Showing papers on "Electroless nickel plating published in 1981"

Method for the electroless nickel plating of long bodies

Abstract: A method and apparatus (10) for the electroless nickel plating of long bodies (12) including a deep tank (11) capable of supporting at least one long body (12) in a substantially vertical position and immersed in an electroless nickel plating solution (32), a fluid distribution system (18-29) including a plurality of vertically spaced sparger outlets (31, 31') within the tank (11) and means for discharging (30) filtered, heated, plating solution through the sparger outlets (31, 31') generally directed toward or around the long body (12) within the tank (11) to provide directionalized dispersion of the solution (32) throughout substantially the full depth of the tank (11).

Electroless nickel plating activator composition a method for using and a ceramic capacitor made therewith

Abstract: An activator composition paste includes a homogeneous dispersion of a palladium and commensurate amounts of silicon and of zinc. A screen printed layer of this paste is applied to a ceramic capacitor body to form electrodes, terminations or both. The body is heated to 615° C. and subsequently electroless nickel plated providing excellent electrical and mechanical connection of the plated nickel to the ceramic.

Electroless nickel plating method for high nickel chromium alloy

Abstract: PURPOSE:To carry out electroless Ni plating with high adhesion by striking a high Ni.Cr alloy with Ni and activating the struck surface. CONSTITUTION:A high Ni.Cr alloy is pretreated by degreasing and pickling and struck with Ni. The struck Ni surface is then activated by acid treatment with a strong acid such as a soln. of nitric acid and hydrofluoric acid, and immediately after washing, electroless Ni plating is carried out. In place of the acid treatment activation, the struck alloy may be subjected to electrolytic elution as an anode in an Ni plating bath at relatively low current density to obtain similar effect.

Nickel coat forming method

Abstract: PURPOSE:To form a homogeneous dense nickel coat of high performance on a substrate by electroless nickel plating by reducing nickel salt in the presence of diethylenetriamine. CONSTITUTION:When a nickel coat is formed on a substrate of glass, plastics, ceramics or the like by electroless plating, one or more among diethylenetriamine, ethylenediamine and imidazole are added to a nickel salt soln., a reducing agent soln. or a nickel plating bath contg. both the nickel salt and the reducing agent by 1-1,000ppm to the amount of the nickel salt. The compounds may be added when the nickel salt is reduced. Thus, nickel particles deposited by reduction are kept fine to form a dense uniform nickel coat free from pinholes, etc.

LOW-VALUE NICKEL RESISTORS ELECTROLESS-PLATED ON "IMST" SUBSTRATE FOR POWER HYBRID ICs

Abstract: This paper describes a new resistor formation technique, characterized by the use of our unique hybrid IC substrate (IMST substrate) and the electroless nickel plating on it.

Powder material for electroless niclel plating bath

Abstract: PURPOSE:To provide the powder material capable of being used in an electroless nickel plating bath obtained by adding sodium hypophosphite, anhydrous sodium acetate and sodium bicarbonate to a nickel sulphate powder coated with a surface active agent so as not to be reacted with other powder. CONSTITUTION:Nickel sulphate is used as much as possible in a hexahydrate form and ground to about 100 mesh or less. In a mixed solution prepared by adding a small amount of A benzine to anhydrous ethanol, an anionic surface active agent and a nonionic surface active agent are added so as to adjust a concn. thereof to 10-100ppm and lead nitrate is added as a reaction stabilizer in a concn. of about 2-4ppm. The obtained surface active agent solution is dropped to the nickel sulphate powder and stirred, mixed and dried. To the obtained nickel sulphate powder, sodium hypophosphite, anhydrous sodium acetate and sodium bicarbonate are added and the resulting mixture is dissolved in warm water and the obtained solution is used as a plating solution.

Silicon Solar Cells with Nickel/Solder Metallization

Abstract: Nickel/solder metallization of silicon solar cells offers a relatively inexpensive method of making electrical contact with the surface of the cell. More expensive methods, using precious metals and costly processes, are extensively used, having been developed for space applications. More recent interest in terrestrial applications of solar cells has led to an increased concern over cost, and nickel has assumed a position as a major candidate for solar cell metallization. Nickel can be plated on silicon solar cells using an electroless chemical deposition method to give contacts with good adhesion. In some cases where adhesion is poor initially, possibly as a result of surface contamination on the silicon, sintering under relatively mild conditions will dramatically improve the quality of the bond without harming the p-n junction of the cell. Silicon dioxide films of uncontrolled thicknesses have been considered to be a major cause of poor adhesion, but we have demonstrated that the electroless nickel plating solution dissolves silicon dioxide before depositing nickel. Silicon solar cells with nickel/solder metallization can survive terrestrial environmental stresses, as demonstrated by a 1,000 hour test at 85°C and 85% relative humidity under constant forward bias of 0.45 volt.

Plating method with nickel

Abstract: PURPOSE:To perform nickel plating at a low cost, by painting PdCl2 paste on the front and back sides of material to be plated and by calcining it, then by performing electroless nickel plating. CONSTITUTION:As a material to be plated is used a ceramic such as alumina, barium titanate. PdCl2 paste is obtained by mixing synthetic resin such as polyvinyl pyrolidone, org. solvent such as methanol, and PdCl2. The paste is prepared to contain about 0.05wt% PdCl2, about 10-90wt% org. solvent, and is painted preferably by screen printing method. The painted PdCl2 is calcined by heating at about 350-600 deg.C temp. in an electric furnace etc. Then electroless Ni plating is performed. Hereby, the material to be plated is plated only on the two activated sides of back and front sides, and the unactivated ends are not plated.

An Illustrated Historical Development of High Surface Loading, High Throughput Barrel Electroless Nickel Plating

Abstract: The paper presents a case history of the development of an electroless nickel barrel plating process to meet the specific requirements of a sophisticated high performance battery cell without endan...