Showing papers on "Electroless nickel plating published in 1996"

Electroless nickel plated contacts on porous silicon

Abstract: We have presented the electroless nickel plating technique as a preferred method for making ohmic or rectifying contacts on porous silicon. Nickel, plated by this technique, penetrates the pores and forms contact on an effective area, about 4.5 times the actual area of the sample. High‐temperature annealing of the plated metal produced excellent ohmic contacts with porous silicon formed on n‐type silicon. The properties of this contact are shown to be much superior to that of conventional evaporated and alloyed ohmic contacts made on p‐type porous silicon of identical characteristics. Contacts made under similar conditions by electroless nickel plating on p‐type porous silicon, on the other hand, showed good rectifying diode characteristics. The observed electrical properties of electroless nickel contacts are believed to be due to the presence of minute amounts of phosphorous with the plated metal.

Electroless nickel plating on SiC powder with hypophosphite as a reducing agent

Abstract: Electroless nickel plating on SiC powders was studied with hypophosphite as a reducing agent. The influence of various parameters of plating-bath temperature, pH value, reducing agent and stabilizer concentration, plating time and the amount of substrate, on the plating rate and the morphology and composition of deposits are discussed. Experimental results indicate that improvement in infiltration occurred during aluminum composite fabrication when the SiC powders were nickel-plated.

Black matrix substrate and color filter using the same

Abstract: PURPOSE: To obtain a black matrix substrate free from plating other than a pattern line part and defect with a simple method by containing a specific organic metal complex in a black dispersing resin. CONSTITUTION: A black composition is obtained by adding palladium acetate of the organic metal complex into a black dispersed body prepared by adding carbon black and a dispersing agent in a polyimide resin. A metal of the organic metal complex is a metal the same as or more noble than that of a metallic layer. A black resin layer 2 composed of the black composition is formed on a transparent glass substrate 1. A positive photoresist is applied thereon by spin coating, exposed with a prescribed mask, developed and the black resin layer 2 is etched. A resin black pattern 4 is formed by stripping the possitive photoresist pattern 3. The substrate is dipped into an electroless nickel plating solution to form a metal nickel layer 5 on the resin black pattern 4.

System for circulating electroless nickel plating solution

Abstract: PROBLEM TO BE SOLVED: To effectively reutilize an exhausted electroless nickel plating soln. contg. nickel hypophosphite by removing the nickel, HPO 3 2- and salts from the exhausted soln. adding the raw material such as nickel hypophosphite to the soln. and then recycling the soln. as the electroless nickel plating soln. SOLUTION: The exhausted electroless nickel plating soln. contg. nickel hypophosphite contg. nickel ion and the hypophosphite ion as the nickel ion reducing agent, chelating agent, buffer, pH regulator, stabilizer, etc., is freed from nickel by a chelate resin. The nickel obtained is reutilized in nickel plating. The soln. freed from nickel is controlled to pH 6 to 9 by adding Ca(OH) 2 , etc., and the HPO 3 2- is precipitated as calcium hypophopsphite and removed. Subsequently, the soln. is passed through an electrodialytic tank, cation-exchange resin, reverse-osmosis membrane, etc., to remove Na + , NH 4 - , etc. The treated soln. is recycled as a fresh plating soln. raw water. COPYRIGHT: (C)1998,JPO

Effect of halide ions on electroless nickel plating

Abstract: The effect of halide ions (F−, Cl−, Br, I−) on nickel deposition in acidic electroless nickel plating baths is investigated. Halide ions were found to have a significant effect on the nickel deposition and the results could not fully be explained using mixed-potential theory. A correlation between the stability constants of halide ions with palladium (ii) ions and the plating rate is proposed to explain the observations. Various parameters, such as the activation energy, deposit microstructure and phosphorus contents of the plating bath in the presence of various halide ions, were also studied.

