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Showing papers on "Blisters published in 2015"


Journal ArticleDOI
TL;DR: In this paper, surface modifications and deuterium retention induced in tungsten by high fluxes (1024 m−2 s−1) low energy (38 eV) D ions were studied as a function of surface temperature.

61 citations


Journal ArticleDOI
TL;DR: In this article, the effect of severe plastic deformation on deuterium retention in tungsten exposed to high-flux low-energy plasma was studied by thermal desorption spectroscopy and scanning electron microscopy.
Abstract: The effect of severe plastic deformation on the deuterium retention in tungsten exposed to high-flux low-energy plasma (flux ∼ 1024 D/m2/s, energy ∼ 50 eV, and fluence up to 3 × 1026 D/m2) at the plasma generator Pilot-PSI was studied by thermal desorption spectroscopy and scanning electron microscopy. The desorption spectra in both reference and plastically deformed samples were deconvolved into three contributions attributed to the detrapping from dislocations, deuterium-vacancy clusters, and pores, respectively. The plastically induced deformation, resulting in high dislocation density, does not change the positions of the three peaks, but alters their amplitudes as compared to the reference material. The appearance of blisters detected by scanning electron microscopy and the desorption peak attributed to the release from pores (i.e., deuterium bubbles) were suppressed in the plastically deformed samples but only up to a certain fluence. Beyond 5 × 1025 D/m2, the release from the bubbles in the deformed material is essentially higher than in the reference material. Based on the presented results, we suggest that a dense dislocation network increases the incubation dose needed for the appearance of blisters, associated with deuterium bubbles, by offering numerous nucleation sites for deuterium clusters eventually transforming into deuterium-vacancy clusters by punching out jogs on dislocation lines.

47 citations


Journal ArticleDOI
TL;DR: In this article, the effect of reducing the implantation energy towards low keV values on the areal density of He and H atoms stored within populations of blister cavities formed by co-implantation of the same fluence of He then H ions into Si(001) wafers and annealing was studied.
Abstract: We have studied the effect of reducing the implantation energy towards low keV values on the areal density of He and H atoms stored within populations of blister cavities formed by co-implantation of the same fluence of He then H ions into Si(001) wafers and annealing. Using a variety of experimental techniques, we have measured blister heights and depth from the surface, diameter, areal density of the cracks from which they originate as functions of implantation energy and fluence. We show that there is a direct correlation between the diameters of the cracks and the heights of the associated blisters. This correlation only depends on the implantation energy, i.e., only on the depth at which the cracks are located. Using finite element method modeling, we infer the pressure inside the blister cavities from the elastic deformations they generate, i.e., from the height of the blisters. From this, we demonstrate that the gas pressure within a blister only depends on the diameter of the associated crack and ...

31 citations


Journal ArticleDOI
TL;DR: In this article, the authors evaluated hydrogen-induced damage including blister and cracking in friction stir welded low carbon steel and found that after hydrogen charging for 2 hours, irreversible dome-shaped blisters and internal cracking began to appear on the surface of the base metal, while the blisters or cracking were hardly observed in the stir zone.

24 citations


Journal ArticleDOI
TL;DR: In this paper, it is shown that argon is trapped in the film during sputtering and migrates to locally form blisters during the high temperature annealing, which is detrimental for thin-film solar cell fabrication.
Abstract: Blister formation in Cu2ZnSnS4 (CZTS) thin films sputtered from a quaternary compound target is investigated. While the thin film structure, composition, and substrate material are not correlated to the blister formation, a strong link between sputtering gas entrapment, in this case argon, and blistering effect is found. It is shown that argon is trapped in the film during sputtering and migrates to locally form blisters during the high temperature annealing. Blister formation in CZTS absorbers is detrimental for thin film solar cell fabrication causing partial peeling of the absorber layer and potential shunt paths in the complete device. Reduced sputtering gas entrapment, and blister formation, is seen for higher sputtering pressure, higher substrate temperature, and change of sputtering gas to larger atoms. This is all in accordance with previous publications on blister formation caused by sputtering gas entrapment in other materials.

