Contact resistance

About: Contact resistance is a research topic. Over the lifetime, 15262 publications have been published within this topic receiving 232144 citations. The topic is also known as: electrical contact resistance & ECR.

Small cell low contact resistance rugged power field effect devices and method of fabrication

Abstract: A multi-cellular power field effect semiconductor device has compact cells including a heavily doped portion of a body region which is self-aligned with respect to an aperture in the gate electrode. The intercept of this heavily doped portion of the body region with the upper surface of the device may also be self-aligned with respect to the aperture and the gate electrode. A method of producing the device is also disclosed.

Self-aligned contact metallization for reduced contact resistance

Abstract: Techniques are disclosed for forming low contact resistance transistor devices. A p-type germanium layer is provided between p-type source/drain regions and their respective contact metals, and an n-type III-V semiconductor material layer is provided between n-type source/drain regions and their respective contact metals. The n-type III-V semiconductor material layer may have a small bandgap (e.g., <0.5 eV) and/or otherwise be doped to provide desired conductivity, and the p-type germanium layer can be doped, for example, with boron. After deposition of the III-V material over both the n-type source/drain regions and the germanium covered p-type source/drain regions, an etch-back process can be performed to take advantage of the height differential between n and p type regions to self-align contact types and expose the p-type germanium over p-type regions and thin the n-type III-V material over the n-type regions. The techniques can be used on planar and non-planar transistor architectures.

Metallization scheme for highly low-resistance, transparent, and thermally stable Ohmic contacts to p-GaN

Abstract: We report on a promising metallization scheme for high-quality Ohmic contacts to surface-treated p-GaN:Mg (2–3×1017 cm−3). It is shown that the as-deposited Pt/Ru contact produces a specific contact resistance of 7.8(±2.2)×10−4 Ω cm2. However, annealing of the contact at 600 °C for 2 min results in a resistance of 2.2(±2.0)×10−6 Ω cm2. It is also shown that the light transmittance of the annealed contact is 87.3% at 470 nm. Furthermore, the surface of the contact annealed at 600 °C for 30 min is found to be very smooth with a rms roughness of 0.8 nm. These results strongly indicate that the Pt/Ru can be a suitable scheme for the fabrication of high-performance laser diodes or other devices.

In situ grown-in selective contacts to n-i-p-i doping superlattice crystals using molecular beam epitaxial growth through a shadow mask

Abstract: Highly selective n‐ and p‐type contacts to GaAs doping superlattices have been achieved by using molecular beam epitaxial growth through a silicon shadow mask to form interdigital grown‐in contacts. Low contact resistance, excellent diode characteristics, and efficient lateral injection electroluminescence are obtained.