Catalytic Surfaces from Langmuir−Blodgett Films of Tris(4,4‘-diisopropyldibenzylideneacetone)palladium(0) as Precursor. 2. Study of the Catalytic Activity in Electroless Metal Plating of Polymers

Abstract: The catalytic activity of palladium particles prepared upon thermal decomposition of Langmuir−Blodgett films of tris(4,4‘-diisopropyldibenzylideneacetone)palladium(0) (1) on polymeric supports was investigated. As the catalytic process, the palladium-catalyzed electroless nickel plating was studied. Influences on the nickel plating due to different palladium concentrations on the substrate were studied. It was found that a minimum substrate coverage with four palladium atoms per square nanometer is sufficient to cause homogeneous nickel plating. The presence of a higher palladium concentration has no further effect on the catalytic activity. The influence of a variation of the annealing time of the LB films on the nickel plating was also investigated. Short annealing times favor palladium cluster formation, while long annealing times lead to larger metallic palladium particles (see part 1 of this study). It was found that short annealing times leading to the clusters do not cause a significant catalytic a...

Production of plated parts such as molded circuit parts

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing plated parts which are excellent in heat resistance and generate no peeling even in a process of high temp. soldering. SOLUTION: A base material 1 made of a liquid crystal polymer as a blank is subjected to an etching treatment, then is added with a catalyst and is subjected to an electroless copper plating 2. After an upper surface of the electroless copper plating 2 is pattern-processed, electro-copper-plating 3 is executed thereon. A circuit pattern is formed, electroless nickel plating 4 is executed on the electro-copper-plating 3 and then heat treatment for hardening the nickel is executed. Thereafter, final surface platings 5, 6, 7 are executed thereon and finally heat treatment is executed for removing moisture in the base material 1. COPYRIGHT: (C)1998,JPO

Electroless Nickel Plating—Influence of Mixed Ligands

Abstract: Electroless nickel plating has been studied from acidic bath solution containing ethylenediamine and/or sodium potassium tartrate as complexing agents at various pH, temperatures and concentrations of sodium hypophosphite. Ni-P alloys with various amounts (1-18%) of phosphorus are obtained under different plating and bath conditions. Cyclic voltammetric studies of the bath solution revealed that the extent of complexation of nickel ions with the complexing agents is in the order of EDA > SPT> EDA & SPT. The functional properties of Ni-P alloys are found to depend on structure, composition and post-treatments. The high % in P in the alloy gave a high corrosion resistance. The X-ray diffraction studies revealed the existence of multiphase Ni-P, Ni 3 P 2 and Ni 5 P 2 films on the surface. Working conditions are optimised to get good quality deposits with high plating rate at sufficiently low temperature from a stable plating bath solution.

Electroless gold plating method

Abstract: PROBLEM TO BE SOLVED: To provide an electroless gold plating method which is suitable to manufacture a printed circuit board having a high reliability SOLUTION: The method is executed by forming a substrate layer on a base by electroless nickel plating and forming a gold coating film on this substrate layer by the electroless gold plating method In such a case, metallic layers (Pt, Pd, Ru and Rh) other than gold which are more noble than nickel are formed on the substrate layer and then the electroless gold plating is executed thereon The metallic layers which are more noble than nickel are formed by the electroless plating and alcohols, and furthermore, aliphat calboxylic acids are contained in a liquid at that time

Effects of the iodide ion on acidic electroless nickel deposition

Abstract: The influences of iodide ion on the electroless nickel (EN) deposition rate, hydrogen evolution, partial cathodic and anodic polarization curves and the stationary potential of the EN solution were determined. It was shown that I - stabilized the electroless nickel plating process due to interference in the anodic reaction through an adsorption-type mechanism.

A Super High Speed Electroless Nickel Plating Process

Abstract: A new super high speed electroless nickel plating process with a deposition rate of 25 to 28 μm/h has been developed. The influences of the concentrations of nickel salt, reducing agent, organic additives such as buffer, complexing agent and accelerator, the pH value, and solution temperature on the deposition rate were studied gravimetrically. The crystal structure and composition of the deposit were also determined by X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS).

