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Digital image correlation

About: Digital image correlation is a research topic. Over the lifetime, 7842 publications have been published within this topic receiving 132166 citations.


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TL;DR: In this article, the thermal buckling behavior of a circular aluminum plate that results from thermal loading was investigated using a digital image correlation (DIC) technique using a polarized light filter.
Abstract: In this study, the thermal buckling behavior of a circular aluminum plate that results from thermal loading was investigated using a digital image correlation (DIC) technique. The aluminum plate was placed in a titanium ring and the structure was heated from room temperature 25 °C to 160 °C. Due to the differences in the coefficients of thermal expansion (CTEs) between aluminum and titanium, the aluminum plate buckles at a certain temperature. The buckling temperature was determined from the full-field deformation shape and temperature-displacement curve that were obtained using the DIC-based ARAMIS® software. In order to obtain an appropriate full-field deformation, a polarized light filter was used to reduce the out-of-plane displacement error, which is an unavoidable error in the experiment. Using this method, the standard deviation of the z directional displacement was reduced from ±3.14 μm to ±2.70 μm. In addition, the results demonstrated that the measured buckling temperature was close to the theoretical buckling temperature of the circular plate in a simply supported boundary condition. In order to verify the proposed measurement method, a finite element analysis of the structure was performed using the ABAQUS software. The results of the DIC-based measurement and finite element analysis were in good agreement regarding the deformation curve tendency. The buckling temperature from the finite element method (FEM) was slightly larger than that from the experimental results due to the initial imperfections of the aluminum specimen. These results provide a good method for studying thermal buckling for the design and analysis of engineering structures in diverse fields such as aerospace engineering, oil refineries, and nuclear engineering.

50 citations

Journal ArticleDOI
TL;DR: In this article, a unified digital image correlation (DIC)/eXtended Finite Element Method (X-FEM) framework based on the Williams' series for fatigue crack growth identification and simulation is proposed.

50 citations

Journal ArticleDOI
TL;DR: In this article, a single-camera high-speed stereo-digital image correlation (SCHS) technique for full-field transient 3D deformation measurement during ballistic impact is investigated.

50 citations

Journal ArticleDOI
TL;DR: In this article, the authors proposed a measuring chain for the correlation system Q-450 and developed a software application called DICMAN 3D, which allows the direct use of this system in the area of modal testing.

50 citations

01 Jan 2008
TL;DR: In this paper, the feature extraction for health monitoring based on optical measurements of transient strain from digital image correlation (DIC) in conjunction with ultra high-speed imaging has been investigated.
Abstract: In this paper, the feature extraction for health monitoring based on optical measurements of transientstrain from digital image correlation (DIC) in conjunction with ultra high-speed imaging has been investigated. Full-field measurement of transient strain have been made in various board assemblies subjected to shock in various orientations. Feature-extraction for health monitoring of leadfree area array architectures based on statistical pattern recognition has been presented. Previous researchers have measured the transient-dynamics of board assemblies with high-speed imaging in conjunction with high-speed image analysis for measurement of relative displacement, angle, velocity, and acceleration [Lall 2006, Che 2006], high-speed data-acquisition systems with discrete strain gages [Lall 2004, 2005, Liang 2005] and with accelerometers for measurement of transient acceleration [Dunford 2004, Goyal 2000, Seah 2005]. Degradation in confidence value gives a leading indication of component failure. Package architectures examined include-flex ball-grid arrays, tape-array ballgrid arrays, and metal lead-frame packages. Statistical Pattern Recognition Techniques including, mahalanobisdistance approach, wavelet packet energy decomposition, and time-frequency (TFA) techniques have been investigated for system identification, condition monitoring, and fault detection and diagnosis in electronic systems. Explicit finite element models have been developed and various kinds of failure modes have been simulated such as solder ball cracking, package fall off and solder ball failure. Models developed include, smeared property models, Timoshenko-beam models, and explicit sub-models. Explicit finite-element models have been correlated with experimental data. The presented approach does not depend on continuity and therefore does not need daisy-chained devices for detection of

50 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
2023582
20221,120
2021667
2020646
2019636
2018567