Topic
Bend radius
About: Bend radius is a(n) research topic. Over the lifetime, 3303 publication(s) have been published within this topic receiving 35415 citation(s). The topic is also known as: minimum bend radius.
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TL;DR: In this paper, the authors reviewed recent research on fiber optic long-period gratings (LPGs) with emphasis placed upon the characteristics of LPGs that make them attractive for applications in sensing strain, temperature, bend radius and external index of refraction.
Abstract: Recent research on fibre optic long-period gratings (LPGs) is reviewed with emphasis placed upon the characteristics of LPGs that make them attractive for applications in sensing strain, temperature, bend radius and external index of refraction. The prospect of the development of multi-parameter sensors, capable of simultaneously monitoring a number of these measurands will be discussed.
1,129 citations
TL;DR: This work demonstrates organic transistors and complementary circuits that continue to operate without degradation while being folded into a radius of 100 μm, enabled by a very thin plastic substrate, an atomically smooth planarization coating and a hybrid encapsulation stack that places the transistors in the neutral strain position.
Abstract: Flexible electronic circuits are an essential prerequisite for the development of rollable displays, conformable sensors, biodegradable electronics and other applications with unconventional form factors. The smallest radius into which a circuit can be bent is typically several millimetres, limited by strain-induced damage to the active circuit elements. Bending-induced damage can be avoided by placing the circuit elements on rigid islands connected by stretchable wires, but the presence of rigid areas within the substrate plane limits the bending radius. Here we demonstrate organic transistors and complementary circuits that continue to operate without degradation while being folded into a radius of 100 μm. This enormous flexibility and bending stability is enabled by a very thin plastic substrate (12.5 μm), an atomically smooth planarization coating and a hybrid encapsulation stack that places the transistors in the neutral strain position. We demonstrate a potential application as a catheter with a sheet of transistors and sensors wrapped around it that enables the spatially resolved measurement of physical or chemical properties inside long, narrow tubes.
1,046 citations
IBM1
TL;DR: The fabrication and accurate measurement of propagation and bending losses in single-mode silicon waveguides with submicron dimensions fabricated on silicon-on-insulator wafers with record low numbers can be used as a benchmark for further development of silicon microphotonic components and circuits.
Abstract: We report the fabrication and accurate measurement of propagation and bending losses in single-mode silicon waveguides with submicron dimensions fabricated on silicon-on-insulator wafers. Owing to the small sidewall surface roughness achieved by processing on a standard 200mm CMOS fabrication line, minimal propagation losses of 3.6+/-0.1dB/cm for the TE polarization were measured at the telecommunications wavelength of 1.5microm. Losses per 90 masculine bend are measured to be 0.086+/-0.005dB for a bending radius of 1microm and as low as 0.013+/-0.005dB for a bend radius of 2microm. These record low numbers can be used as a benchmark for further development of silicon microphotonic components and circuits.
955 citations
Patent•
04 Jun 1993
TL;DR: In this article, a medical staple forming die and pusher punch for use in a staple forming machine is presented, where the bend radius of the staple is formed either by the form punch pushing the wire past a set of rollers, or by movable forming dies in conjunction with a tapered or contoured pusher punched.
Abstract: A medical staple forming die and pusher punch for use in a staple forming machine. The bend radius of the staple is formed either by the form punch pushing the wire past a set of rollers, or by movable forming dies in conjunction with a tapered or contoured pusher punch. Since the wire is not scrapping on a stationary rail, pulling thin or cracking in its corners is substantially eliminated and the possibility of metal slivers produced by the prior art scrapping methods is substantially reduced or eliminated.
529 citations
TL;DR: In this article, a new optical waveguide technology for integrated optics, based on propagation of long-range surface plasmon polaritons (LR-SPPs) along metal stripes embedded in dielectric, is presented.
Abstract: New optical waveguide technology for integrated optics, based on propagation of long-range surface plasmon polaritons (LR-SPPs) along metal stripes embedded in dielectric, is presented. Guiding and routing of electromagnetic radiation along nanometer-thin and micrometer-wide gold stripes embedded in polymer via excitation of LR-SPPs is investigated in the wavelength range of 1250-1650 nm. LR-SPP guiding properties, such as the propagation loss and mode-field diameter, are investigated for different stripe widths and thicknesses. A propagation loss of /spl sim/6 dB/cm, a coupling loss of /spl sim/0.5 dB (per facet), and a bend loss of /spl sim/5 dB for a bend radius of 15 mm are evaluated for 15-nm-thick and 8-/spl mu/m-wide stripes at the wavelength of 1550 nm. LR-SPP-based 3-dB power Y-splitters, multimode interference waveguides, and directional couplers are demonstrated and investigated. At 1570 nm, coupling lengths of 1.9 and 0.8 mm are found for directional couplers with, respectively, 4- and 0-/spl mu/m-separated waveguides formed by 15-nm-thick and 8-/spl mu/m-wide gold stripes. LR-SPP-based waveguides and waveguide components are modeled using the effective-refractive-index method, and good agreement with experimental results is obtained.
401 citations