Inhibition of nickel precipitation by organic ligands

Abstract: Wastewaters from electroplating are very complex due to the composition of the plating baths. A nickel plating bath typically consists of a nickel source (nickel chloride or nickel sulfate), complexing agents to solubilize nickel ions controlling their concentration in the solution, buffering agents to maintain pH, brighteners to improve brightness of the plated metal, stabilizers (inhibitors) to prevent undesired reactions, accelerators to enhance speed of reactions, wetting agents to reduce surface tension at the metal surface, and reducing agents (only for electroless nickel plating) to supply electrons for reduction of the nickel. Alkaline precipitation is the most common method of recovering nickel from wastewaters. However, organic constituents found in the wastewaters can mask or completely inhibit the precipitation of nickel. The objective of this study was to conduct an equilibrium study to explore the inhibition behavior of various organic ligands on nickel precipitation. This will lay the groundwork for development of technologies efficacious in the treatment of complexed nickel. The organic ligands used in this study are EDTA, triethanolamine (TEA), gluconate, and tartrate.

Electroless plating bath using chelating agent

Abstract: An electroless plating bath using a biodegradable chelating agent as a complexing agent Examples of the complexing agent heretofore used include EDTA for electroless copper plating baths and citric acid and EDTA for electroless nickel plating baths However, EDTA is difficultly biodegradable and hence the use thereof should be avoided from the viewpoint of environmental protection Further, the electroless nickel plating baths using citric acid are likely to lower the phosphorus content of the nickel coating under alkaline conditions providing a high plating rate, thus rendering the use of citric acid unsuitable for the production of a nickel coating having a high phosphorus content at a high efficiency The use of at least one member selected among monoamine chelating agents, such as aspartic acid/acetic acid, and diamine chelating agents, such as ethylenediaminedisuccinic acid as the complexing agent contained in the electroless plating baths has realized the provision of plating baths having a high biodegradability, good bath stability in copper plating and capable of forming a high-phosphorus coating at a high rate in nickel plating

Preparation of ink-jet head

Abstract: PROBLEM TO BE SOLVED: To prepare an ink-jet head provided with a water-repellent film always with high water repellency without being influenced by the condition during plating by irradiating the surface of polytetrafluoroethylene fine particles- dispersed nickel plating with excimer laser. SOLUTION: A polytetrafluoroethylene (PTFE) fine particles 32-dispersed nickel plating part 33 is formed on the surface of a nozzle forming member 31 by PTFE-dispersed nickel plating. This nickel plating is performed by PTFE fine particles-dispersed electroless nickel plating, etc. Then, the surface of the plating film is irradiated with excimer laser and as the irradiation energy of the excimer laser, by setting it in the range of 100-250mJ/cm 2 , the PTFE fine particles become rich on the surface of the nickel plating to obtain a water- repellent film with richer water repellency. In addition, the nickel plating can be covered with a film of PTFE fine particles by heating it at 300-400°C for 30-60min. COPYRIGHT: (C)1997,JPO

Electroless nickel plating bath

Abstract: An electroless nickel plating bath comprising (a) a water-soluble Nickel salt, (b) a reducing agent, (c) a complex former and (d) a compound with a sulphur-to-sulphur bond. A primer coating of Ni may be deposited by immersing the substrate in an electroless Ni plating bath containing no component (d), and then immersing the substrate in a second electroless Ni plating bath containing components (a), (b), (c) and (d). Component (d) is chosen eg from a thiosulphate, dithionate, polythionate, or dithionite.

