Showing papers on "Electroless nickel plating published in 2001"

Selective Electroless Nickel Plating on Polyelectrolyte Multilayer Platforms

Abstract: Polyelectrolyte multilayers (PEMs) fabricated by the layer-by-layer adsorption of poly(acrylic acid) (PAA) and poly(allylamine hydrochloride) (PAH) are used to selectively bind palladium catalysts for electroless nickel plating. Depending on the pH conditions used during multilayer processing and the polyelectrolyte adsorbed last, the surface of the PAH/PAA-based multilayers can be tuned to contain primarily PAA, primarily PAH, or a mixture of PAA and PAH functionalities (i.e., carboxylic acids or amines). The palladium-complex ions of tetraaminepalladium chloride (Pd(NH3)4Cl2) or sodium tetrachloropalladate (Na2PdCl4) bind selectively by ion exchange only to surfaces of PAA or PAH, respectively. Substrates that are coated with regions of PAA-topped and PAH-topped multilayers, fabricated at a PAH pH of 7.5 and a PAA pH of 3.5, bind [Pd(NH3)4]2+ only on the PAA regions. Upon immersion into an electroless nickel plating bath, only the PAA-topped regions of the substrate, activated by the Pd complex, promote...

Initial Deposition Mechanism of Electroless Nickel Plating on Magnesium Alloys

Abstract: In this paper, the initial deposition mechanism of electroless nickel plating (EN) on magnesium alloys was studied by X-ray photoelectron spectroscopy (XPS). scanning electron microscopy (SEM) and ...

A study on surface state during the pretreatment of electroless nickel plating on magnesium alloys

Abstract: Changes of the surface state during the pretreatment of electroless nickel plating on magnesium alloys were studied using the weight loss method. scanning electron microscopy (SEM) and X-ray photoe...

Recovery of Nickel from Spent Electroless Nickel Plating Baths by Solvent Extraction Using LIX84I.

Abstract: In order to recover nickel ion in a spent electroless nickel-phosphorus alloy plating bath and, at the same time, to remove impurities such as iron and zinc, the applicability of solvent extraction with LIX84I as the extractant has been investigated using actual spent bath. Although the extraction efficiency of nickel from the spent bath is considerably lower than that from the nickel sulfate-nitrate solution, nickel in the spent bath is selectively extracted with high efficiency (> 99 %) at the pH of 6-7. The extracted nickel is effectively stripped by sulfuric acid at a pH of less than 3. On the basis of these results, a flowsheet for recovering nickel from the spent bath is proposed. Chemical equilibrium calculations of the spent bath have shown that the complexes of nickel with anions such as lactate and phosphonate ions become predominant in the pH range between 2 and 6. This results in the depression of nickel extraction efficiency from the spent bath as compared with that from the nickel sulfate-nitrate solution. By combining these aqueous equilibrium calculations with the extraction equilibrium and the successive aggregation equilibria of the active component of the extractant in the organic phase, the extraction behavior of nickel is quantitatively predicted.

Method for electroless metal plating

Abstract: A method for electroless metal plating of substrates, more specifically with electrically non-conductive surfaces, by which the substrates may be reliably metal plated at low cost under manufacturing conditions as well and by means of which it is possible to selectively coat the substrates to be treated only, and not the surfaces of the racks. The method involves the following steps: a. pickling the surfaces with a solution containing chromate ions; b. activating the pickled surfaces with a silver colloid containing stannous ions; c. treating the activated surfaces with an accelerating solution in order to remove tin compounds from the surfaces; and d. depositing, by means of an electroless nickel plating bath, a layer that substantially consists of nickel to the surfaces treated with the accelerating solution, the electroless nickel plating bath containing at least one reducing agent selected from the group comprising borane compounds.

Forceps for endoscope and manufacturing method of forceps

Abstract: An electroless nickel plating film is formed over a surface of a base material of a forceps piece made of austenitic stainless steel. Thus, the forceps can be chemical resistant. Moreover, since the electroless nickel plating film displays hardness suitable for the forceps as well as superior toughness, an edge can be put on the electroless nickel plating film more easily than a hardened steel that has the same hardness.

Current and emerging technologies for extending the lifetime of electroless nickel plating baths

Abstract: The waste treatment and rejuvenation of spent electroless nickel baths has attracted a considerable amount of interest from electroplating shops, electroless nickel suppliers, universities and regulatory agencies due to the finite life of the baths and the associated waste that the process generates. It is generally accepted that the recycling of electroless nickel solutions is one of the most important challenges facing the electroless nickel-plating industry today. This review presents an overview of the existing and emerging technologies for extending the life of electroless nickel baths. The electroless nickel bath regenerative technologies are appraised from the standpoint of removal of harmful bath components, loss of valuable bath components, cost-effectiveness, secondary waste generation and ease of implementation. The review draws upon an array of academic papers, industrial/company reports, conference proceedings and patents in order to allow the reader to evaluate and compare the different technologies and options for extending the life of electroless nickel-plating solutions.

