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Blisters

About: Blisters is a research topic. Over the lifetime, 980 publications have been published within this topic receiving 16229 citations.


Papers
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Journal ArticleDOI
TL;DR: A reproducible partial-thickness burn was inflicted on 100 albino guinea pigs, and microscopic examination showed that previously viable dermis was incorporated in this crust.
Abstract: A reproducible partial-thickness burn was inflicted on 100 albino guinea pigs. With the blister intact, the evaporative water loss from the burn surface was essentially the same as from normal unburned skin. When the blister was removed, the rate of water loss was initially more than 100 times normal, and it remained 20 to 50 times the normal rate throughout the first week. This high rate of water loss was associated with an increasing depth of wound destruction (from dehydration) and a thickening of the overlying crust. Microscopic examination showed that previously viable dermis was incorporated in this crust. The depth of dermal loss was negligible when the blister was left intact, and improved healing resulted. We believe it is important to leave burn blisters intact, whenever possible.

18 citations

Journal ArticleDOI
TL;DR: In this article, a 3D difference imaging of tungsten surfaces was used to demonstrate that roughness introduced by chemical etching, without the associated mechanical deformation layer introduced by grinding, only moderately reduces blistering.
Abstract: Up to now, blister formation on rough or technical tungsten surfaces exposed to hydrogen isotope plasma was believed to be completely suppressed. The few dedicated experiments on this issue that can be found in literature appear to support that claim. Using a novel technique of 3D difference imaging of tungsten surfaces, we now demonstrate that roughness introduced by chemical etching, i.e. without the associated mechanical deformation layer introduced by grinding, only moderately reduces blistering. A technical surface with comparable roughness produced by precision grinding (R a ≤ 1.6 µm) led to a strong reduction in blister size and density, but blisters were found nevertheless. In this article we give a detailed description of the investigated rough W surfaces and present a statistical evaluation of blistering on these surfaces after exposure to a low-temperature deuterium plasma.

18 citations

Patent
27 Dec 2000
TL;DR: In this article, a method for forming a blister band (1) for blister packs (10) in blistering machines (M), a band of heat-formable material is moved stepwise through a preheating station (5), a forming station (6), where a regular series of blisters (20) is formed, a filling station (8), where which said blisters(20) are filled with relative articles, a sealing station (9), in which the blister band is sealed with a covering band (11), and a cutting off station (13), where the
Abstract: According to a method for forming a blister band (1) for blister packs (10) in blistering machines (M), a band (1) of heat-formable material is moved stepwise through a preheating station (5), a forming station (6), where a regular series of blisters (20) is formed, a filling station (8), where which said blisters (20) are filled with relative articles, a sealing station (9), in which the blister band is sealed with a covering band (11), and a cutting off station (13), where the blister band is cut into single blister packs (10). The method includes gradual heating, during the stepwise movement of the band (1) in the preheating station (5), of respective areas (24a, 24b, 24c) of the band (1). The areas (24a, 24b, 24c) are distributed regularly within a cold grid-like zone and have extension suitably bigger than the extension of the blisters (20) made in the region of the heated areas (24a, 24b, 24c).

18 citations

Journal ArticleDOI
TL;DR: In this article, the structural analysis of surface blisters on SiC crystals heavily irradiated by He+ and H+ ions using grazing incidence electron microscopy and electron energy-loss spectroscopy is presented.

18 citations

Journal ArticleDOI
TL;DR: In this paper, the critical stress and corresponding pressure for rupture decrease with increasing blister radius and increase with increasing crack length, whereas the rupture pressure increases with the ratio of oxide film thickness to blister radius.
Abstract: Expressions have been derived which describe the critical stress and pressure necessary to rupture oxide blisters which form on aluminum during the growth of corrosion pits. These expressions have been derived and evaluated for radial cracks in the oxide blister. The critical stress and corresponding pressure for rupture decrease with increasing blister radius and decrease with increasing crack length. The critical stress is independent of the ratio of oxide film thickness to blister radius, whereas the rupture pressure increases with this ratio. The critical stress is independent of Poisson's ratio for the oxide film whereas the rupture pressure is weakly dependent on Poisson's ratio for the oxide film.

18 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202353
2022133
202118
202036
201922
201846