Thick-film formation in electroless gold plating

Abstract: PROBLEM TO BE SOLVED: To solve a problem of a thick-film formation of a gold plating film in a short time and the problem of fin flaws of nickel by applying a nickel plating using an electroless nickel plating soln containing an inorg sulfur compd as a gold plating pretreatment of a circuit pattern for an electronic substrate SOLUTION: An electroless gold plating is executed after applying nickel plating by using an electroless plating soln to which thiosulfate, dithionate, polythionate or dithionite having S-S sulfur bond are added The addition of the compd having S-S sulfur bond is 001-100mg/l, especially preferably 05-50mg/l, and the plating is executed by a conventional method Further, at the time of the elecroless gold plating after nickel plating with this plating soln, the plating is executed by using a plating bath containing gold cyanate as a starting material of the gold and having a pH of 4-9 COPYRIGHT: (C)1997,JPO

Electroless nickel plating method of aluminum

Abstract: PURPOSE: To prolong the life of an electroless nickel plating liq. by executing the electroless nickel plating after subjecting an aluminum stock to a zinc substitution treatment and pickling, and thereafter, further subjecting the stock to the zinc substitution treatment for longer time than that of the foregoing treatments. CONSTITUTION: In the case the electroless nickel plating is executed to the aluminum or an aluminum alloy stock, the first zinc substitution treatment is executed to this stock preferably for 1-60sec. Then the stock is pickled and the second zinc substitution treatment is executed for a longer time than that of the first zinc substitution treatment, for 30-100sec preferably. Thereafter, the electroless nickel plating of the stock is executed by using the electroless plating liq. essentially consisting of water soluble nickel salt, hydrophosphorous acid/hypophosphate respectively as its complexing agent and reducing agent. In this way, the life of the electroless nickel plating liq. becomes more than about two times that obtained by a conventional method and the cost effectiveness of the plating is improved and also it is possible to reduce industrial wastes.

Origins of Nodules in Electroless Nickel-Phosphorus Deposition

Abstract: The origins of nodule formation in electroless nickel-phosphorus deposition were investigated. It was found that the pretreatment and plating conditions influenced the formation of nodules.Nodules were observed in the fractographs of the depositions depending on changes in the surface morphology of the copper substrate when the plating baths included mono- or di- carboxylic acids. On the other hand, nodules were not observed in the fractographs of the depositions with plating baths that contained hydroxycarboxylic acids.Nodules tended to be less likely to form when the deposition rate was relatively low and the phosphorus content of the deposition was high.

Fabrication of Nickel Microbump on Aluminium Substrate Using Electroless Nickel Plating

Abstract: Tape automated bonding (TAB) and flip chip bonding technologies have been progressing with the advancement of surface mounting technologies. The formation of metallic microbump is required to connect outer lead with each pad electrically for these mounting technologies. In general, aluminium has been used as a circuit or electrode material for large scale integrated circuits (LSI) fabrication. Recently, bump formation or via-hole filling by electroless nickel deposition was reported. A zincate process is generally used prior to electroless nickel plating on aluminium substrate. However, an organic resist cannot be applied because the zincate bath is strongly alkaline. Accordingly, we investigated electroless nickel plating on aluminium substrates using a nickel displacement process and fabrication of nickel bumps on aluminium electrode by electroless nickel plating. Furthermore, direct electroless nickel plating without nickel displacement on aluminium and nickel bump formation were studied. As major results, catalytic nickel site with a good adhesion on bulk aluminium substrate can be formed by the process of nickel displacement plating. A straight-walled nickel bump about 20 μm in width and 15 μm in height may be formed by optimization of nickel displacement plating bath composition and operating conditions. In addition, more uniform nickel bumps can be fabricated on an aluminium substrate by activation with dimethyl amine borane (DMAB) instead of nickel displacement plating.