22 citations


Journal ArticleDOI
15 Jan 2015-Langmuir
TL;DR: A quantitative model describing the blister growth is developed, which accurately describes the temporal evolution of the blisters, and identifies osmosis as the driving force behind the blister formation.
Abstract: A failure mechanism of thin film polymers immersed in water is presented: the formation of blisters. The growth of blisters is counterintuitive as the substrates were noncorroding and the polymer does not swell in water. We identify osmosis as the driving force behind the blister formation. The dynamics of the blister formation is studied experimentally as well as theoretically, and a quantitative model describing the blister growth is developed, which accurately describes the temporal evolution of the blisters.

19 citations


Journal ArticleDOI
TL;DR: In this paper, a theoretical framework is presented to describe the bulging deformation of tungsten blisters and to estimate the mechanical driving force of blister growth, and the validity of the analytical formulations based on the theory of elastic plates is evaluated with the help of finite element analysis.

14 citations


Journal ArticleDOI
TL;DR: In this article, the effect of heat treatment and alloying elements on the deposition and characterization of E-paint was investigated on four different magnesium substrates: as-extruded AZ61 (AZ61), heat-treated AZ61(AZ61-H), heat treated TZ61 (TZ61), and heat-treated TZ-61(TZ-H).

14 citations


Journal ArticleDOI
TL;DR: An ultrafast, non-vacuum spatial ALD with the deposition rate of around 10 nm/min, developed by the group, is hired to deposit Al2O3 films and shows an obvious gain in open-circuit voltage (Voc) and short-circuits current (Jsc) because of the increased minority carrier lifetime and internal rear-side reflectance, respectively.
Abstract: Currently, aluminum oxide stacked with silicon nitride (Al2O3/SiNx:H) is a promising rear passivation material for high-efficiency P-type passivated emitter and rear cell (PERC). It has been indicated that atomic layer deposition system (ALD) is much more suitable to prepare high-quality Al2O3 films than plasma-enhanced chemical vapor deposition system and other process techniques. In this study, an ultrafast, non-vacuum spatial ALD with the deposition rate of around 10 nm/min, developed by our group, is hired to deposit Al2O3 films. Upon post-annealing for the Al2O3 films, the unwanted delamination, regarded as blisters, was found by an optical microscope. This may lead to a worse contact within the Si/Al2O3 interface, deteriorating the passivation quality. Thin stoichiometric silicon dioxide films prepared on the Si surface prior to Al2O3 fabrication effectively reduce a considerable amount of blisters. The residual blisters can be further out-gassed when the Al2O3 films are thinned to 8 nm and annealed above 650°C. Eventually, the entire PERC with the improved triple-layer SiO2/Al2O3/SiNx:H stacked passivation film has an obvious gain in open-circuit voltage (V oc) and short-circuit current (J sc) because of the increased minority carrier lifetime and internal rear-side reflectance, respectively. The electrical performance of the optimized PERC with the V oc of 0.647 V, J sc of 38.2 mA/cm2, fill factor of 0.776, and the efficiency of 19.18% can be achieved.

