Topic
Blisters
About: Blisters is a research topic. Over the lifetime, 980 publications have been published within this topic receiving 16229 citations.
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TL;DR: In this article, a polycrystalline copper surface was physically sputtered by helium ion irradiation with changing the ion fluence and the incident angle, and the flatness of the surface was examined.
Abstract: Polycrystalline copper was physically sputtered by helium ion irradiation with changing the ion fluence and the incident angle. After that, flatness of the surface was examined. For normal incidence, small bubbles and pores were formed at the surface. The average size and areal density increased with the increase of helium ion fluence. By the increase of the incident angle, the copper surface gradually became flat. However, in the case of shallow bombardment with an angle of 67.5°, the surface had a different morphology compared to the other cases. One possible reason may be formations of blisters. In the present experiment, helium ion, which easily produces blisters, was employed. If the ion species such as argon ion and reactive ion is employed, the surface roughness may decrease with increase of incident angle.
1 citations
Patent•
27 Oct 2005
TL;DR: In this paper, the authors used a mixture of organosilicon and phenol-formaldehyde resins in the ratio of 1:2 accordingly, density of 0.940-0.980 g/cm3.
Abstract: FIELD: aircraft industry; rocket industry; mechanical engineering and other industries; production of antenna blisters made out of quartz ceramics. ^ SUBSTANCE: the invention is pertaining to the aircraft and rocket equipment, in particular, to production of the antenna blisters for rockets and may find application in mechanical engineering and other branches of industry at production of items possessive a high strength in combination with radiotransparency in the whole range of temperatures of operation. The technical result of the invention is formation of a protective and hardening layer on the inner surface of the antenna blister, which possesses a sealing function, humidity resistance and a hardening effect. The method of production of the defensive and hardening layer in a shell of the antenna blister made out of quartz ceramics includes impregnation of then inner surface of the ceramic shell with an acetonic solution of a mixture of organosilicon and phenol-formaldehyde resins in the ratio of 1:2 accordingly, density of 0.940-0.980 g/cm3. The produced layer is dried at an indoor temperature within 3-6 hours, then polymerized at the temperature of 220-240°C within 4-6 hours. The impregnation conduct by a method of the communicating vessels in the closed volume or by the method of pouring over with water in the closed volume. ^ EFFECT: the invention ensures formation of a protective and hardening layer on the inner surface of the antenna blister, which possesses a sealing function, humidity resistance and a hardening effect. ^ 3 cl, 6 ex
1 citations
TL;DR: In this paper, the effect of grain boundary direction with respect to the exposed surface on blistering in tungsten (W) was studied and it was found that large-size blisters were originated from parallel GBs rather than perpendicular GBs.
Abstract: The effect of grain boundary (GB) direction with respect to the exposed surface on blistering in tungsten (W) is studied. Four types of W materials were used in this work and classified according to GB directions: one with GBs parallel to the exposed surface (parallel GBs) and the other with GBs perpendicular to the exposed surface (perpendicular GBs). After exposure to high flux deuterium plasmas, blisters were observed and found to be related to GBs in all types of materials. It is found that large-size blisters were originated from parallel GBs rather than perpendicular GBs. Blisters were supposed to grow faster in parallel GBs than in perpendicular GBs. Moreover, the exfoliation of blister caps was observed in the materials with parallel GBs but not in that with perpendicular GBs. This study provides a new insight into the role of GB direction on blistering.
1 citations
TL;DR: It is demonstrated that subepidermal blisters heal primarily via the replenishment of keratinocytes from HF pools at the expense of HF growth and through the proper morphological transformation of the regenerated cells.
Abstract: Subepidermal blisters form through the detachment of the epidermis from the dermis. Despite such blisters being common in clinical practice, how they heal has not been fully elucidated. Here, we uncover the precise cellular contribution to subepidermal blister healing. The growth of hair follicles (HFs) was retarded during the healing processes of subepidermal blisters. The progeny of HF junctional zone stem cells (SCs), rather than those of epidermal SCs, were the main contributors to blister healing, and HF depletion from the wound bed through Col17a1 knockout verified the contribution of epidermal SC progeny. The wedge-shaped morphology of keratinocytes in the blistered skin helped cover the epidermal defects and was reduced by Col7a1 knockout or by extracellular calcium administration, resulting in delayed blister healing. These findings, corroborated by mathematical modeling and human blister samples, demonstrate that subepidermal blisters heal primarily via the replenishment of keratinocytes from HF pools at the expense of HF growth and through the proper morphological transformation of the regenerated cells. Our study paves the way for tailoring therapeutic interventions for subepidermal blistering diseases, including epidermolysis bullosa and pemphigoid diseases.
1 citations
TL;DR: In this paper, the effect of the dew point in the heating atmosphere and the effects of very small amounts of iron, silicon and beryllium added in super-purity aluminium on the blisters originating from the reaction of water vapour and aluminium were studied.
Abstract: The authors studied the effect of the dew point in the heating atmosphere and the effect of very small amounts of iron, silicon and beryllium added in super-purity aluminium on the blisters originating from the reaction of water vapour and aluminium. Further, the difference of electron diffraction patterns in two kinds of oxide film having the different effect on preventing the blisters and also the blistering rate at various heating temperature were studied.The results are as follows:(1) It is necessary to keep the dew point under about 5°C in air and about 10°C in nitrogen atmosphere in order to anneal 99.99% aluminium without blistering at 500°C.(2) Very small additions of iron and silicon to super-purity aluminium cause to increase the blisters. Although iron does not affect the blistering at the lower temperature such as 300°C, silicon causes slightly to increase the blistering.(3) Addition over 0.003% beryllium is proved to prevent the blistering completely.(4) The oxide film formed at higher temperature than 450-500°C in dry air distinctly affects to prevent the blistering. This oxide film showed the dotted diffraction ring whereas the oxide film formed at lower temperature (440°C) showing the perfect ring pattern has not the protective effect of blistering. In other words, the oxide film having a grown crystalline oxide by raising temperature, acts to prevent the blistering as compared with that having very small crystalline oxide formed at lower temperature.(5) There is a linear relation between the logarithm of blistering speed and the inverse of annealing absolute temperature.
1 citations