Method for electroless nickel plating

Abstract: A method for electroless metal plating of substrates, more specifically with electrically non-conductive surfaces, by which the substrates may be reliably metal plated at low cost under manufacturing conditions as well and by means of which it is possible to selectively coat the substrates to be treated only, and not the surfaces of the racks. The method involves the following steps: a. pickling the surfaces with a solution containing chromate ions; b. activating the pickled surfaces with a silver colloid containing stannous ions; c. treating the activated surfaces with an accelerating solution in order to remove tin compounds from the surfaces; and d. depositing, by means of an electroless nickel plating bath, a layer that substantially consists of nickel to the surfaces treated with the accelerating solution, the electroless nickel plating bath containing at least one reducing agent selected from the group comprising borane compounds.

Method for treating aged electroless nickel plating liquid

Abstract: PROBLEM TO BE SOLVED: To provide a method for greatly reducing discharge of waste water, by selectively removing phosphite ions accumulating in an electroless nickel plating liquid and reusing the liquid. SOLUTION: This method comprises steps of making an aged electroless nickel plating liquid contact with hydrotalcites, and making the hydrotalcites receive the phosphite ions from the aged liquid, to remove or reduce the phosphite ions in the aged liquid; separating the hydrotalcites; precipitating and separating metal ions in the liquid by neutralizing the liquid after the separation; cooling the liquid after the separation; separating precipitated sodium sulfate from the liquid; and obtaining the usable electroless nickel plating liquid by replenishing the separated liquid with nickel ions, sulfate ions, and organic acid ions. COPYRIGHT: (C)2003,JPO

Method for deposition of electroless plating film

Abstract: PROBLEM TO BE SOLVED: To provide a method for depositing an electroless plating film of uniform film thickness onto pad electrodes of a semiconductor substrate without applying plating resist to the back and sides of the semiconductor substrate. SOLUTION: A zinc immersion film 23 is deposited by using a zinc immersion process onto the pad electrode 21. After washed with pure water, the semiconductor substrate 15 as a substrate to be plated is immersed in an oxidation- reduction type electroless nickel plating solution using a nickel-plated stainless- steel bar as a counter electrode 12 and using this counter electrode 12 as a negative electrode while applying a minute positive potential to the semiconductor substrate 15. By this method, a bump 16 composed of an electroless nickel plating film of uniform film thickness can be formed on a plurality of pieces of the pad electrode 21 while obviating the necessity of the application of plating-resist to the back and sides of the semiconductor substrate 15.

Method for measuring concentration of sulfur-containing compound in electroless nickel plating solution

Abstract: PROBLEM TO BE SOLVED: To provide a method for measuring the concentration of a sulfur- containing compound in an electroless nickel plating solution. SOLUTION: The method for measuring the concentration of a sulfur- containing compound in an electroless nickel plating solution includes a stage (1) where a metallic coupon is subjected to immersion treatment to an electroless nickel plating solution containing a sulfur-containing compound, or a diluted solution thereof, and a stage (2) where the metallic coupling subjected to the above treatment is immersed into a palladium-containing solution, and the change of the surface of the metallic coupon is measured. By the same method, the concentration of the sulfur-containing compound in the plating solution can swiftly and easily be measured with high precision. Further, the control of the plating solution is also made more highly precise, and more efficient by using the measuring method.

Method of manufacturing stamper

Abstract: PROBLEM TO BE SOLVED: To manufacture a master stamper of an optical disk which is small in surface roughness and is reduced in noise by omitting a process step of developing a photoresist after exposure. SOLUTION: An organic dry film used for the photoresist or holography is applied at about 100 to 500 nm on an optical glass master disk and the optical glass master disk is exposed by using CW lasers, such as from 257 nmAr times waves, 266 nmYAG quaternary harmonics, 351 nmAr lasers and 413 nmKr lasers. Only the polymers of the segments exposed by the lasers are shrunk by the exposure treatment and the fine rugged patterns are formed. A conductive film is thereafter formed at about 50 nm on the master disk formed with such fine rugged patterns by electroless nickel plating or nickel sputtering, etc., without undergoing a developing process and the stamper is so manufactured by nickel electroplating as to attain a thickness of about 300 μm. COPYRIGHT: (C)2003,JPO

Electrode formed with electroless multilayer plating film thereon, and its manufacturing method

Abstract: PROBLEM TO BE SOLVED: To provide an electrode on a semiconductor wafer, in which dispersion of film thickness among the electrodes is inhibited and which has high adhesion to the surface of an electrode base section, and in which films having high bond strength are formed among the wafer and other electronic components, and to provide a manufacturing method of the electrode. SOLUTION: The electrode on the semiconductor wafer, in which an electroless nickel plating film, an electroless palladium plating film and an electroless gold plating film are formed on the surface of the electrode base section in this order, is manufactured. The surface of the electrode base section on the semiconductor wafer is plated with the electroless nickel-plating film, the electroless palladium plating film and the electroless gold plating film in this order.