14 citations


Journal ArticleDOI
TL;DR: Epidermal suction blister grafts are an effective treatment for chronic wounds or vitiligo, but this treatment is time consuming and limited to small areas.
Abstract: Summary Background Epidermal suction blister grafts are an effective treatment for chronic wounds or vitiligo, but this treatment is time consuming and limited to small areas. Objectives To compare two novel strategies to create fractional epidermal grafts. Methods Epidermal blisters were raised from fresh human skin ex vivo at 38–40 °C, with suction of 380–510 mmHg. In Strategy 1, a 1-cm blister was micromeshed into approximately 500 pieces, transferred to elastic adhesive dressing, then pneumatically expanded to approximately nine times the original blister area. In Strategy 2, a 25-cm2 array of 100 small blisters was raised, simultaneously harvested and captured directly onto an adhesive dressing. Measurements were taken for the pneumatic expansion limit, the release of microblisters upon hydration of the dressing adhesive, light microscopy, epidermal cell viability and positive L-3,4 dihydroxyphenylalanine melanocyte presence in blisters. Results Both strategies yielded viable fractional epidermal microblister arrays, carried on a dressing for transfer to graft recipient sites. The microblisters were gradually released upon hydration of the dressing adhesive. Strategy 2 has major advantages as only small blisters are made at the donor site, skilful dissection and physical expansion are not required and the strategy can be scaled to create large-area grafts. Conclusions Strategy 2 is the more practical method for fractional epidermal micrografting to treat larger lesions with less donor-site trauma and has recently been commercialized.

12 citations


Journal ArticleDOI
TL;DR: In this article, surface morphology changes and deuterium retention in Toughened, Fine-Grained Recrystallized Tungsten (TFGR W) with TaC dispersoids (W-TaC) and pure tungsten exposed to D plasmas to a fluence of 1026-D/m2

Journal ArticleDOI
TL;DR: In this paper, the authors adopt the analytical blister propagation energy approach for waterproofing membranes and compare it with adhesive fracture energy from standard peeling test methods, already described in the literature.
Abstract: Bridge decks are commonly subjected to harsh environmental conditions that often lead to serious corrosion problems, which are triggered by blisters under the hot mix asphalt bridge deck pavement with waterproofing membranes. These blisters are secretly evolving during weather exposure until often being detected too late. Formation of blisters under the waterproofing membrane is caused by a complex mechanism governed by bottom–up pressure and loss of adhesion. This paper primarily intends to adopt the analytical blister propagation energy approach for waterproofing membranes and compare it with adhesive fracture energy from standard peeling test methods, already described in the literature. Three different types of polymer modified bitumen membranes (PBM) were used for this purpose. The investigation includes a comparison between uniaxial and biaxial testing conditions for determining the modulus of elasticity of the membranes. Moreover, the influence of the displacement rate and temperature on the adhesive fracture energy in peeling tests is investigated. It was found that the biaxial modulus of PBM in the longitudinal and transversal direction is comparable with the uniaxial tension testing results in the main directions. In addition, it was observed that the ratio of longitudinal and transversal modulus of elasticity was similar. The energy calculated from tests with elliptical blister propagation showed a comparable value to the standard peeling fracture energy for similar types of PBM.

Journal ArticleDOI
TL;DR: In this article, the thermal shock behavior of blister-covered W surfaces during combined steady-state/pulsed plasma loading was studied by scanning electron microscopy and electron backscatter diffraction.
Abstract: The thermal shock behaviour of blister-covered W surfaces during combined steady-state/pulsed plasma loading was studied by scanning electron microscopy and electron backscatter diffraction. The W samples were first exposed to steady-state D plasma to induce blisters on the surface, and then the blistered surfaces were exposed to steady-state/pulsed plasma. Growth and cracking of blisters were observed after the exposure to the steady-state/pulsed plasma, while no obvious damage occurred on the surface area not covered with blisters. The results confirm that blisters induced by D plasma might represent weak spots on the W surface when exposed to transient heat load of ELMs. The cracks on blisters were different from the cracks due to the transient heat loads reported before, and they were assumed to be caused by stress and strain due to the gas expansion inside the blisters during the plasma pulses. Moreover, most of cracks were found to appear on the blisters formed on grains with surface orientation near [1 1 1].

