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Showing papers on "Conductive polymer published in 1970"


Patent
John V Meyer1
27 Jan 1970
TL;DR: In this paper, a conductive polymer having a steeply-sloped positive temperature coefficient (PTC) of resistance is composed of crystalline polymers having a narrow molecular weight distribution and filled with conductive particles such as carbon black, tin powder, gold powder, silver powder and other conductives.
Abstract: Conductive polymer having a steeply-sloped positive temperature coefficient (PTC) of resistance is composed of crystalline polymer having a narrow molecular weight distribution and filled with conductive particles such as carbon black, tin powder, gold powder, silver powder and other conductive particles which do not oxidize at the temperatures to which the composition is subjected during processing. Additional additives are incorporated to impart desired characteristics. Stabilizing agents which prevent deterioration of the resistance characteristics of the material include alkylated polyhydroxy phenol and phenylbetanapthylamine. (Dialkylphenol-sulfide may be added to reduce degradation at a metal polymer interface thus reducing contact resistance). Flame retardants which do not deleteriously effect the resistance characteristics include phenylbetanapthylamine high chlorinated perchloropentacyclodecane and antimony oxide. The several ingredients are for a preliminary mixed together, then subjected to a more thorough mixing step to effect an adequate dispersion of the filler material throughout the polymer, and then subjected to shearing forces for a limited period of time while maintaining the mix within a desired temperature range. The mix is then formed in the desired configuration as by inserting into a preheated mold while still at an elevated temperature. The formed element is removed from the mold and machined preferably to a rough finish to facilitate bonding of electrically conductive coatings to spaced locations thereof. The element is then coated with electrically conductive coating and annealed to minimize contact resistance.

51 citations


01 Jan 1970
TL;DR: A review of recent developments in fretting studies in electrical contact is presented in this paper, focusing on developments in conducting polymer surfaces, where highly conductive interconnects are formed using metallized particles embedded within a high temperature polymer compound.
Abstract: A review of recent developments in fretting studies in electrical contacts is presented, focusing on developments in conducting polymer surfaces. Fretting is known to be a major cause of contact deterioration and failure; commonly exhibited as the contact resistance increases from a few milliohms, in the case of a new metallic contacts, to in excess of several ohms for exposed contacts. Two technologies are discussed; firstly extrinsically conducting polymer (ECP), where highly conductive interconnects are formed using metallized particles embedded within a high temperature polymer compound, and secondly; intrinsically conducting polymers (ICPs) are discussed. These latter surfaces are new developments which are beginning to show potential for the application discussed. This paper presents the work on the ICPs using poly(3,4- ethylenedioxythiophene)/poly(4-styrenesulfonate) (PEDOT /PSS) and its blends from secondary doping of dimethylformamide (DMF) PEDOT/PSS. Two different processing techniques namely drop coating and spin coating have been employed to develop test samples and their functionality were assessed by two independent studies of temperature and fretting motion. The review leads to a number of recommendations for further studies into the application of conducting polymers for contacts with micro-movement.

3 citations