Showing papers on "Electroless nickel plating published in 1976"
Patent•
21 Oct 1976
TL;DR: In this paper, a plating solution is brought to equilibrium and thereafter operated with the concentration of plating reactants and by-products maintained substantially constant, avoiding the known problems of byproduct build-up and variable concentration of reactants typically associated with the use of such solutions.
Abstract: This invention relates to electroless metal deposition and more specifically, to a process where a plating solution is brought to equilibrium and thereafter operated with the concentration of plating reactants and by-products maintained substantially constant. The plating solution treated in accordance with the invention is one having evaporative losses of at least one percent per plating cycle. Following the process, a plating solution can be operated indefinitely and yields a metal plate of uniform quality and predictable properties at any time during use of the solution. The invention avoids the known problems of by-product build-up and variable concentration of reactants typically associated with the use of such solutions.
31 citations
Patent•
03 Mar 1976
TL;DR: In this article, the authors proposed to add large quantities of sodium fluoride to a chemical plating solution for depositing nickel on a catalytic substrate to increase the rate of deposition of an electroless nickel plating bath.
Abstract: The invention resides in the addition of large quantities of sodium fluoride to a chemical plating solution for depositing nickel on a catalytic substrate. The purpose of the addition is to increase the rate of deposition of an electroless nickel plating bath. In this way, heavy deposits may be made on substrates without substantial surface roughness, the control and integrity of the properties of the bath can be better maintained, concentrations of additives needed to maintain control of bath properties can be reduced, and the life of the plating bath can be extended.
4 citations