Journal Article
TL;DR: The patient was treated with leg elevation, loosely applied nonadhesive dressings, and a short course of oral antibiotics after skin desquamation, and the patient was able to resume intensive rehabilitation after resolution of the blisters.
Abstract: Fracture blisters are tense vesicles that arise on markedly swollen skin overlying traumatized soft tissue. While this relatively uncommon complication has been well described in the trauma literature, this article reports for the first time a case of fracture blisters after primary total knee arthroplasty. The fracture blisters developed within 36 hours of surgery and were associated with profound swelling and erythema. There was no evidence of vascular injury, compartment syndrome, iatrogenic fracture, or deep venous thrombosis. The patient was treated with leg elevation, loosely applied nonadhesive dressings, and a short course of oral antibiotics after skin desquamation. Blood-filled blisters required longer time to reepithelialization than fluid-filled blisters. Knee stiffness developed because of pain and fear of participation with physical therapy, but the patient was able to resume intensive rehabilitation after resolution of the blisters. Patient factors, surgical factors, and review of the literature are discussed.

Journal ArticleDOI
01 Mar 2015
TL;DR: In this paper, a laminar skin simulant was constructed to study the incidence of friction blisters and the effect of the applied normal load on the number of cycles required to produce a blister was investigated.
Abstract: A laminar skin simulant was constructed to study the incidence of friction blisters. The skin simulant consists of a thin polyurethane top layer and textured gum foam rubber bottom layer adhered to an acrylic-backing plate to emulate the layered structure of the human skin. Friction blisters were produced on the skin simulant by using a dual-axis tribometer. The effect of the applied normal load on the number of cycles required to produce a blister was investigated. The skin simulant was also analyzed as an adhesive-bonded laminar composite to determine the relationship between the applied normal load and the number of cycles for blistering. The normal load and the number of cycles were found to be inversely related and vary by a power law function, as observed in previous work on human subjects in Naylor’s pioneering study. The results obtained from the experimental data and the fracture mechanics modeling of the skin simulant indicate the potential of elastomeric skin simulant in providing useful insigh...

Journal ArticleDOI
01 Oct 2015
TL;DR: A broadband multilayer dielectric mirror coating of TiO2/SiO2 was manufactured on stainless steel substrate of grade 1.4429 with a mean specular reflectivity approaching 98% over the wavelength range of 450-670nm as discussed by the authors.
Abstract: A broadband multilayer dielectric mirror coating of TiO2/SiO2 was manufactured on stainless steel substrate of grade 1.4429 with a mean specular reflectivity approaching 98% over the wavelength range of 450–670 nm. The coating was tested under thermal conditions as expected for in-port mirrors in ITER, exceeding 1000 h at Tmirror = 260 °C with repeated thermal cycles in vacuum. They were also exposed to water vapour atmosphere at 120 °C. Reflectivity measurements were conducted at elevated temperature and room temperature in between tests. No significant change in specular reflectivity after excursions to 350 °C was found and reflectivity was measured to be stable at elevated temperature. Local defects developed during thermal testing in the form of blisters and flakes with up to 200 μm diameter. The blisters grew and flaked off over several days at elevated temperature. Exposure to water vapour and thermal gradients of +100 K h−1 and −200 K h−1 did not accelerate subsequent generation or growth of defects. Coatings with different interlayer were exposed to elevated temperature to study the impact on adhesion and defect generation.

Journal ArticleDOI
TL;DR: In this paper, surface morphology and deuterium retention in ultrafine-grained tungsten fabricated by equal-channel angular pressing (ECAP) have been examined after exposure to a low energy, high-flux deutium (D) plasma at fluences of 3×1024 D/m2 and 1×1025 D /m2 in a temperature range of 100°C-150°C.
Abstract: Surface morphology and deuterium retention in ultrafine-grained tungsten fabricated by equal-channel angular pressing (ECAP) have been examined after exposure to a low energy, high-flux deuterium (D) plasma at fluences of 3×1024 D/m2 and 1×1025 D/m2 in a temperature range of 100°C-150°C. The methods used were scanning electron microscopy (SEM) and thermal desorption spectroscopy (TDS). Sparse and small blisters (~0.1 μm) were observed by SEM after D plasma irradiation on every irradiated surface; yet they did not exhibit significant structure or plasma fluence dependence. Larger blisters or protrusions appeared after subsequent TDS heating up to 1000°C. The TDS results showed a single D desorption peak at ~220°C for all samples and the D retention increased with increasing numbers of extrusion passes, i.e., the decrease of grain sizes. The increased D retention in this low temperature range should be attributed to the faster diffusion of D along the larger volume fraction of grain boundaries introduced by ECAP.

