Showing papers on "Electroless nickel plating published in 1970"
Patent•
01 Dec 1970TL;DR: In this paper, it was shown that after degreasing, picking, picking and carving, the URANIUM BODIES are treated with a SATURATED Solution of PALLADIUM CHLORIDE or a HOT Solution of TETRASODIUM PYROPHOSPHATE and RINSED before IMMERSION in the ELECTROLESS NICKEL PLATING SOLUTION.
Abstract: THE QUALITY OF NICKEL PLATING APPLIED TO URANIUM BODIES BY THE ELECTROLESS PLATING PROCESS IS SUBSTANTIALLY IMPROVED IF, AFTER DEGREASING, PICKLING AND ETCHING, THE URANIUM BODIES ARE TREATED WITH A SATURATED SOLUTION OF PALLADIUM CHLORIDE OR A HOT SOLUTION OF TETRASODIUM PYROPHOSPHATE AND RINSED BEFORE IMMERSION IN THE ELECTROLESS NICKEL PLATING SOLUTION
21 citations
Patent•
13 Jul 1970TL;DR: In this article, the use of a QUATERNARY AMINE SURFACTANT SOLUTION in an ELECTROLESS METAL PLATING PROCESS produces a UNIFORM COATING on a non-convex and extensive surface cover.
Abstract: THE USE OF A QUATERNARY AMINE SURFACTANT SOLUTION IN AN ELECTROLESS METAL PLATING PROCESS PRODUCES A UNIFORM COATING ON A NONCONDUCTOR SURFACE AND EXCELLENT SURFACE COVERAGE.
19 citations
Patent•
04 Nov 1970
TL;DR: In this article, an adherent COATING of an ELECTROLESS NICKEL PLATE on glass is described, using an ACIDIC ELECTROFLUORIC ACID ETHCH.
Abstract: AN ADHERENT COATING OF ELECTROLESS NICKEL PLATE ON GLASS IS OBTAINED USING AN ACIDIC ELECTROLESS PLATING SOLUTION HAVING A PH WITHIN THE RANGE OF ABOUT 5.0 TO 7, WHICH SOLUTION CONTAINS BORATE IONS, FLUORIDE IONS AND AN ION OF AN ORGANIC HYDROXYCARBOXYLIC ACID SUCH AS GLYCOLATE ION. THE USE OF A HYDROFLUORIC ACID ETHCH PRIOR TO PLATING FURTHER IMPROVES ADHESION.
6 citations
5 citations
Patent•
10 Mar 1970TL;DR: In this paper, a method for electrolessly plating a NICKEL from a bath is presented, in which a mixture of salt, ammonium hydroxide, and a source of HYPOPHOSPHITE IONS are used.
Abstract: A METHOD FOR ELECTROLESSLY PLATING NICKEL FROM A BATH COMPRISING (I) A NICKEL SALT; (II) A NICKEL ION COMPLEXING AGENT; (III) A SOURCE OF HYDROPHOSPHITE IONS; AND (IV) AMMONIUM HYDROXIDE, IN WHICH THE MOLAR CONCENTRATION RATIO OF NICKEL TO HYPOPHOSPHITE IONS IS LESS THAN 0.2. THE BATH EXHIBITS A PLATING RATE SUBSTANTIALLY INDEPENDENT OF HYPOPHOSPHITE ION CONCENTRATION.
2 citations