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Capacitive micromachined ultrasonic transducers

About: Capacitive micromachined ultrasonic transducers is a research topic. Over the lifetime, 2623 publications have been published within this topic receiving 40893 citations.


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Journal ArticleDOI
TL;DR: A theoretical model is proposed that agrees well with observed transducer behavior and is used to demonstrate that microfabricated ultrasonic transducers constitute an attractive alternative to piezoelectric transducers in many applications.
Abstract: The current state of novel technology, surface microfabricated ultrasonic transducers, is reported. Experiments demonstrating both air and water transmission are presented. Air-coupled longitudinal wave transmission through aluminum is demonstrated, implying a 110 dB dynamic range for transducers at 2.3 MHz in air. Water transmission experiments from 1 to 20 MHz are performed, with a measured 60 dB SNR at 3 MHz. A theoretical model is proposed that agrees well with observed transducer behavior. Most significantly, the model is used to demonstrate that microfabricated ultrasonic transducers constitute an attractive alternative to piezoelectric transducers in many applications.

616 citations

Journal ArticleDOI
TL;DR: The first pulse-echo phased array B-scan sector images using a 128-element, one-dimensional (1-D) linear CMUT array is presented and preliminary investigations on the effects of crosstalk among array elements on the image quality are performed.
Abstract: Piezoelectric materials have dominated the ultrasonic transducer technology. Recently, capacitive micromachined ultrasonic transducers (CMUTs) have emerged as an alternative technology offering advantages such as wide bandwidth, ease of fabricating large arrays, and potential for integration with electronics. The aim of this paper is to demonstrate the viability of CMUTs for ultrasound imaging. We present the first pulse-echo phased array B-scan sector images using a 128-element, one-dimensional (1-D) linear CMUT array. We fabricated 64- and 128-element 1-D CMUT arrays with 100% yield and uniform element response across the arrays. These arrays have been operated in immersion with no failure or degradation in performance over the time. For imaging experiments, we built a resolution test phantom roughly mimicking the attenuation properties of soft tissue. We used a PC-based experimental system, including custom-designed electronic circuits to acquire the complete set of 128/spl times/128 RF A-scans from all transmit-receive element combinations. We obtained the pulse-echo frequency response by analyzing the echo signals from wire targets. These echo signals presented an 80% fractional bandwidth around 3 MHz, including the effect of attenuation in the propagating medium. We reconstructed the B-scan images with a sector angle of 90 degrees and an image depth of 210 mm through offline processing by using RF beamforming and synthetic phased array approaches. The measured 6-dB lateral and axial resolutions at 135 mm depth were 0.0144 radians and 0.3 mm, respectively. The electronic noise floor of the image was more than 50 dB below the maximum mainlobe magnitude. We also performed preliminary investigations on the effects of crosstalk among array elements on the image quality. In the near field, some artifacts were observable extending out from the array to a depth of 2 cm. A tail also was observed in the point spread function (PSF) in the axial direction, indicating the existence of crosstalk. The relative amplitude of this tail with respect to the mainlobe was less than -20 dB.

508 citations

Journal ArticleDOI
TL;DR: In this article, an electrical equivalent circuit model for electrostatic transducers based on the early work of Mason (1942) was designed and constructed for operation at 1.8 and 4.6 MHz.
Abstract: Airborne ultrasound has many applications such as, ranging, nondestructive evaluation, gas flow measurement, and acoustic microscopy. This paper investigates the generation and detection of ultrasound in air at a few MHz. Conventional plane piston lead zirconium titanate (PZT) based transducers perform poorly for this application due to the lack of proper matching layer materials. Electrostatic, or capacitive, transducers promise higher efficiency and broader bandwidth performance. The device structure in this work consists of a capacitor where one plate is a circular silicon nitride membrane coated with gold and the other is a rigid silicon substrate. By applying a voltage between the membrane and the silicon substrate, an electrostatic force is exerted on the membrane which sets it in motion, thus generating a sound wave in air. Presented here is an electrical equivalent circuit model for electrostatic transducers which is based on the early work of Mason (1942). The electrostatic transducers were designed and constructed for operation at 1.8 and 4.6 MHz. The transducers were fabricated using standard micromachining techniques. An optical interferometer was used to measure the peak displacement of the 1.8 MHz electrostatic transducer at 230 /spl Aring//V. A transmit-receive system was built using two electrostatic transducers. The system had a signal to noise ratio of 34 dB at a transducer separation of 1 cm. Each transducer had a 3-dB bandwidth of 20%, and a one-way insertion loss of 26 dB. There is excellent agreement between the measured device performance and theoretical predictions.

453 citations

Journal ArticleDOI
TL;DR: Both transducer focusing techniques proved successful in producing highly sensitive, high-frequency, single-element, ultrasonic-imaging transducers that could possibly allow for an increase in depth of penetration, higher image signal-to-noise ratio (SNR), and improved image contrast at high frequencies when compared to previously reported results.
Abstract: This paper discusses the design, fabrication, and testing of sensitive broadband lithium niobate (LiNbO/sub 3/) single-element ultrasonic transducers in the 20-80 MHz frequency range. Transducers of varying dimensions were built for an f# range of 2.0-3.1. The desired focal depths were achieved by either casting an acoustic lens on the transducer face or press-focusing the piezoelectric into a spherical curvature. For designs that required electrical impedance matching, a low impedance transmission line coaxial cable was used. All transducers were tested in a pulse-echo arrangement, whereby the center frequency, bandwidth, insertion loss, and focal depth were measured. Several transducers were fabricated with center frequencies in the 20-80 MHz range with the measured -6 dB bandwidths and two-way insertion loss values ranging from 57 to 74% and 9.6 to 21.3 dB, respectively. Both transducer focusing techniques proved successful in producing highly sensitive, high-frequency, single-element, ultrasonic-imaging transducers. In vivo and in vitro ultrasonic backscatter microscope (UBM) images of human eyes were obtained with the 50 MHz transducers. The high sensitivity of these devices could possibly allow for an increase in depth of penetration, higher image signal-to-noise ratio (SNR), and improved image contrast at high frequencies when compared to previously reported results.

321 citations

Journal ArticleDOI
TL;DR: In this paper, a new method for fabricating capacitive micromachined ultrasonic transducers (CMUTs) that uses a wafer bonding technique is introduced. But the method is not suitable for large CMUTs.
Abstract: Introduces a new method for fabricating capacitive micromachined ultrasonic transducers (CMUTs) that uses a wafer bonding technique. The transducer membrane and cavity are defined on an SOI (silicon-on-insulator) wafer and on a prime wafer, respectively. Then, using silicon direct bonding in a vacuum environment, the two wafers are bonded together to form a transducer. This new technique, capable of fabricating large CMUTs, offers advantages over the traditionally micromachined CMUTs. First, forming a vacuum-sealed cavity is relatively easy since the wafer bonding is performed in a vacuum chamber. Second, this process enables better control over the gap height, making it possible to fabricate very small gaps (less than 0.1 /spl mu/m). Third, since the membrane is made of single crystal silicon, it is possible to predict and control the mechanical properties of the membrane to within 5%. Finally, the number of process steps involved in making a CMUT has been reduced from 22 to 15, shortening the device turn-around time. All of these advantages provide repeatable fabrication of CMUTs featuring predictable center frequency, bandwidth, and collapse voltage.

312 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202330
202287
202165
202067
201986
201867