Proceedings ArticleDOI
20 Apr 2015
TL;DR: In this paper, the blisters are shown to be unevenly distributed and with different dimensions depending on the structure area, indicating that some chemical reaction occurs at the interface at the blistered sites.
Abstract: Blistering of 11 nm and 45 nm-thick Al 2 O 3 layers deposited by ALD on silicon substrates is studied in Al-Al 2 O 3 -Si structures fabricated using a field isolated process. Blisters are shown to be unevenly distributed and with different dimensions depending on the structure area. After chemical etching down to silicon, round voids are revealed underneath the blisters depending on the etchant used, indicating that some chemical reaction occurs at the Al 2 O 3 -Si interface at the blistered sites.

Journal ArticleDOI
TL;DR: In this article, micro-and nano-scale surface damage on a W divertor component sample exposed to high heat flux loads generated with He atoms has been investigated through SEM, EBSD, AFM and FIB-SEM.

Journal ArticleDOI
TL;DR: In this paper, the effect of initial tension on the mechanics of adhered graphene blisters is investigated by extending Hencky's solution to cases with an initial tension, and the system parameters including maximum blister deflection, pressure difference across the membrane, and critical delamination pressure under various initial tensions are modeled and calculated.
Abstract: The effect of initial tension on mechanics of adhered graphene blisters is investigated by extending Hencky’s solution to cases with an initial tension The system parameters including maximum blister deflection, pressure difference across the membrane, and critical delamination pressure under various initial tensions are modeled and calculated The dependences of critical pressure on the radius and depth of etched microcavity are also demonstrated and compared with the previous work which does not consider the initial tension The results show that the added adhesion energy between monolayer graphene membrane and SiO2 substrate can reach 00954 J/m2 with a reported maximum initial tension of 24 N/m taken into account, which accounts for 212 % of the measured average value 045 J/m2 Thus, the initial tension should be considered in further adhesion energy measurements of graphene/substrate interfaces

Journal ArticleDOI
TL;DR: In this paper, an ultrathin Fe film grown epitaxially on top of a GaAs(001) substrate was used to create single-crystalline blisters and only a few nanometers thick.
Abstract: Starting from an ultrathin Fe film grown epitaxially on top of a GaAs(001) substrate, we show that freestanding structures can be created by ion-beam treatment. These structures are single-crystalline blisters and only a few nanometers thick. Anisotropic stress in the rim of a blister induces magnetic domain states magnetized in the direction normal to the blister edge. Experimental evidence is provided that the lateral size can be confined by starting from a nanostructured template.

Journal ArticleDOI
TL;DR: Wang et al. as discussed by the authors studied surface blistering morphologies of W thin films irradiated by 30-keV He ion beam and found that the blistering morphology strongly depends on He fluence.
Abstract: Surface blistering morphologies of W thin films irradiated by 30 keV He ion beam were studied quantitatively. It was found that the blistering morphology strongly depends on He fluence. For lower He fluence, the accumulation and growth of He bubbles induce the intrinsic surface blisters with mono-modal size distribution feature. When the He fluence is higher, the film surface morphology exhibits a multi-scale property, including two kinds of surface blisters with different characteristic sizes. In addition to the intrinsic He blisters, film/substrate interface delamination also induces large-sized surface blisters. A strategy based on wavelet transform approach was proposed to distinguish and extract the multi-scale surface blistering morphologies. Then the density, the lateral size and the height of these different blisters were estimated quantitatively, and the effect of He fluence on these geometrical parameters was investigated. Our method could provide a potential tool to describe the irradiation induced surface damage morphology with a multi-scale property.

