Showing papers on "Electroless nickel plating published in 1972"
Patent•
21 Apr 1972TL;DR: In this article, a method for the electroless deposition of nickel on a substrate without pretreatment of the substrate was proposed, in which the reducing agent is an amine borane compound, the relatively high pH is maintained with NH 4 OH plus a strong alkali, and the complexing agent is pyrophosphate anion.
Abstract: A method for the electroless deposition of nickel on a substrate without pretreatment of the substrate, in which the reducing agent is an amine borane compound, the relatively high pH is maintained with NH 4 OH plus a strong alkali, and the complexing agent is pyrophosphate anion.
5 citations
Patent•
IBM1
TL;DR: In this paper, a metal alkoxide additive has been used to improve the performance of electroless nickel plating systems by reducing bath decomposition at room temperature, activating the hypophosphite reducing agent and promoting more efficient utilization of the bath materials.
Abstract: A metal alkoxide additive enhances deposit rate, stability and efficiency at room temperature of certain electroless nickel plating systems. These are systems which utilize hypophosphite as a reducing agent and as a source of phosphorous for strengthening the deposits. The additive apparently operates to: (a) significantly retard bath decomposition at room temperatures; (b) activate the hypophosphite reducing agent, which characteristically is poorly reactive at room temperature, thereby promoting higher reduction rates; and (c) promote more efficient utilization of the bath materials. The sequence and method of combination of bath ingredients materially affects the bath efficiency.
1 citations