Chip

About: Chip is a research topic. Over the lifetime, 44555 publications have been published within this topic receiving 352381 citations.

Embedded array access time test

Abstract: An apparatus and method for testing an access time of a macro embedded in a LSI chip. The apparatus includes a logical gate connected to the output latches of the macro, thereby controlling the access time of the macro, and a test latch for determining an on-chip delay time between a test signal for enabling the output latches and an input signal for enabling the macro. The method includes the steps of determining the on-chip delay time between the test signal and the input signal, thereby allowing the test signal to be synchronized with the input signal, supplying the synchronized test signal to the output latches for a manufacturer specified macro access time, and testing the latched output data from the macro.

Film-like commodity and manufacturing method therefor

Abstract: PROBLEM TO BE SOLVED: To provide a new integrated circuit, having a configuration which would not impair the desinability of business cards. SOLUTION: A thin-film integrated circuit is mounted on the film-like commodity. An IDF chip has a semiconductor film with a thickness that is 0.2 μm or smaller as an active region, thus reducing the film thickness as compared with a chip formed by a silicon wafer. In addition, the thin-film integrated circuit can have light transmission properties, which differs from a chip formed from a silicon wafer. COPYRIGHT: (C)2005,JPO&NCIPI

The importance of material selection for flip chip on board assemblies : Advancing MCM technologies

Abstract: Flip Chip On Board (FCOB) technology, where the unpackaged silicon chip is assembled directly to an organic substrate, provides an unique interconnect structure that significantly reduces the substrate area required by traditional through hole or surface mount integrated circuit packages. Without the protection for the chip that a package body affords however, reduced mechanical robustness and a decrease in reliability performance are potential concerns. In addition, the inherent thermal mismatch between the chip and substrate, particularly with an organic printed circuit board, will produce an accumulation of stress in the solder joints under normal operating conditions that can result in relatively premature failures due to solder fatigue. Coupling the chip and substrate together with an encapsulation material under the chip face has successfully overcome these mechanical and reliability issues

Highly miniaturized, battery operated, digital wireless camera using programmable single chip active pixel sensor (APS) digital camera chip

Abstract: A miniaturized camera which is programmable and provides low power consumption. An active pixel image sensor used in the highly miniaturized camera provides improved imaging functionality as well as reduced power consumption, extending the possible life time of the camera system. The spread spectrum nature of transmission and reception improves data integrity as well as data security. The ability of the highly miniaturized wireless camera to receive commands as well as transmit image data provides improved functionality and a variable rate of power consumption to be set according to the application and needs of the situation.