Contact resistance

About: Contact resistance is a research topic. Over the lifetime, 15262 publications have been published within this topic receiving 232144 citations. The topic is also known as: electrical contact resistance & ECR.

Pressure sensing by flexible, organic, field effect transistors

Abstract: A mechanical sensor based on a pentacene field effect transistor has been fabricated. The pressure dependence of the output current has been investigated by applying a mechanical stimulus by means of a pressurized air flow. Experimental results show a reversible current dependence on pressure. Data analysis suggests that variations of threshold voltage, mobility and contact resistance are responsible for current variations. Thanks to the flexibility of the substrate and the low cost of the technology, this device opens the way for flexible mechanical sensors that can be used in a variety of innovative applications such as e-textiles and robotic interfaces.

Contact resistance reduction employing germanium overlayer pre-contact metalization

Abstract: Techniques are disclosed for forming transistor devices having reduced parasitic contact resistance relative to conventional devices. The techniques can be implemented, for example, using a standard contact stack such as a series of metals on, for example, silicon or silicon germanium (SiGe) source/drain regions. In accordance with one example such embodiment, an intermediate boron doped germanium layer is provided between the source/drain and contact metals to significantly reduce contact resistance. Numerous transistor configurations and suitable fabrication processes will be apparent in light of this disclosure, including both planar and non-planar transistor structures (e.g., FinFETs), as well as strained and unstrained channel structures. Graded buffering can be used to reduce misfit dislocation. The techniques are particularly well-suited for implementing p-type devices, but can be used for n-type devices if so desired.

Crystal-polarity dependence of Ti/Al contacts to freestanding n-GaN substrate

Abstract: The effect of crystal polarity on the electrical properties of Ti/Al contacts to n-GaN substrate has been investigated. The Ti/Al contacts prepared on Ga-face n-GaN substrate became ohmic with a contact resistivity of 2×10−5 Ω cm2 after annealing at temperatures higher than 600 °C for 30 s. On the contrary, the contacts on N-face n-GaN substrate exhibited nonlinear current–voltage curve and high Schottky barrier heights over 1 eV were measured at the same annealing conditions. These results could be explained by opposite piezoelectric-field at GaN/AlN heterostructure resulted from different polarity of the GaN substrate.

Experimental study of the minority-carrier transport at the polysilicon—monosilicon interface

Abstract: This paper presents the results of an experimental study designed to explore both qualitatively and quantitatively the mechanism of the improved current gain in bipolar transistors with polysilicon emitter contacts. Polysilicon contacts were deposited and heat treated at different conditions. The electrical properties Were measured using p-n junction test structures that are much more sensitive to the contact properties than are bipolar transistors. A simple phenomenological model was used to correlate, the structural properties with electrical measurements. Possible transport mechanisms are examined and estimates are made about upper bounds on transport parameters in the principal regions of the devices. The main conclusion of this study is that the minority-carrier transport in the polycrystalline silicon is dominated by a highly disordered layer at the polysilicon-monosilicon interface characterized by very low minority-carrier mobility. The effective recombination velocity at the n+polysilicon-n+monosilicon interface was found to be a strong function of fabrication conditions. The results indicate that the recombination velocity can be much smaller than 104cm/s.

Ohmic contacts to sic

Abstract: In this chapter, the most significant results obtained in the last decade in the field of ohmic contacts to SiC are reviewed First, the basic concepts related to the physics of ohmic contacts and to the contact resistance measurement techniques are briefly reported Then, some aspects concerning the formation of low resistance (10-5-10-6 Ωcm2) ohmic contacts on n-type and for p-type SiC are discussed, focusing on Ni-based and Al/Ti-based contacts Examples of innovative applications on practical devices are also reported, as the simultaneous formation of ohmic contacts on n- and p-type SiC for vertical power MOS devices, obtained adding Al to a standard Ni contact, and a single-metal technology for ohmic and rectifying contacts in MESFETs, using Ti or Ni without post-deposition annealing