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Blisters

About: Blisters is a research topic. Over the lifetime, 980 publications have been published within this topic receiving 16229 citations.


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Journal Article
TL;DR: The present study reports three cases of pathomimia, in which the lesions consisted of vesicles or bullae producted by friction, which makes it possible to distinguish them from the blisters of different forms ofvesicular and bullous diseases and from burn blisters which may also occur in pathomicia.
Abstract: Self-inflicted skin lesions (pathomimia, artefacts) can be produced in a variety of ways, by the help of nails, razor blades, cigarettes, chemicals, etc. The present study reports three cases of pathomimia, in which the lesions consisted of vesicles or bullae producted by friction. Friction blisters can easily be produced in sites where the epidermis is both thick and firmly attached to the underlying tissues. The blisters have a characteristic histological appearance, which makes it possible to distinguish them from the blisters of different forms of vesicular and bullous diseases and from burn blisters which may also occur in pathomimia. Language: en

10 citations

Patent
30 Sep 2005
TL;DR: In this paper, a device for safeguarding a blister strip (B) and enabling a tablet or the like to be dispensed from a respective housing on the blister strip, which is retained and protected within the device, this latter being formed from a single sheet of cardboard folded about the blister strips, the blisters of which extend through holes (4) provided in a part of the sheet, in other part of which there being provided breakable knurlings defining removable discs (6) which are aligned with said holes to enable said discs to break with consequent detachment of
Abstract: Device for safeguarding a blister strip (B) and enabling a tablet or the like to be dispensed from a respective housing on the blister strip, which is retained and protected within the device, this latter being formed from a single sheet of cardboard folded about the blister strip, the blisters of which extend through holes (4) provided in a part of the sheet, in the other part of which there being provided breakable knurlings defining removable discs (6) which are aligned with said holes to enable said discs to break with consequent detachment of said discs and expulsion of said tablets when the individual blisters of the blister strip are pressed with the finger of one hand.

10 citations

Journal ArticleDOI
TL;DR: In this paper, the authors demonstrate the root cause and a prevention method of the blister formation in electroless copper plating and demonstrate that Ni added plating solutions reduced the hydrogen gas evolution significantly and thus produced no blisters in the Cu deposits.
Abstract: Electroless copper (Cu) plating is a key process to provide seed layers for the subsequent Cu electroplating in the printed wiring boards (PWBs). Due to the demand for lower power dissipation at higher temperatures and high signal frequencies, various kinds of organic materials have been newly introduced as substrates. However, they have come with defects such as delamination and/or blisters in the Cu layers on organic substrates, i.e., weak adhesion. Here we demonstrate the root cause and a prevention method of the blister formation. Various parameters affecting the blister formation have been investigated combined with the deposit thickness (internal stress), hydrogen gas evolution, and codeposited Ni content in the electroless Cu plating. It was not obvious that the compressive internal stress in deposits was directly related to the blister formation. Instead, the hydrogen gas evolution clearly turned out to be the key factor, and it was observed that Ni added plating solutions reduced the hydrogen gas evolution significantly and thus produced no blisters in the Cu deposits. The control of blisters would be more critical as the line and space become narrower in the production lines such as ball grid array (BGA) and high density interconnection (HDI).

10 citations

Journal ArticleDOI
TL;DR: The presence of postoperative blisters in patients with ankle fractures was associated with prolonged surgical procedures and high serum glucose levels.
Abstract: The most frequent postoperative complications after an ankle fracture are usually skin related. We present the results of a retrospective study of 112 patients with ankle fracture who had undergone open reduction and internal fixation from January 2014 to December 2014. The following features were analyzed: patient comorbidities, fracture type, the presence of an open fracture or fracture-dislocation, timing and duration of surgery, preoperative glucose level, and short-term complications (i.e., blisters, wound dehiscence, deep and superficial infections, and reintervention). The mean age of the patients was 50.38 years. Fracture blisters were present in 20.5% of the cases. The operative time was 75.74 ± 25.09 minutes for patients with blisters and 64.48 ± 19.73 minutes for patients without blisters (p = .023). The preoperative blood glucose levels were 122.96 ± 28.46 g/dL in the patients with blisters and 106.70 ± 21.32 g/dL in the patients without blisters (p = .003). No statistically significant differences were observed between the patients who had undergone surgery 24 hours after injury. In conclusion, the presence of postoperative blisters in patients with ankle fractures was associated with prolonged surgical procedures and high serum glucose levels.

10 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202353
2022133
202118
202036
201922
201846