Proceedings ArticleDOI
15 Apr 2015
TL;DR: In this paper, serious blisters were found on the shell surface of the gas tank which operated in wet H2S environment during a regular inspection Gas sampling device was used to determine that the gas in the blister is hydrogen The causes of blisters are analyzed and investigated by means of chemical analysis, metallographic examines, scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS).
Abstract: Serious blisters were found on the shell surface of the gas tank which operated in wet H2S environment during a regular inspection Gas sampling device was used to determine that the gas in the blister is hydrogen The causes of blisters were analyzed and investigated by means of chemical analysis, metallographic examines, scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) The results revealed that the elongated MnS inclusions are the important reason for the hydrogen blisters The preventive measures of the hydrogen blisters are put forward based on the above study

Patent
22 Jul 2015
TL;DR: In this paper, the utility model relates to a medicine blister package structure which comprises a base plate, a plurality of aluminum foils and blisters, and a pull bar is fixed to the position of the side edge or one corner of each aluminum foil.
Abstract: The utility model relates to a medicine blister package structure which comprises a base plate, a plurality of aluminum foils and blisters. The aluminum foils and the base plate are connected in a sealed, the blisters and the aluminum foils are respectively located on two sides of the base plate, the aluminum foils and the blisters are equal in number and correspond in position in a one-to-one mode, the aluminum foils are rectangular, and a pull bar is fixed to the position of the side edge or one corner of each aluminum foil. The medicine blister package structure has the advantages that the medicine blister package structure is easy to tear, low in manufacturing cost, safe and non-toxic, enables medicine to be more convenient to take out on the premise that the medicine sealing performance of the blisters is ensured, and has practicability.

Journal ArticleDOI
TL;DR: In this paper, inductively coupled plasma CVD (ICP-CVD) silicon nitride was used as the thin film and blisters were formed on the silicon-nitride film upon annealing at 800 ǫ$ c.
Abstract: We have demonstrated a novel process for the fabrication of inverted pyramidal structures on silicon. The proposed technique uses no photolithography step and is instead replaced by a thin-film deposition step and thermal annealing. In this paper, inductively coupled plasma CVD (ICP-CVD) silicon nitride was used as the thin film. Blisters were formed on the silicon nitride film upon annealing at 800 $^{\circ}$ C. The silicon nitride film remaining on the surface of the wafer acts as an etch mask for the texturization process, which is carried out in an alkaline solution. It was observed that only open blisters participated in the etch process, while closed blisters were resistant to the etching solution. It was observed that the gas flow ratio, annealing time, and temperature played an important role in determining the shape, size, and areal density of the blisters. By integrating an argon plasma pretreatment in the silicon nitride deposition process, surface coverage of 51% was obtained for lower annealing temperatures of 550 $^{\circ}$ C. Upon etching the sample in an alkaline solution, a weighted average reflectance of 17.3% was obtained, indicating the potential of this process.

Journal ArticleDOI
TL;DR: In this article, the formation of tungsten-deuterium films on a silicon substrate during the sputtering of a Tungsten target in magnetron discharge deuterium plasma is studied.
Abstract: The features of the formation of tungsten-deuterium films on a silicon substrate during the sputtering of a tungsten target in magnetron discharge deuterium plasma are studied. Scanning electron microscopy reveals the presence of blistered regions on the surface of the film; the concentration of these regions depends on the target-substrate distance. This distance is also responsible for the concentration of deuterium trapped in the films, which is determined by elastic recoil detection analysis. It is assumed that the deuterium retained by the film is located in pores and surface blisters that form the observed bulged regions. A possible cause of the formation of blisters and pores is the low solubility of deuterium in the Si substrate and the W film.

