pair of crossed printed dipoles and is fed by both broadband baluns. Based on the broadband dual-polarized antenna with a tooth-shaped slot line in the baluns, a crossed dumbbell-shaped parasitic element is proposed above the radiator to generate a notch band from 2.9 to 3.1 GHz and improve the impedance matching in the operating band (1.71–2.69 GHz and 3.4–3.6 GHz). To verify the principle, the antenna was fabricated and measured. The experimental results confirm that it achieves a bandwidth covering 1.71–3.6 GHz (VSWR 35 dB in the operating band. The antenna has a half-power beamwidth within 69.5 ± 4° and gain within 8.1 ± 0.4 dBi in the 2/3/4G bands, and a gain within 6.6 ± 0.5 dBi in the 5G band.
47 citations
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01 Jul 1987TL;DR: In this paper, a microstrip groundplane conductor is split into two balanced ground arms at one end, and a unique microstrip excitation structure is placed above the split ground elements on the opposed surface of the substrate to excite the antenna.
Abstract: An balun/antenna apparatus is provided which is capable of being fabricated on a printed circuit board substrate by automated equipment. The balun-antenna includes a microstrip groundplane conductor which is split into two balanced ground arms at one end. The split groundplane conductor operates as both a balun and as a radiating conductor. A unique microstrip excitation structure is situated above the split ground elements on the opposed surface of the substrate to excite the antenna with radio frequency energy.
46 citations
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11 Jun 2006TL;DR: In this paper, an active double-balanced mixer for automotive applications in the 77 GHz range is presented, which includes on-chip baluns both at the RF and the LO port.
Abstract: An active double-balanced mixer for automotive applications in the 77 GHz range is presented. The circuit includes on-chip baluns both at the RF and the LO port. The mixer was designed and fabricated in a 200 GHz f/sub T/ SiGe:C bipolar technology. The chip was characterized by on-wafer measurements. At 77 GHz, the conversion gain of the mixer is 11.5 dB. The single sideband noise figure at 77 GHz is 15.8 dB. The input-referred 1 dB compression point at 75 GHz is -0.3 dBm. Measurements across the wafer verified that this mixer circuit is robust against wafer inhomogeneities. The size of the chip is 700/spl mu/m /spl times/ 900/spl mu/m. The circuit was designed for a supply voltage of 5.5 V and draws 75 mA.
46 citations
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28 Nov 1994
TL;DR: In this article, the authors propose a method for connecting two twisted pair lines in a LAN so as to avoid common mode current, by placing a balun at the connection between the lines.
Abstract: A method for connecting together two twisted pair lines in a LAN so as to avoid common mode current The invention recognizes that the impedance to ground is different for each wire in the twisted pair line Moreover, this impedance is different from spool-to-spool for lines having the same purported impedance A balun is placed at the connection between the lines
46 citations