Topic
Digital image correlation
About: Digital image correlation is a research topic. Over the lifetime, 7842 publications have been published within this topic receiving 132166 citations.
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TL;DR: In this article, a tensile loading device is designed to apply the loading at speed of less than 1μm/s to achieve strain rate of about 10−3/s at the gage section level.
41 citations
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TL;DR: In this article, a technique for mapping residual stress profiles in amorphous materials with high spatial definition is presented by applying a focused ion beam (FIB)based semidestructive mechanical relaxation method, the stresses are mapped in a peened and fatigued bulk metallic glass (BMG) (Zr50Cu40Al10 at.
Abstract: Residual stresses in crystalline or glassy materials often play a key role in the performance of advanced devices and components. However, stresses in amorphous materials cannot easily be determined at the micron scale by diffraction, or by other conventional laboratory methods. In this article, a technique for mapping residual stress profiles in amorphous materials with high spatial definition is presented. By applying a focused ion beam (FIB)–based semidestructive mechanical relaxation method, the stresses are mapped in a peened and fatigued bulk metallic glass (BMG) (Zr50Cu40Al10 at. pct). The residual stresses are inferred using finite element analysis (FEA) of the surface relaxations, as measured by digital image correlation (DIC), that occur when a microslot is micromachined by FIB. Further, we have shown that acceptable accuracy can in most cases be achieved using a simple analytical model of the slot. It was found that the fatigue cycling significantly changes the distribution of compressive residual stresses with depth in the plastically deformed surface layer. Our observations point to the scalability of this method to map residual stresses in volumes as small as 1 × 1 × 0.2 μm3 or less.
41 citations
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TL;DR: In this paper, a high-resolution digital camera mounted on an optical microscope is used to photograph the natural random pattern present on the surface of a polished polymer bonded explosive (PBX) sample.
41 citations
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41 citations
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27 May 2014-Materials Science and Engineering A-structural Materials Properties Microstructure and Processing
TL;DR: In this article, in situ surface deformation measurement techniques were applied to characterize strain localization sites in nickel-based superalloys when tested under constant load at 700 °C.
Abstract: in situ surface deformation measurement techniques were applied to characterize strain localization sites in nickel-based superalloys when tested under constant load at 700 °C. Deformation maps were coupled with electron backscatter diffraction (EBSD) measurement of grain location and orientation to correlate localization sites with underlying surface microstructure. Superalloy Rene-104 was heat treated and quenched to create two microstructures with similar grain sizes but different grain boundary character: the standard microstructure had microscopically planar grain boundaries, and the other microstructure had serrated grain boundaries. Analysis of full field strain maps calculated from in situ scanning electron microscopy (SEM) images indicated distinct differences in strain localization as a function of total strain for the two microstructures. The standard microstructure showed very little intra-granular strain accumulation, and annealing twin boundaries played an important role in strain localization sites, whereas the serrated microstructure experienced strain accumulation more evenly throughout the microstructure. Grain boundary sliding (GBS) was observed in both microstructures, but the development of serrated grain boundaries significantly decreased the contribution of this mechanism to the overall strain accommodation from 20% to 14% of the total plastic strain being accommodated by GBS.
41 citations