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Showing papers on "Chip published in 1968"


Patent
30 Sep 1968

47 citations


Patent
18 Mar 1968

44 citations


Patent
14 Oct 1968
TL;DR: In this paper, a method for face-down bonding of a flipp-chip to a car is described, which includes the steps of orIENTing the flipper by direct reference to its ELECTRICAL TERMINALs at a given position apart from the original position.
Abstract: A METHOD FOR FACE DOWN BONDING A FLIP-CHIP TO A CARRIER SUBSTRATE INCLUDING THE STEPS OF ORIENTING THE CHIP BY DIRECT REFERENCE TO ITS ELECTRICAL TERMINALS AT AS GIVEN POSITION APART FROM THE SUBSTRATE, ORIENTING THE SUBSTRATE WITH REFERENCE TO THE CHIP AT A PRESCRIBED POSITION SEPARATE FROM THE CHIP POSITION, TRANSFERRING THE CHIP FROM THE GIVEN POSITION TO THE SUBSTRATE POSITION, THE TRANSFER BEING AC- COMPLISHED IN A MANNER TO RETAIN THE RELATIVE ORIENTATION OF THE CHIP AND SUBSTRATE SO THAT THE CORRESPONDING ELECTRICAL TERMINALS THEREOF ARE PLACED IN CONTACTING RELATIONSHIP, AND APPLYING HOT GAS SOLDER TO THE REGION BETWEEN THE CHIP AND SUBSTRATE TO BOND THE CONTACTING TERMINALS.

14 citations


Patent
29 Aug 1968

8 citations


Patent
03 Jul 1968

7 citations


Patent
12 Jan 1968

7 citations


Proceedings ArticleDOI
C. Thornton1
01 Jan 1968

6 citations


Patent
27 Jun 1968

5 citations


Journal ArticleDOI
TL;DR: Large-scale integration of semiconduailable in small-scale arrays can make possible an `oscilloscope on a chip' that offers more immediate possibilities for construction and application than do some of the more sophisticated functions proposed.
Abstract: Large-scale integration of semiconduailable in small-scale arrays can make possible an `oscilloscope on a chip'. Development of such a device offers more immediate possibilities for construction and application than do some of the more sophisticated functions that have been proposed.

2 citations



Patent
03 May 1968



Proceedings ArticleDOI
01 Jan 1968


Journal ArticleDOI
TL;DR: An integrated circuit breadboard chip is described in this article, which consists of fifty-seven separate devices on a 0.075 in. × 0.0130 in. silicon chip, including npn, lateral and substrate pnp, and compatible MOS transistors as well as various types of diodes, resistors and a capacitor.