Showing papers on "Blisters published in 1984"
TL;DR: In this article, a double metal gate of Pd/Pt was proposed to avoid the hydrogen-induced lattice expansion of the Pd film without any loss of the hydrogen sensitivity.
Abstract: Blister formation in palladium gate MISFET hydrogen sensors occurs even at low hydrogen pressures and the sensors fail in long-time operation. The blisters in the Pd gate are due to hydrogen-induced lattice expansion of the Pd film. By making a double metal gate of Pd/Pt, the problem is avoided without any loss of the hydrogen sensitivity.
35 citations
TL;DR: It is concluded that suction blisters of the skin behave like a dynamic interstitium-like compartment with dynamic physiological properties in six young men without known skin disease.
Abstract: In six young men without known skin disease we evaluated whether mild suction to the skin significantly alters the properties of the underlying capillaries or whether suction blisters can be regarded as an interstitium-like compartment with dynamic physiological properties. Instead of the usual technique where the tracer is administered intravenously prior to the suction, we postponed the administration of the tracer (99mTc-DTPA) to 15 min after the suction blisters had been formed on the abdominal skin. We found that the final slope of average interstitium 99mTc-DTP A was almost parallel to that of the final slope of 99mTc-DTP A in the blister fluid (r = 0.917). During the period 120-240 min after the injection where the final slopes could be defined, the ratio between the amount of 99mTc-DTPA present in the interstitium and the amount of 99mTc-DTPA present in a blister fluid volume equal to interstitial fluid volume was 1.3. It is concluded that suction blisters of the skin behave like a dynamic interst...
21 citations
TL;DR: In this article, the blisters produced by 200 keV D+ irradiation of Cu at 120 K and subsequent heating to room temperature are found to be of two distinct types: small semi-spherical blisters and large blister flakes.
13 citations
Patent•
10 Dec 1984
TL;DR: In this article, a process for avoiding blister formation between a metal layer which is electrolessly deposited on a surface of a ceramic substrate and the substrate is described. But, it is not shown how to avoid the formation of blisters.
Abstract: A process for avoiding blister formation between a metal layer which is electrolessly deposited on a surface of a ceramic substrate and the substrate. The substrate is adhesion promoted with an alkali metal composition containing between 0.35 and 0.9 mole fraction alkali metal compound, and water in an amount which is sufficient to lower the melting temperature of the composition to between 145° and 240° C. and adhesion promote the ceramic surface with the molten composition in a time period between 1 and 200 minutes. Thereafter, the adhesion promoted ceramic surface may be activated to render it receptive to electroless metal deposition. The treated ceramic surface is coated free of blisters using an electroless metal deposition bath with an adherent, metal layer having a thickness greater than 5 micrometers.
11 citations
8 citations
TL;DR: In this paper, a scanning Auger electron microscopy technique was used to analyze 304 stainless steels whose surfaces were irradiated with 100 keV He and 2 keV Ar ions.
2 citations
TL;DR: In this paper, blisters were found in Zr-2.5 wt% Nb and high purity Zirconium, in either the fully annealed or 40% cold-worked conditions, were irradiated with 50 keV helium ions at temperatures between 100 K and 773 K to doses up to 2 × 10 22 ions/m 2.
1 citations
Patent•
20 Sep 1984
TL;DR: In this article, a zinc-coated steel sheet for a beautiful culvert, while inhibiting the formation of blisters after coating even when a hot-rolled material is used as a substrate, was obtained by adding the limited amount of B or Ti to aluminum-killed steel having a specified composition.
Abstract: PURPOSE:To obtain the titled zinc-coated steel sheet for a beautiful culvert, while inhibiting the formation of blisters after coating even when a hot-rolled material is used as a substrate, by adding the limited amount of B or Ti to aluminum-killed steel having a specified composition. CONSTITUTION:Zinc plating in an amount of adhesion above 610g/m is applied onto the hot-rolled material of aluminum-killed steel comprising C =0.20%, Ni<=0.30%, 0.01-0.08% soluble Al, 0.002-0.010% B or 0.10-0.20% Ti and the balance Fe. Hereon, since said amount of B or Ti is added to the components of the steel, the occluding power of said steel is enhanced so as to eliminate the discharge of occluded H2 after the coating. Consequently, the formation of blisters can be inhibited.