Reductive activation treating solution for electroless nickel plating and method for producing printed circuit board using same

Abstract: PROBLEM TO BE SOLVED: To produce a reductive activation treating solution for depositing a nickel-gold plating film suppressed in the generation of the unevenness of whiteness and excellent in reliability on packaging and to provide a method for producing a printed circuit board using same. SOLUTION: This solution is obtained by dissolving a reducing agent into an aqueous solution of an inorganic base, particularly the reducer is composed of sodium hypophosphite or potassium hypophopshite, the aqueous solution of an inorganic base is the one in which hydroxide composed of sodium hypophosphite or potassium hypophosphite is dissolved, and pH is controlled to 9 to 13.

Electroless nickel plating bath

Abstract: PROBLEM TO BE SOLVED: To prevent deterioration in the wettability of solder and the generation of cracking or the like in a nickel plating film caused by the reduction of the purity of nickel in the film SOLUTION: This electroless nickel plating bath contains nickel salt as a metal feeding source consisting essentially of at least one kind of nickel acetate and nickel chloride, a reducing agent composed of hydrazine and at least one kind among saccharin, the salt thereof and formalin

Material for build-up wiring board and method for producing printed wiring board using it

Abstract: PROBLEM TO BE SOLVED: To provide a material for build-up wiring board, and a production method of printed wiring board, in which fine pattern wiring is facilitated while utilizing the conventional characteristics and abnormal deposition of electroless nickel plating and electroless gold plating is eliminated. SOLUTION: On the surface of a metal foil, a first resin layer containing no filler is provided under the state of stage C or B and a second resin layer containing a filler is provided thereon in stage B or A to produce a material for build-up wiring board. The second resin layer of the build-up wiring board is placed directly on the surface of an inner layer board and hot pressed integrally. Subsequently, a metal foil is removed and a part for connecting an inner layer circuit electrically with a circuit formed on the surface of the first resin layer is irradiated with laser thus making a non-through hole reaching the inner layer circuit. Thereafter, a plating metal layer is formed on the surface of the first resin layer and the inner wall of the non-through hole, an etching resist layer is formed on the surface of the plating metal layer and then the unnecessary plating metal layer is removed by etching.

Electrode forming method of semiconductor element

Abstract: PROBLEM TO BE SOLVED: To provide a method for forming a highly reliable protruding electrode by an electroless plating method without corroding any aluminum electrode. SOLUTION: After removing an oxide film 13 present on an aluminum electrode 11, primary zinc particles 14 are so substituted for aluminum as to deposit them on the aluminum electrode 11. Then, a processed object is so dipped into an alkali solution hydroxide containing palladium as to form a palladium- activated film 16. Next, after so dipping the processed object into a weak acid solution as to remove palladium adsorbed in unnecessary portions, the processed object is so dipped into oxidation-reduction type electroless nickel plating liquid as to grow a nickel deposition 17 on the palladium-activated film 16. By dipping the processed object into the electroless nickel plating liquid in a predetermined time, a nickel protruding electrode 18 can be obtained. COPYRIGHT: (C)2002,JPO

Wiring board, method and device for producing wiring board

Abstract: PROBLEM TO BE SOLVED: To provide a metal plated film with which satisfactory solder bonding can be provided, by replacing a nickel oxide film generated in substituting gold plating with electrolytic flash gold plating process by solving a problem that an interface break occurs due to the nickel oxide film in the case of solder bonding. SOLUTION: After electroless nickel plating to an electroless wiring board, electrolytic flash gold plating is combined while using a dedicated metal plating device so that satisfactory solder bonding can be obtained.

Sliding material for compressor

Abstract: PROBLEM TO BE SOLVED: To provide a sliding material satisfying both of hardness and separation resistance. SOLUTION: A shoe 76 of a compressor is prepared by forming a Ni-P electroless nickel plating layer on an aluminum alloy base material, and further forming a Ni-P-B electroless nickel plating layer on the Ni-P plating layer. The Ni-P-B plating layer has a content of phosphor of 0.5-5.0 wt.%, and a content of boron of 0.05-0.2 wt.%, and is free from heat treatment. In a scratch test, crackings are not caused from scratched marks 210, 212 with respect to a test piece 200 of the Ni-P-B plating layer free from heat treatment, but the crackings 220, 222 are caused in a state of being extended from the scratched marks 214, 216 on a surface of a test piece 202 on which heat treatment is performed. Without performing heat treatment, the impairing of the deforming performance of the plating layer can be prevented, and a hard layer 152 is hardly separated even when the scratched mark is caused by the intrusion of a foreign matter between the shoe and a piston or a swash plate. COPYRIGHT: (C)2003,JPO

