Electrical connection

About: Electrical connection is a research topic. Over the lifetime, 15180 publications have been published within this topic receiving 111459 citations.

Package systems having interposers

Abstract: A package system includes a first integrated circuit disposed over an interposer. The interposer includes at least one molding compound layer including a plurality of electrical connection structures through the at least one molding compound layer. A first interconnect structure is disposed over a first surface of the at least one molding compound layer and electrically coupled with the plurality of electrical connection structures. The first integrated circuit is electrically coupled with the first interconnect structure.

Shielded optical probe having an electrical connector

Abstract: The invention is a noninvasive optical probe having an electrical connector for connecting the optical probe to a cable connector. According to one embodiment, the electrical connector includes a durable flexible tab suspended between the housing of the optical probe and a protective cover. The electrical connector also advantageously forms, according to various embodiments, a flexible, plugable, lockable, removable, and sealable electrical connection.

Circuit board based cable connector

Abstract: A circuit board based cable connector is disclosed for use with a sensor connector tab to establish electrical signal connection between a sensor and a monitor or processor. The connector comprises a housing which encloses a circuit board. A slot is formed through a leading edge of the housing to allow insertion of the connector tab. A release mechanism releasably secures the connector tab within the housing. The circuit board is positioned adjacent and generally parallel to the inserted connector tab. Traces are formed on the side of the circuit board opposite the connector tab and establish electrical connection between wires of a cable and connector arms of the circuit board. A ground plane is formed on the tab side of the circuit board and, together with the flexible shield, provides an EMI shielding envelope. The connector arms extend generally parallel to the circuit board and are bent at their free ends to form dips. Slots formed through the circuit board are adapted to receive the dipped contact arm ends. The contact arm dips extend through the slots and into contact with electrical contacts of the connector tab, establishing an electrical connection. The connector tab is easily removed by actuating the release mechanism.

Surgical instrument battery pack with voltage polling

Abstract: A method of operating a medical device comprises electrically connecting a power device to the medical device. The method further comprises sensing at least one characteristic of one of the medical device with the power device. The method further comprises adjusting or maintaining one or more characteristics of an electrical connection feature the power device according to the at least one observed characteristic such that the electrical connection features of the power device and medical device are operationally compatible, and operating the power device according to an operational profile associated with the medical device.

Semiconductor package and method for fabricating the same

Abstract: There is provided a semiconductor package and method for fabricating the same. An embodiment of the semiconductor package includes: a semiconductor chip having a first face and a second face, the first face having a plurality of input/output pads formed thereon; a circuit board composed of a resin film having a first face and a second face, a circuit pattern layer including a plurality of bond fingers and ball lands, and a cover coat covering the circuit pattern layer and selectively exposing the plurality of bond fingers and ball lands, the circuit pattern layer being formed on the first face of the resin film, the circuit board having a through hole at the center thereof, the semiconductor chip being placed in the through hole; electrical connection means for electrically connecting the input/output pads of the semiconductor chip to the bond fingers of the circuit board; an encapsulant for encapsulating the semiconductor chip, connection means and a part of the circuit board; and a plurality of conductive balls fused to the circuit board. Accordingly, the semiconductor package becomes very thin and its heat spreading performance is improved.