Chamber pressure

About: Chamber pressure is a research topic. Over the lifetime, 2988 publications have been published within this topic receiving 30725 citations.

Generalized response of chemiluminescence analyzers

Abstract: The mass flow and chemical kinetic equations for a gaseous chemiluminescence (CL) analyzer are formulated and solved. The resultant equation can be used to predict the absolute response of the analyzer as a function of the sample flow rate, the sample gas pressure, the chamber pressure, the chamber volume, the mass flow rate and mole fraction of the reagent gas, and the rate constants of the relevant chemical processes. Thus, the equation allows optimization of these parameters. It is shown that for varying sample pressure the analyzer can be used to measure either concentration or mole fraction and that interfering reactions can sometimes be discriminated against by chamber pressure variation. The equations apply equally well to a flowing‐liquid‐phase CL analyzer, if the chemical mechanism considered is appropriate.

Measurements of temperature and electron number density in a dc argon-nitrogen plasma torch: Supersonic operation

Abstract: The diagnostics study on supersonic argon/nitrogen plasma jets expanded into a low-pressure test chamber is carried out by means of emission spectroscopy and enthalpy probe measurement techniques. The spatial distributions of electron density, temperatures, and associated shock structure effects in plasma jets are investigated in conjunction with their direct dependency upon the chamber pressure. The experimental results show the occurrence and the position of different zones; i.e., supersonic expansion, stationary shock waves and subsonic jet at pressures below 51 kPa. Flow fluctuations due to the oblique shock wave at 39 kPa background pressure are observed and discussed. The electron density profiles show variations along the plasma axis that coincide with the position of the shock waves. The experimental results show the transition from the moderately under-expanded to the strongly under-expanded jet structure induced by lowering of the chamber pressure.

Cooling of High-Pressure Rocket Thrust Chambers with Liquid Oxygen

Abstract: An experimental program using hydrogen and oxygen as the propellants and supercritical liquid oxygen (LOX) as the coolant was conducted at 4.14 and 8.274 MN/square meters (600 and 1200 psia) chamber pressure. Data on the following are presented: the effect of LOX leaking into the combustion region through small cracks in the chamber wall; and verification of the supercritical oxygen heat transfer correlation developed from heated tube experiments; A total of four thrust chambers with throat diameters of 0.066 m were tested. Of these, three were cyclically tested to 4.14 MN/square meters (600 psia) chamber pressure until a crack developed. One had 23 additional hot cycles accumulated with no apparent metal burning or distress. The fourth chamber was operated at 8.274 MN/square meters (1200 psia) pressure to obtain steady state heat transfer data. Wall temperature measurements confirmed the heat transfer correlation.

In-service test valve

Abstract: Disclosed is an in-service test valve and system. The in-service test valve includes a body having a first chamber with a relatively small diameter bore and second chamber axially spaced apart from the first chamber and having a relatively large diameter bore. An imperforate shuttle is slidingly mounted in the valve body and includes a first piston slidingly sealingly mounted in the first chamber bore and a second piston slidingly sealingly mounted in the second chamber bore. An in-service inlet is provided in the valve body for introducing in-service pressure into the first chamber to apply sensing pressure to the first piston and urge the shuttle toward the second chamber. A test inlet is provided for introducing test pressure into the second chamber to apply test pressure to the second piston to urge the shuttle in the direction of the first chamber. A check valve is provided in the valve body for allowing communication of test pressure to the first chamber when test pressure is greater than first chamber pressure. A valve operated by the shuttle is provided for isolating the in-service inlet from the first chamber when test pressure is applied. An outlet is provided in the valve body for communicating pressure within the first chamber exterior of the valve.

Investigation of CF3I as an Environmentally Benign Dielectric Etchant

Abstract: In this study, trifluoroiodomethane (CF3I), a non-global-warming gas, has been investigated as a substitute for typical PFC’s currently used in wafer patterning and CVD chamber cleaning processes. Dielectric films consisting of plasma enhanced chemically vapor deposited silicon dioxide and silicon nitride were comparatively etched in CF3I and C2F6/O2 plasma environments. The etch rate of these films was ascertained as a function of applied rf power, etchant gas flow rate, reaction chamber pressure, and CF3I: O2 ratio. Destruction efficiencies of CF3I at different processing parameters were evaluated. Depending on the flow rate, rf power, and chamber pressure, utilization efficiency of CF3I varied from as low as 10% to as high as 68%. CF4, C2F6, COF2, and CO2 were the predominant by-products found in the exhaust stream; however, their concentrations were very low compared to the traditional process employing C2F6/O2 mixtures.