Patent
02 Mar 2015
TL;DR: In this paper, the authors proposed a method to suppress blisters caused by a gas generated by the reaction between components included in the coat layer of an image formation paper and the treatment liquid by controlling the temperature at which a paper P for image formation applied with a treatment liquid for ink aggregation is heated and dried.
Abstract: PROBLEM TO BE SOLVED: To provide an image formation method and an image formation device capable of suppressing blisters produced by a gas generated in a coat layer.SOLUTION: By controlling the temperature at which a paper P for image formation applied with a treatment liquid for ink aggregation is heated and dried and the dropping amount of ink drops, blisters caused by a gas generated by the reaction between components included in the coat layer of an image formation paper P and the treatment liquid can be suppressed.

01 Jan 2015
TL;DR: Two novel strategies to create fractional epidermal microblister arrays are compared to treat larger lesions with less donor-site trauma and can be scaled to create large-area grafts.
Abstract: Summary Background Epidermal suction blister grafts are an effective treatment for chronicwounds or vitiligo, but this treatment is time consuming and limited to small areas.Objectives To compare two novel strategies to create fractional epidermal grafts.Methods Epidermal blisters were raised from fresh human skin ex vivo at 38–40 °C,with suction of 380–510 mmHg. In Strategy 1, a 1-cm blister was micromeshedinto approximately 500 pieces, transferred to elastic adhesive dressing, thenpneumatically expanded to approximately nine times the original blister area. InStrategy 2, a 25-cm 2 array of 100 small blisters was raised, simultaneously har-vested and captured directly onto an adhesive dressing. Measurements were takenfor the pneumatic expansion limit, the release of microblisters upon hydration ofthe dressing adhesive, light microscopy, epidermal cell viability and positiveL-3,4 dihydroxyphenylalanine melanocyte presence in blisters.Results Both strategies yielded viable fractional epidermal microblister arrays, car-ried on a dressing for transfer to graft recipient sites. The microblisters weregradually released upon hydration of the dressing adhesive. Strategy 2 has majoradvantages as only small blisters are made at the donor site, skilful dissection andphysical expansion are not required and the strategy can be scaled to createlarge-area grafts.Conclusions Strategy 2 is the more practical method for fractional epidermal micro-grafting to treat larger lesions with less donor-site trauma and has recently beencommercialized.

Patent
03 Sep 2015
TL;DR: In this article, the authors present a system for repackaging different medications from the respective original blister packs thereof into filling blisters, in particular patient-specific weekly blisters comprising accommodating compartments arranged in a matrix configuration, having rows corresponding to a number of intake times during a day and columns corresponding to the number of days, for example days of the week.
Abstract: The invention relates to a system and to a method for repackaging different medications from the respective original blister packs thereof into filling blisters, in particular patient-specific weekly blisters comprising accommodating compartments arranged in a matrix configuration, having rows corresponding to a number of intake times during a day and columns corresponding to a number of days, for example days of the week. The system according to the invention comprises a conveying device for separating and feeding filled original blisters, a temporary store having random access for temporarily storing the original blisters packaged in blister carriers each associated with an original blister type, said blister carriers having standardized outer dimensions, and an ejecting device for ejecting a defined number of units of a selected medication from the original blister in question into the filling blister.

Patent
10 Feb 2015
TL;DR: In this article, a package for pharmaceutical blister packs (12) comprising means (11) for removing the protecting foil of the blister packs is presented. The package protects the blister pack (12), and at the same time provides an easy and convenient way of opening the package for people at all level of ability and dexterity.
Abstract: The present invention relates to a package (7) for pharmaceutical blister packs (12) comprising means (11) for removing the protecting foil of the blister packs. The package protects the blister packs (12) and at the same time provides an easy and convenient way of opening the blister pack for people at all level of ability and dexterity.