Channel length modulation

About: Channel length modulation is a research topic. Over the lifetime, 1790 publications have been published within this topic receiving 34179 citations.

Modeling of 14 nm gate length n-Type MOSFET

Abstract: Metal-Oxide-Semiconductor Field Effect Transistors MOSFETs (MOSFETs) transistor have been scaled tremendously through Moore's Law since 1974 in order to compact transistors in a single chip. Thus, a proper scaling technique is compulsory to minimize the short channel effect (SCE) problems. In this paper, the virtual fabricated design and device's characterization of 14 nm HfO2/WSi2 n-type MOSFET device is presented. The device is scaled based on previous research on 32 nm transistors. The virtual fabrication and simulation of n-type MOSFETs are implemented using Virtual Wafer Fabrication (VWF) Silvaco TCAD Tools named ATHENA and ATLAS. From the simulation, result shows that the optimal value of threshold voltage (VTH), drive current (ION) and leakage current (IOFF) are 0.232291 V, 78.922×10−6 A/um and 77.11×10−9 A/um respectively. These simulation results are believed to be able to create a touchstone towards the optimization and fabrication of 14 nm device's gate length utilizing High-K/Metal Gate n-type MOSFET in impending work.

A compact LDD MOSFET I-V model based on nonpinned surface potential

Abstract: Based on nonpinned surface potential concept, in this paper we present a compact single-piece and complete I-V model for submicron lightly-doped drain (LDD) MOSFETs. The physics-based and analytical model was developed using the drift-diffusion equation and based on the quasi two-dimensional (2-D) Poisson equation. The important short-channel device features: drain-induced-barrier-lowering (DIBL), channel-length modulation (CLM), velocity saturation, and the parasitic series source and drain resistances have been included in the model in a physically consistent manner. In this model, the LDD region is treated as a bias-dependent series resistance, and the drain-voltage drop across the LDD region has been considered in modeling the DIBL effect. This model is smoothly-continuous, valid in all regions of operation and suitable for efficient circuit simulation. The accuracy of the model has been checked by comparing the calculated drain current, conductance and transconductance with the experimental data.

Junction field effect transistor having unsaturated drain current characteristic with lightly doped drain region

Abstract: A field effect transistor has the property that the product of its series resistance and its true transconductance is less than one throughout the entire range of drain voltage in the operative state of the transistor, the series resistance being the sum of the resistance from source to channel and the resistance of this channel. In order to prevent an excessive increase in the active resistance of the channel, the channel is made to have an impurity concentration as low as less than 1015 atoms/cm3, preferably less than 1014 atoms/cm3, so that the depletion layers extending from the gates grow extensively to become contiguous in response to a small increase in the reverse gate voltage applied. As a result, the field effect transistor of this invention has an unsaturated drain current versus drain voltage characteristic.

Current-voltage model of short-channel MOSFETs operated in the linear region

Abstract: A new analytic MOSFET current model in the linear region is developed by using the pseudo-two-dimensional approximation. The model physically accounts for the threshold voltage reduction with decreasing channel length. In the model a set of device parameters can be used for devices with different channel lengths. The model has been applied to study the current of lightly doped drain (LDD) MOSFETs with drawn channel length of 0.6 to 20 μm, and a good fitting has been achieved between the experimental data and the model.