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Chamber pressure

About: Chamber pressure is a research topic. Over the lifetime, 2988 publications have been published within this topic receiving 30725 citations.


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Journal ArticleDOI
TL;DR: The T-burner is a simple buiner used for the study of oscillatoiy combustion and the results obtained therefrom as mentioned in this paper, which are used to characterize the over-all one-dimensional acoustic behavior in the system to characterize the transient combustion of the piopellant.
Abstract: This paper desciibes a simple buiner used foi the study of oscillatoiy combustion and the icsults obtained therefrom The burner, commonly called the T-burner, consists of sidevented cylindrical steel chamber in the ends of which piopellant disks are burned If the propellant combustion spontaneously geneiates piessure oscillations, use is made of the over-all one-dimensional acoustic behavior in the system to characteiize the transient combustion of the piopellant The important vaiiables used in the chaiacterization are the growth late of the oscillations and their decay rate following the consumption of the piopellant A desciiption is given of the several types of investigations in which the T-buinei is the primaiy research tool These investigations concern the response function of the combustion zone, the effect of normal pressure peituibations upon the average burning rate of the propellant, the participation of the piopellant in the acoustic motion of the system, the mechanism by which aluminum supiesses oscillatoiy combustion, and the influence of piopellant composition upon the icsponse function of the combustion zone The latter two desciiptions are given in some detail Nomenclature c = speed of sound in the combustion gas f = frequency of the oscillations I = length of the gas column in the T-burner HD = number of particles per unit volume of combustion gas with diameter D pm = amplitude of the pressure oscillations pQ = amplitude of the pressure oscillations at an arbitrary zero time p = mean chamber pressure r = burning rate of the propellant R = radius of the particle in the combustion gas t = time Y = speed with which the gas leaves the combustion zone Y = real part of the specific acoustic admittance of the combustion zone Z = (2-jrfRz/2v)112 ag = exponential constant that describes the growth of the oscillations ad — exponential constant that describes the decay of the oscillations exa = reduction in ag which is caused by the presence of aluminum or alumina in the propellant 7 = ratio of the heat capacities of the combustion gas n = amplitude of the fractional mass flow rate perturbation of the mass leaving the combustion zone e = amplitude of the fractional pressure perturbation which causes /z a = amplitude of the fractional density pertuibation accompanying e p = density of the combustion gas p = density of the propellant pp = density of the particles in the combustion gas v = kinematic viscosity of the combustion gas 5 = P/PP

27 citations

Journal ArticleDOI
TL;DR: In this paper, a neutral background pressure map of the large vacuum test facility (LVTF) is presented, which is performed with a rake consisting of five calibrated Bayard-Alpert hot-cathode ionization gauges.
Abstract: A neutral background pressure map of the large vacuum test facility (LVTF) is presented. The LVTF is mapped at cold anode flow rates of 5.25, 10.46, and 14.09mg∕s. In addition, neutral background pressure maps are created at hot anode (i.e., discharge on) flow rates of 5.25 and 10.46mg∕s for discharge voltages of 300 and 500V, corresponding to P5 Hall thruster operating conditions ranging from 1.5to5.0kW. The chamber pressure is mapped at nominal xenon pumping speeds of 140 000 and 240000l∕s. The pressure map is performed with a rake consisting of five calibrated Bayard–Alpert hot-cathode ionization gauges. The plume expansion appears to be independent of anode flow rate and facility background pressure. Analysis of axial pressure profiles on the LVTF’s centerline shows that the plume pressure decreases from a maximum at the thruster exit plane down to the facility background pressure at approximately 2m downstream of the exit plane. Comparison of axial pressure profiles on the LVTF’s centerline shows tha...

27 citations

Journal ArticleDOI
TL;DR: In this paper, the authors evaluate two rocket exhaust configurations within an Rocket-Based Combined Cycle engine model and show that the annular configuration yields an average Mach number 57% higher than the traditional circular configuration under conditions close to those for maximum air entrainment.
Abstract: Experimental tests are conducted to evaluate two rocket exhaust configurations within an Rocket-Based Combined Cycle engine model. Each configuration uses a single rocket chamber but expands the rocket exhaust to a different geometry. One configuration uses two traditional circular rocket nozzles whereas the other uses two annular exhaust geometries based on the Exchange Inlet design. Wall pressure data are collected along the length of each configuration to evaluate the air entrainment. The annular configuration is shown to increase the entrainment ratio by as much as 28% over the traditional circular rocket design. The annular configuration is also shown to choke the incoming airflow at a lower rocket chamber pressure more uniformly across the engine cross section. Total pressure measurements are also obtained at the engine exit plane, which show that the annular configuration yields an average Mach number 57% higher than the circular configuration under conditions close to those for maximum air entrain...

27 citations

Patent
28 Jul 1997
TL;DR: In this article, a method of etching a trench in a semiconductor substrate in a reactor chamber using alternatively reactive ion etching and depositing a passivation layer by chemical vapour deposition is described.
Abstract: of EP0822582This invention relates to methods for treatment of semiconductor substrates and in particular a method of etching a trench in a semiconductor substrate in a reactor chamber using alternatively reactive ion etching and depositing a passivation layer by chemical vapour deposition, wherein one or more of the following parameters: gas flow rates, chamber pressure, plasma power, substrate bias, etch rate, deposition rate, cycle time and etching/deposition ratio vary with time.

27 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202322
202257
202167
202086
201991
201882