Topic
Contact area
About: Contact area is a research topic. Over the lifetime, 12358 publications have been published within this topic receiving 256401 citations. The topic is also known as: contact patch & contact region.
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TL;DR: In this paper, a probabilistic model for the deformation mechanics of the interface between randomly rough metal surfaces, which is geometrically and mechanically more realistic than previous models, is derived and numerically evaluated.
105 citations
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01 Jun 1991TL;DR: Lubrication mechanisms and contact mechanics have been analysed in a new generation of ‘cushion form’ bearings for artificial hip joints, which comprise low elastic modulus layers on the articulating surfaces, and the main advantage of using a cushion bearing with low elasticModulus layers was found to be associated with microelastohydrodynamic lubrication.
Abstract: Lubrication mechanisms and contact mechanics have been analysed in a new generation of ‘cushion form’ bearings for artificial hip joints, which comprise low elastic modulus layers on the articulating surfaces. Comparisons have been made with ‘ hard’ bearings used in existing prostheses and also with the natural hip joint. Lubricating film thicknesses are enhanced by larger contact areas and lower contact pressures. For a fixed contact area, simultaneous changes in layer thickness and radial clearance have been shown to have a small effect on elastohydrodynamic film thickness. Hard bearings designed with the same contact area as the cushion bearings produced a similar film thickness, but lubricant film thickness is not optimized in current designs. The main advantage of using a cushion bearing with low elastic modulus layers was found to be associated with microelastohydrodynamic lubrication. Careful selection of the elastic modulus is important in order to ensure that this lubrication regime was effective...
105 citations
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TL;DR: In this article, a material removal rate model as a function of abrasive weight concentration has been proposed for chemical mechanical planarization/polishing (CMP) by extending the material removal model developed earlier in 2001 and 2002.
Abstract: A material removal rate (MRR) model as a function of abrasive weight concentration has been proposed for chemical mechanical planarization/polishing (CMP) by extending a material removal model developed earlier in 2001 and 2002. With an increase of the weight concentration of abrasives, three regions of material removal exist: a chemically dominant and rapid increasing region, a mechanically dominant linear region, and a mechanically dominant saturation region. A detailed model is proposed to explain that the transition from the first to the second region is due to a transition from a wafer surface covered with a single soft material to a surface covered with both soft and hard materials. The slope of the linear region is a function of abrasive size distribution, and the saturation removal rate is a function of abrasive size distribution and wafer-pad contact area. The model can help to clarify the roles of chemicals, wafer-pad contact area, and abrasive size distribution in CMP.
104 citations
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TL;DR: In this paper, three models, JKR (Johnson, Kendall and Roberts), DMT (Derjaguin, Muller, and Toporov) and MD (Maugis-Dugdale), are compared with the Hertz model in dealing with nano-contact problems.
Abstract: Three models, JKR (Johnson, Kendall and Roberts), DMT (Derjaguin, Muller, and Toporov) and MD (Maugis-Dugdale), are compared with the Hertz model in dealing with nano-contact problems. It has been shown that both the dimensionless load parameter, P = P /(πΔγR), and the transition parameter have significant influences on the contact area at micro/nano-scale and should not be ignored in nano-indentation tests.
104 citations
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TL;DR: In this article, the relationship between normal force and friction force for a finger contacting a surface was examined, and also the effect of surface roughness, using a finger friction rig.
104 citations