Clock gating

Abstract: With the increasing clock rate and transistor count of today's microprocessors, power dissipation is becoming a critical component of system design complexity. Thermal and power-delivery issues are becoming especially critical for high-performance computing systems. In this work, we investigate dynamic thermal management as a technique to control CPU power dissipation. With the increasing usage of clock gating techniques, the average power dissipation typically seen by common applications is becoming much less than the chip's rated maximum power dissipation. However system designers still must design thermal heat sinks to withstand the worse-case scenario. We define and investigate the major components of any dynamic thermal management scheme. Specifically we explore the tradeoffs between several mechanisms for responding to periods of thermal trauma and we consider the effects of hardware and software implementations. With approximate dynamic thermal management, the CPU can be designed for a much lower maximum power rating, with minimal performance impact for typical applications.

Abstract: It is shown that clock frequencies in excess of 200 MHz are feasible in a 3- mu m CMOS process. This performance can be obtained by means of clocking strategy, device sizing, and logic style selection. A precharge technique with a true single-phase clock, which increases the clock frequency and reduces the skew problems, is used. Device sizing with the help of an optimizing program improves circuit speed by a factor of 1.5-1.8. The logic depth is minimized to one instead of two or more, and pipeline structures are used wherever possible. Experimental results for several circuits which work at clock frequencies of 200-230 MHz are presented. SPICE simulation shows that some circuits could work up to 400-500 MHz. >

Abstract: A 275mm2 network-on-chip architecture contains 80 tiles arranged as a 10 times 8 2D array of floating-point cores and packet-switched routers, operating at 4GHz. The 15-F04 design employs mesochronous clocking, fine-grained clock gating, dynamic sleep transistors, and body-bias techniques. The 65nm 100M transistor die is designed to achieve a peak performance of 1.0TFLOPS at 1V while dissipating 98W.

Abstract: This paper describes an integrated network-on-chip architecture containing 80 tiles arranged as an 8x10 2-D array of floating-point cores and packet-switched routers, both designed to operate at 4 GHz. Each tile has two pipelined single-precision floating-point multiply accumulators (FPMAC) which feature a single-cycle accumulation loop for high throughput. The on-chip 2-D mesh network provides a bisection bandwidth of 2 Terabits/s. The 15-FO4 design employs mesochronous clocking, fine-grained clock gating, dynamic sleep transistors, and body-bias techniques. In a 65-nm eight-metal CMOS process, the 275 mm2 custom design contains 100 M transistors. The fully functional first silicon achieves over 1.0 TFLOPS of performance on a range of benchmarks while dissipating 97 W at 4.27 GHz and 1.07 V supply.

Abstract: Featuring an extensive 40 page tutorial introduction, this carefully compiled anthology of 65 of the most important papers on phaselocked loops and clock recovery circuits brings you comprehensive coverage of the field-all in one self-contained volume. You'll gain an understanding of the analysis, design, simulation, and implementation of phase-locked loops and clock recovery circuits in CMOS and bipolar technologies along with valuable insights into the issues and trade-offs associated with phase locked systems for high speed, low power, and low noise.