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Showing papers on "Coplanar waveguide published in 1979"


Book
01 Jun 1979
TL;DR: In this article, the authors present a quasi-static analysis of an Enclosed Microstrip and a Slot-Coupled Microstrip Line, as well as a fullwave analysis of Discontinuity Inductance Evaluation.
Abstract: Microstrip Lines I: Quasi-Static Analyses, Dispersion Models, and Measurements -Introduction. Quasi-Static Analyses of a Microstrip. Microstrip Dispersion Models. Microstrip Transitions. Microstrip Measurements. Fabrication. Microstrip Lines II: Fullwave Analyses, Design Considerations, and Applications - Methods of Fullwave Analysis. Analysis of an Open Microstrip. Analysis of an Enclosed Microstrip. Design Considerations. Other Types of Microstrip Lines. Microstrip Applications. Microstrip Discontinuities I: Quasi-Static Analysis and Characterization -Introduction. Discontinuity Capacitance Evaluation. Discontinuity Inductance Evaluation. Characterization of Various Discontinuities. Compensated Microstrip Discontinuities. Microstrip Discontinuities II: Fullwave Analysis and Measurements - Planar Waveguide Analysis. Fullwave Analysis of Discontinuities. Discontinuity Measurements. Slotlines -Introduction. Slotline Analysis. Design Considerations. Slotline Discontinuities. Variants of Slotline. Slotline Transitions. Slotline Applications. Defected Ground Structure (DGS) -Introduction. DGS Characteristics. Modeling of DGS. Applications of DGS. Coplanar Lines: Coplanar Waveguide and Coplanar Strips -Introduction. Analysis. Design Considerations. Losses in Coplanar Lines. Effect of Tolerances. Comparison with Microstrip Line and Slotline. Transitions. Discontinuities in Coplanar Lines. Coplanar Line Circuits. Coupled Microstrip Lines -Introduction. General Analysis of Coupled Lines. Characteristics of Coupled Microstrip Lines. Measurements on Coupled Microstrip Lines. Design Considerations for Coupled Microstrip Lines. Slot-Coupled Microstrip Lines. Coupled Multiconductor Microstrip Lines. Discontinuities in Coupled Microstrip Lines. Substrate Integrated Waveguide (SIW) -Introduction. Analysis Techniques of SIW. Design Considerations. Other SIW Configurations. Transitions Between SIW and Planar Transmission Lines. SIW Components and Antennas. Fabrication Technologies and Materials.

2,182 citations


Proceedings ArticleDOI
01 Jan 1979
TL;DR: In this paper, various methods to excitate propagation along coplanar waveguide (C.P.W) are reviewed and some very useful transitions are completly described.
Abstract: This paper reviews various methods to excitate propagation along coplanar waveguide (C.P.W); some very useful transitions are completly described and the performances obtained on transitions such as coplanar to coax, coplanar to microstrip or coplanar to slot line are given. Examples of application in microwave integrated circuits illustrate the employment of these transitions.

55 citations


Patent
Ronald E. Stegens1
27 Dec 1979
TL;DR: In this paper, a versatile test structure for coplanar waveguide (CPW) microwave integrated circuits is provided with a support structure or carrier which accommodates any length of CPW circuit.
Abstract: A versatile test structure for coplanar waveguide (CPW) microwave integrated circuits is provided with a support structure or carrier which accommodates any length of CPW circuit. The carrier is provided with a shock mounting means for a CPW substrate which protects the substrate against physical damage, as well as damage caused by widely varying thermal coefficients of expansion. The carrier is provided at each end thereof with a sliding connector to inject or remove microwave energy from the CPW substrate via a coaxial connector. The sliding connector and the carrier together comprise a mounting structure for the substrate which may be further provided with a sliding energy sampler or a right-angle CPW transition which may be used to sample energy levels within the substrate, or test individual portions of a CPW circuit.

47 citations


Patent
15 Jun 1979
TL;DR: In this paper, an active microwave amplifier element is hermetically sealed on the opposite side of a dielectric substrate from the side in which input and output signals are transmitted.
Abstract: An active microwave amplifier element is hermetically sealed on the opposite side of a dielectric substrate from the side in which input and output signals are transmitted. The active element is mounted on a ground plane and is electrically connected to coplanar waveguide elements which are coplanar with the ground plane. The coplanar waveguide elements are electrically connected to associated microwave strips through the dielectric substrate and said holes are also sealed. A cap having similar coefficient of thermal expansion to the dielectric substrate is mounted on the ground plane to enclose and hermetically seal the active element.

33 citations


Patent
26 Jul 1979
TL;DR: In this paper, a multi-layer printed circuit with a plurality of linear conductors with a heater and a diode in each group was classified into groups and at least one end of each group being connected together.
Abstract: A multi-layer printed circuit applicable to a thermal printer head, having a plurality of parallel linear conductors with a heater and a diode in each conductors being classified into a plurality of groups and at least one end of the conductors in each group being connected together, said printed circuit comprising a first layer having an insulating substrate with a plurality of parallel linear conductors attached to said substrate, the terminated ends of the conductors in each group being arranged on an oblique line on the first layer, a second layer having a parallelogram-shape substrate portion with a plurality of parallel conductors on the surface of the same, each conductor on the second layer connecting each of the conductors in each group on the first layer to the corresponding conductors in the related group across some of the conductors on the first layer.

11 citations


Proceedings ArticleDOI
01 Jan 1979
TL;DR: In this article, it was shown that conductor and dielectric losses height is equal to the round plane and lower in microstrip than in coplanar waveguides when the substrate spacing in CPW is increased.
Abstract: Conductor and dielectric losses height is equal to the round plane are lower in microstrip than in coplanar waveguides (CPW) when the substrate spacing in CPW. When radiation loss is included and the ground plane spacing is allowed to increase in the CPW, the guides are comparable.

5 citations