Showing papers on "Electroless nickel plating published in 1982"

Apparatus for controlling electroless plating bath

Abstract: A method and an apparatus for controlling an electroless plating bath such as an electroless nickel plating bath capable of using the bath for an extended period of time without remake are disclosed. The method comprises the steps of continuously or intermittently measuring the concentration of at least one consumable ingredient in the electroless plating bath, and automatically adding to the plating bath a first replenishing composition essentially consisting of consumable ingredients after detecting that the measured value has reached a predetermined concentration; while continuously or intermittently measuring the consumed amount of at least one consumable ingredient of the electroless plating bath to determine the degree of aging of the bath, and automatically discharging the predetermined volume of the plating solution and automatically adding to the plating bath a second replenishing composition containing nonconsumable ingredients in an amount essentially corresponding to a lost amount by the discharging after detecting that the consumed amount of the consumable ingredients has reached a predetermined value.

Electroless nickel plating

Abstract: Nickel-phosphorus deposits are electrolessly coated onto substrates at a commercially acceptable rate of deposition in a manner that enhances corrosion resistance and reduces the internal tensile stress of the electroless deposit on the substrate. This is done by plating from a bath that is sulfur-free (or free of sulfur except at its highest oxidation state) and that includes an unsaturated carboxylic acid of the formula R(COOH) n wherein R is an unsaturated alkyl group of at least 2 carbon atoms and n is at least 1, or a derivative thereof. Such compounds include aconitic, citraconic, fumaric, itaconic and maleic acids. The reducing agent of the bath may also be its phosphorus source e.g. an alkali metal hypophosphite.

Process for recovering nickel from spent electroless nickel plating solutions

Abstract: A process for recovering nickel from spent electroless nickel plating solutions by adjusting the pH of the solution to 10-10.5 with sodium hydroxide, adding ammonium hydroxide to obtain a pH of 11 of the solution, and heating the solution at 40°-50° C. while subjecting the solution to electrolysis to deposit nickel from the spent solution and separating the deposited nickel such that the spent solution may be safely discharged as effluent.

Etching agent for electroless plated thin nickel film

Abstract: PURPOSE:To dissolve and remove only a thin nickel film while inhibiting the erosion and blackening of the pattern of a copper circuit by adding free chlorine ions and a palladium sequestering agent such as oxime to an etching agent contg. an acid and hydrogen peroxide as principal components. CONSTITUTION:An etching agent consisting of about 0.1-50wt% of >=1 kind of acid selected from sulfuric acid, nitric acid and phosphoric acid, about 0.1-50% H2O2, about 2-20,000ppm free Cl and >= about 10ppm Pd sequestering agent dissolves only Ni while inhibiting Pd used as a surface activator in electroless nickel plating reaction from entering an etching soln. together with Ni and eroding a copper pattern or forming a black film on the surface of the pattern. The free Cl is obtd. by adding a chloride such as NaCl. As the Pd sequestering agent >=1 kind of compound selected from oximes, naphthol, amine, phenanthroline, quinaldinic acid, EDTA, benzotriazoles, etc. is used.

Production of electrode for liquid crystal display panel

Abstract: PURPOSE:To keep the voltage applied to each electrode of a panel at a certain level, by providing a metallic lead wire having a small width and a low resistance value on a transparent conductive film and thus avoiding the voltage drop caused by the resistance of the electrode film. CONSTITUTION:An Ni-P group bath of hypophosphite salt is preferably used for the electroless nickel plating both used at a lead wire part of a matrix panel in terms of the high adhesive strength to a transparent electrode film on a substrate and a low level of electric resistance. The thickness of the metallic skin requires 4,000Angstrom for the electrode at the data side and 1.6mu for the electrode at the driving side respectively. The heat treatment is preferably carried out for an hour at 200-400 deg.C in the air or in the N2 atmosphere in terms of the adhesive strength and the resistance value. It is possible to apply the nickel plating after a preprocess by which only the area on the transparent conductive film is selectively plated. This method can reduce the cost and increase the production efficiency in comparison with the vapor deposition method since no Au is used.

Forming method for pattern by electron beam

Abstract: PURPOSE:To obtain a new method of forming a high sensitivity pattern without detrimental liquid waste by combining a patterning of silver halide film by the exposure of an electron beam and a patterning of metal by electroless plating. CONSTITUTION:This method has the steps of forming a silver halide film on a substrate, exposing it with an electron beam, X-ray or ion beam to form a pattern of silver particles, and forming a metallic film by electroless plating. High resolution silver halide emulsion is coated on a glass substrate 1 to form a silver halide layer 2, a pattern is drawn by an electron beam drawing device, is then developed and fixed to form a silver particle pattern. Then, the substrate is dipped in an electroless nickel plating bath to form a nickel film 4, and is then cleaned and baked, thereby obtaining a desired mask.

Peeling method for electroless nickel plating

Abstract: PURPOSE:To peel off Ni plating easily and inexpensively from an electroless Ni plating articl by carrying out electrolysis using the article as an anode in an aqueous soln. contg. one or >=2 among CrO3, Na2Cr2O7 and K2Cr2O7. CONSTITUTION:An electroless Ni plated article is immersed in an aqueous soln. contg. one or >=2 among chromic anhydride, sodium dichromate and potassium dichromate. By carrying out electrolysis using the article as an anode and a suitable cathode, the Ni plating can be peeled off easily, and the surface state of the article after the peeling is made favorable.