Gold Wire Bondability of Electroless Gold Plating Using Disulfiteaurate Complex

Abstract: Generally, contact or terminal areas are coated with nickel as a barrier layer; subsequently, gold plating is performed to maintain reliability of electrical interconnection. Treatment using dilute solutions of palladium ions have been applied to initiate electroless nickel plating on copper substrates because copper has no catalytic action for the oxidation of hypophosphite. However, trace amounts of palladium ions may remain on the unwanted areas and extraneous nickel deposits are often observed. We confirmed that nickel films without extraneous deposits can be formed using the activation solutions containing dimethyl amine borane (DMAB). Bondability on the electrolessly deposited gold was greatly influenced by the phosphorus contents of the deposited nickel films as the underlayer. Bonding strength after electroless gold plating was increased with increasing phosphorus contents in the nickel films. Stabilizers in the electroless gold plating also influenced the bonding strength. Baths containing cupferron or potassium nickel cyanide as a stabilizer showed superior bondability. Gold deposits having strong orientation with Au(220) and Au(311) indicated high bond strength.

Sintered material made of calcium phosphite and zeolite powder and its production

Abstract: PURPOSE: To produce a sintered material usable as a structure or a building material by using a calcium phosphite generated from a regenerating treatment of an electroless nickel plating waste liq. CONSTITUTION: This sintered material is produced by mixing and controlling 5-50wt.%, calcium phosphite, 5-50wt.% zeolite powder and a small quantity of the third component, forming the mixture under pressure and sintering within a temp. range of 1000-1200 deg.C. As a result, characteristics excellent in bending strength, minimum in dimentional change and deforming and excellent in water retention and water permeability are obtained, and the material can be used mainly as a burned building material such as tile for pavement, exterior and interior tile.

The effect of nickel salts on electroless nickel plating

Abstract: Nickel chloride, fluoride, bromide, iodide, formate, acetate, sulfamate, fluoborate, borate and sulfate were compared in an acid lactate-acetate electroless nickel plating solution formulation for plating rate and bath stability, as well as nitric acid resistance and hardness of the deposit.

Black matrix and its production

Abstract: PURPOSE: To provide a black matrix which has low reflectivity and with which bright videos are obtainable even in a bright place as well as a process capable of producing this black matrix by a method which is expellent in mass productivity with good accuracy and without using costly equipment. CONSTITUTION: This black matrix consists of a transparent substrate 1, a blackened zinc compd. baking layer 2 and an electroless nickel plating layer 4 formed on this blackened zinc compd. baking layer 2. This process comprises forming the zinc compd. baking layer 2 on the transparent substrate 1 and executing pattern formation as the black matrix by successively bringing this layer into a palladium catalyst liquid and electroless nickel plating liquid after the formation of the zinc compd. baking layer 2 or after the formation of the nickel plating layer 4.

Circuit board, production thereof and probe card employing it

Abstract: PROBLEM TO BE SOLVED: To obtain a circuit board having a conductive layer formed on the surface of an acicular single crystal provided on the circuit formed on the board and a probe card for inspecting a semiconductor using the circuit board which are excellent in long term reliability and applied to the measurement of a semiconductor by bonding the acicular single crystal to the conductive layer through a palladium silicide or a nickel silicide. SOLUTION: A single crystal circuit 2 is made in a thin Si layer 3 formed on an SOI wafer and an acicular single crystal 1 is grown thereon by VLS while arranging the length thereof. It is then cleaned with an aqueous solution containing fluorine and palladium or nickel is deposited thereon. Subsequently, it is heat treated in an atmosphere of inert gas, e.g. nitrogen, hydrogen or argon, or inert vacuum and cleaned with diluted nitric acid in order to remove metal nickel or palladium not yet reacted thus leaving only a silicide 9 on the surface of the acicular single crystal 1 and the single crystal circuit 2 composed of silicon. It is further cleaned with diluted hydrofluoric acid and subjected to electroless nickel plating thus enhancing adhesion of the conductive film to the surface of the acicular single crystal and the single crystal circuit under high temperature.

