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Bend radius

About: Bend radius is a research topic. Over the lifetime, 3303 publications have been published within this topic receiving 35415 citations. The topic is also known as: minimum bend radius.


Papers
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Patent
31 Jan 2001
TL;DR: In this article, a disk drive is disclosed comprising an actuator arm, a head coupled to the actuator, and a voice coil motor for actuating the arm to move the head.
Abstract: A disk drive is disclosed comprising an actuator arm, a head coupled to the actuator arm, and a voice coil motor for actuating the actuator arm to move the head. The voice coil motor comprises a first magnet for generating a first magnetic flux, and a yoke comprising a magnetic flux conductor for guiding the first magnetic flux. The magnetic flux conductor comprises a body and a top and bottom protruding plate portions, wherein the body and the plate portions are integrally formed. The body defines, in vertical cross section, a primary bend having a primary bend radius and at least one secondary bend having a secondary bend radius.

53 citations

Journal ArticleDOI
TL;DR: In this paper, the effect of the tube-bending process on subsequent crashworthiness of aluminum alloy s-rail structures was examined through experiments, and the effects of bending process parameters, tube initial thickness, thickness changes, work hardening and bend radius on the energy absorption characteristics of srail impact structures were assessed.

53 citations

Journal ArticleDOI
TL;DR: In this article, a flexible polyimide (Kapton) substrate was used to encapsulate brittle inorganic materials in thin-film transistors (TFTs) by gluing a second patterned flexible Polyimide substrate on top.
Abstract: Flexible electronic devices are influenced by mechanical impacts or bending. This mechanical stress can damage brittle inorganic thin-film layers. One way to improve the stability of such devices is to encapsulate them. For this reason, we encapsulate brittle inorganic materials in our thin-film transistors (TFTs) on flexible polyimide (Kapton) substrates by gluing a second patterned flexible polyimide substrate on top. The developed encapsulation method has the advantages of low process temperatures and micrometer alignment between features on the two substrates and does not damage any thin-film device layer. We are able to bend encapsulated TFTs down to a radius of 125 μm without loss of functionality. At this bending radius, the saturation mobility decreases by 3%, and the threshold voltage shifts by 0.2 V. Compared with nonencapsulated TFTs, we decrease the bending radius before the devices fail by an order of magnitude.

52 citations

Journal ArticleDOI
TL;DR: In this article, the authors used the Lemaitre and Cockcroft-Latham (C&L) criteria to predict the position at which damage will occur and its distribution for both spin forming and tube bending.

52 citations

Patent
08 Jul 2008
TL;DR: In this paper, an apparatus and method for compensating for mode-profile distortions caused by bending optical fibers having large mode areas was proposed, which micro-structures the index of refraction in the core and surrounding areas of the inner cladding from the inner bend radius to the outer bend radius in a manner that compensates for the index changes induced by the geometry and/or stresses to the fiber caused by the bending.
Abstract: An apparatus and method for compensating for mode-profile distortions caused by bending optical fibers having large mode areas. In various embodiments, the invention micro-structures the index of refraction in the core and surrounding areas of the inner cladding from the inner bend radius to the outer bend radius in a manner that compensates for the index changes that are otherwise induced in the index profile by the geometry and/or stresses to the fiber caused by the bending.

52 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202365
2022172
202181
2020112
2019135
2018153