Method for preparing electroless nickel plating replenisher and plating solution

Abstract: PROBLEM TO BE SOLVED: To provide a method for preparing an electroless nickel plating replenisher and a plating solution from an electroless nickel plating waste solution. SOLUTION: This method for preparing an electroless nickel plating replenisher from a nickel-containing electroless plating waste solution has an extracting stage (i) in which an oily liquid containing a nickel extracting agent is brought into contact with the waste solution, and nickel in the waste solution is extracted into the oily liquid, (ii) a stripping stage in which an aqueous solution containing acidic substance is brought into contact with the oily liquid, and nickel in the oily liquid is stripped into the aqueous solution, and (iii) a nickel concentration controlling stage in which a nickel compound is added to the aqueous solution, and the concentration of nickel is controlled to the prescribed one.

Electroless nickel plating solution

Abstract: PROBLEM TO BE SOLVED: To provide a stabilizing agent for electroless nickel-plating, which imparts adequate stability to an electroless nickel-plating solution without aggravating the depositing properties of an electroless nickel-plating solution, and is made of a highly safe material. SOLUTION: The electroless nickel-plating solution includes a phosphine compound expressed by the following general formula, as the stabilizing agent: (wherein R 1 , R 2 and R 3 , are each the same or different, represent a monovalent aliphatic hydrocarbon group which may have a substituent group, an aryl group which may have a substituent group, or a heterocyclic group which may have a substituent group). COPYRIGHT: (C)2006,JPO&NCIPI

Treatment process for electroless nickel plating waste solution

Abstract: PROBLEM TO BE SOLVED: To provide a treatment process for an electroless nickel plating waste solution, by which phosphorus being in the form of hypophosphorous acid, phosphorous acid, and/or the like, in the waste solution can surely be precipitated and removed in a high removal ratio even when a comparatively small amount of an oxidizing agent is added. SOLUTION: This treatment process comprises: adjusting the pH of an electroless nickel plating waste solution to 5.5-9; then, heating the pH-adjusted waste solution to 90-110 deg.C to oxidize hypophosphorous acid into phosphorous acid; thereafter, adding a calcium source to the resulting solution while maintaining the pH of the solution at 11-12, to precipitate the phosphorus acid as its calcium salt and to remove the calcium salt from the solution; and further oxidizing phosphorous acid remaining in the residual waste solution with ozone or the like, into orthophosphoric acid, to precipitate the orthophosphoric acid as its calcium salt and to remove the calcium salt from the residual solution; wherein prior to the phosphorus precipitation/removal stage, nickel ion can be precipitated and removed by adding an alkaline substance other than calcium salts to the solution.

Electroless nickel plating method to object to be plated which has blind hole

Abstract: PROBLEM TO BE SOLVED: To provide an electroless nickel plating method which is capable of forming sufficient electroless nickel plating layers even within the blind holes of an object to be plated which has the blind holes SOLUTION: This method performs electroless nickel plating by immersing the object to be plated which has the blind holes into an electroless nickel plating liquid of a first stage and filling the blind holes with the electroless nickel plating liquid, then immersing the object to be plated in an electroless nickel plating liquid of a second stage in the state that the electroless nickel plating liquid remains in the blind holes, in which the electroless nickel plating liquid of the first stage contains a nickel compound at ≥015 mol/l and a pH buffering agent at ≥025 mol/l COPYRIGHT: (C)2002,JPO

Multilayer plated nd-fe-b based magnet and its manufacturing method

Abstract: PURPOSE: A multilayer plated Nd-Fe-B based magnet and its manufacturing method are provided to improve the corrosion resistance and the uniform electrodeposition and the adhesion by plating Nd-Fe-B based magnet with the nickel and the copper. CONSTITUTION: The Nd-Fe-B based magnet is plated with nickel having thickness of 1 to 5 micrometer, and then copper having thickness of 5 to 10 micrometer is plated on the nickel plated Nd-Fe-B based magnet. The manufacturing method includes the steps of an electrical plating of nickel on the Nd-Fe-B based magnet, an electrical plating of copper on the nickel plated Nd-Fe-B based magnet, and an electroless nickel plating on the copper plated Nd-Fe-B based magnet with nickel having thickness of 10 to 20 micrometer. The electrical plating of nickel having thickness of 1 to 5 micrometer provides the adhesion. When the thickness is less than 1 micrometer, the adhesion between the plated nickel and the magnet decreases. When the thickness exceeds the 5 micrometer, the stress of a plated layer increases. The electrical plating with copper improves the corrosion resistance and removes the stress. The electroless nickel plating enhances the uniform electrodeposition.