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Showing papers on "Electroless nickel plating published in 1969"


Patent
02 Apr 1969
TL;DR: In this article, a clean aluminous surface is prepared for ELECTROLESS PLATING by ETCHING in an ALKALINE SOLUTION and then pickinglining in an ACIDIC SOLUTION CONTAINING CHLORIDE IONS.
Abstract: ALUMINUM AND ALUMINUM ALLOYS ARE SUBJECTED TO A PREPLATING TREATMENT WHICH CONDITIONS THE SURFACES OF THESE METALS FOR RECEIVING ELECTROLESSLY DEPOSITED NICKEL PLATING DIRECTLY THEREON. A CLEAN ALUMINOUS SURFACE IS PREPARED FOR ELECTROLESS PLATING BY ETCHING IN AN ALKALINE SOLUTION AND THEN PICKLING IN AN ACIDIC SOLUTION CONTAINING CHLORIDE IONS. AN ALKALINE SOLUTION CONTAINING HYPOPHOSPHITE IONS IS EMPLOYED TO ACTIVATE THE ALUMINOUS SURFACE WHICH IS THEN PROVIDED WITH A THIN ELECTROLESS NICKEL STRIKE COAT BY IMMERSION IN AN AMMONICAL SOLUTION CONTAINING NICKEL IONS, HYPOPHOSPHITE IONS, AND A CHELATING AGENT. AFTER THE ELCTROLESS STRIKE COAT IS APPLIED, THE ALUMINOUS SURFACE IS PROVIDED WITH A PLATING OF ELECTRLESS NICKEL IN A CONVENTIONAL, ESSENTALLY HALOGEN-FREE BATH.

17 citations


Patent
Robert O. Lussow1, Louis H. Wirtz1
19 Feb 1969
TL;DR: In this paper, a process for electroless deposition of uniform and consistent dense nickel films on nonconductive substrates utilizing conventional techniques was proposed. But the process requires at least two repetitive cycles of activation, electroless plating of nickel and heating.
Abstract: A process for electroless deposition of uniform and consistent dense nickel films on nonconductive substrates utilizing conventional techniques The process requires at least two repetitive cycles of activation, electroless plating of nickel and heating

9 citations


Patent
05 Aug 1969
TL;DR: CATALYTIC METAL SURFACES are NICKEL PLATED from a CATIONHYPOPHOSPHITE ANION Solution as mentioned in this paper, which is used by spraying reactive solutions on the METAL surface and heating the surface with STEAM.
Abstract: CATALYTIC METAL SURFACES ARE NICKEL PLATED FROM A CATIONHYPOPHOSPHITE ANION SOLUTION. PLATING IS ACCOMPLISHED BY SPRAYING THE REACTIVE SOLUTIONS ON THE METAL SURFACE AND HEATING THE SURFACE AS BY CONTATING IT WITH STEAM. PLATING SOLUTION IS RECOVERED, ADJUSTED IN PH AS NECESSARY TO ASSURE SATISFACTORY PLATING AND RECYCLED.

7 citations


Proceedings ArticleDOI
01 Feb 1969

4 citations


Journal ArticleDOI
TL;DR: In this paper, the properties of acid-acetate baths containing hypophosphite as a reducing agent were studied in an attempt to obtain an electroless nickel deposit; further, the protective property of such deposits with phosphorus contents of 4 to 13% was investigated.
Abstract: The properties of acid-acetate baths containing hypophosphite as a reducing agent were studied in an attempt to obtain an electroless nickel deposit; further, the protective property of such deposits with phosphorus contents of 4 to 13% was investigated. The hypophosphite utilization efficiency for the deposition of electroless nickel was found to be 0.33; the deposition rate indicates a first-order dependence on hypophosphite, but it is independent of nickel concentration, within the limits specified in the range of suitable conditions. The phosphorus content of the deposits increases with a decrease in the pH value of the bath and with an increase in the initial concentration of hypophosphite, but it is independent of that of nickel. An electoless nickel with a high phosphorus content affords more protection against metallic bases.

3 citations