Electroless nickel-phosphorus-silicon nitride composite plating bath

Abstract: PURPOSE:To obtain an excellent wear-resistant coating film having self- lubricating properties by adding wear-resistant particulate silicon nitride together with mica to an electroless nickel plating bath using sodium hypophosphite as the reducing agent. CONSTITUTION:This plating bath consists essentially of a nickel salt, hypophosphorous acid or its salt, at least one organic compound selected from organic acids and their salts and silicon nitride and further contains mica. The following bath composition is preferred: 0.08 to 0.14mol/l nickel sulfate; 0.16 to 0.3mol/l sodium hypophosphite; 0.1 to 0.2mol/l of the total of at least one compound selected from among malic acid, malonic acid and their salts and at least one compound selected form among succinic acid, propionic acid and their salts; 2 to 5g/l particulate silicon nitride having 0.1 to 0.3mum particle size; and 1.5 to 5g/l mica having 0.5 to 1mum grain size. The plating using this bath is performed at a 80 to 95 deg.C liquid temp. while stirring and after plating, the resulting plated material is subjected to heat treatment at 200 to 600 deg.C for 10min to 3hr.

Electroless nickel plating solutions and methods

Abstract: An electroless nickel plating bath comprising (a) a water-soluble Nickel salt, (b) a reducing agent, (c) a complex former and (d) a compound with a sulphur-to-sulphur bond. A primer coating of Ni may be deposited by immersing the substrate in an electroless Ni plating bath containing no component (d), and then immersing the substrate in a second electroless Ni plating bath containing components (a), (b), (c) and (d). Component (d) is chosen eg from a thiosulphate, dithionate, polythionate, or dithionite.

Paste electrode and alkaline secondary battery

Abstract: PURPOSE: To provide a paste electrode capable of firmly holding an active material and preventing internal short circuit in the manufacture of a spiral electrode group by constituting a conductive substrate with a specified porous body in the specified paste electrode CONSTITUTION: A paste electrode formed by filling paste containing a nickel compound serving as an active material in a conductive substrate In the electrode, the conductive substrate is formed with a metal fiber porous body having the structure in which metal fibers formed by conducting metal plating (example: electroless nickel plating) on a carbon fiber nonwoven fabric made of carbon fibers whose length is 20-30mm and diameter is 10-30μ, and baking are three- dimensionally arranged, and the metal fiber porous body consists mainly of longer than 5mm long fibers, preferably 80 or more volume percent of the porous body is made of these fibers An alkaline secondary battery is formed with a positive electrode 2 made of this paste electrode, a negative electrode 4, a separator 3 interposed between the positive electrode 2 and the negative electrode 4, and an alkaline electrolyte

Hydrogen storage alloy electrode and hydrogen storage alloy particle for metal-hydride alkaline storage battery

Abstract: PURPOSE:To obtain the metal-hydride alkaline storage battery, which has a long lifetime and of which inner pressure is hard to rise so that the activation processing can be finished in a short time, by forming the surface of hydrogen storage alloy particle, which is to be used for the electrode material, with a nickel plating layer, which includes phosphorus of the specific phosphorus CONSTITUTION:Electroless nickel plating, which includes phosphorus at 11-14% by weight, is performed to the surface of a hydrogen storage alloy to be used for a metal-hydride alkaline storage battery so as to form an electroless nickel plating layer on the particle surface of the alloy. This hydrogen storage alloy is used for the manufacture of electrode. Even in the case where charge and discharge cycle is repeated, oxidation and deterioration of the hydrogen storage alloy is hard to be generated. Furthermore, since this nickel plating layer is a porous film, which includes phosphorus at a high rate, charge and discharge reaction is hard to be hindered, and the inner pressure of the battery is hard to rise even in the case of over charge.

Electroless nickel plating bath - containing nickel salt, reducing agent, complexing agent and a compound with sulphur to sulphur bond

Abstract: An electroless nickel plating bath comprising (a) a water-soluble Nickel salt, (b) a reducing agent, (c) a complex former and (d) a compound with a sulphur-to-sulphur bond. A primer coating of Ni may be deposited by immersing the substrate in an electroless Ni plating bath containing no component (d), and then immersing the substrate in a second electroless Ni plating bath containing components (a), (b), (c) and (d). Component (d) is chosen eg from a thiosulphate, dithionate, polythionate, or dithionite.