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Showing papers on "Electroless nickel plating published in 2003"


Patent
Howard R. Test1
06 Aug 2003
TL;DR: In this article, an improved wire bonding process for copper-metallized integrated circuits is provided by a nickel layer that acts as a barrier against up-diffusing copper, and the nickel bath is placed and remains in hydrogen saturation by providing a piece of metal that remains in the nickel plating tank before and during the plating process.
Abstract: An improved wire bonding process for copper-metallized integrated circuits is provided by a nickel layer that acts as a barrier against up-diffusing copper. In accordance with the present invention the nickel bath is placed and remains in hydrogen saturation by providing a piece of metal that remains in the nickel plating tank before and during the plating process.

163 citations


Journal ArticleDOI
TL;DR: In this paper, a simple and controlled method, that is, by electroless plating, nickel has been deposited on the surfaces of silicon carbon nanoparticles, and the deposited nickel and silicon carbide nanoparticles are bound tightly.
Abstract: By a simple and controlled method, that is, by electroless plating, nickel has been deposited on the surfaces of silicon carbon nanoparticles. Energy dispersive spectrometry (EDS) spectra show that pre-treatments of the silicon carbide nanoparticles have an important influence on the effect of electroless nickel plating. Transmission electron microscopy images and EDS spectra of silicon carbide nanoparticles before and after electroless nickel plating reveal that nickel has been deposited on the surface of silicon carbide nanoparticles and the deposited nickel and silicon carbide nanoparticles are bound tightly.

77 citations


Journal ArticleDOI
TL;DR: In this article, a two-step electroless nickel plating method was proposed for complex 3D microstructures with sub-micron resolution, where charged Pd catalyst complexes were first deposited on oppositely charged functional surfaces, and then were reduced to elemental nickel selectively where the Pd complex was deposited on the surface.
Abstract: Selective electroless nickel plating was demonstrated at the micron scale on 3-D surface microstructures using a two-step method. The 3-D patterned and functional surface microstructures consisted of microparticles, polyelectrolyte multilayers, and self-assembled monolayers, which were built by microcontact printing and directed self-assemblies of polyelectrolytes and particles. Selectively nickel-plated surfaces were characterized with optical microscopy, X-ray photoelectron spectroscopy, scanning electron microscopy, and energy-dispersive X-ray spectroscopy. Charged Pd catalyst complexes were first deposited on oppositely charged functional surfaces, and then were reduced to elemental nickel (0) selectively where the Pd complex was deposited on the surface. In this work, it was demonstrated that selective electroless nickel plating on complex 3-D microstructures with submicron resolution could be achieved using a two-step electroless plating method.

71 citations


Journal ArticleDOI
TL;DR: In this article, tetraaminepalladium nanoparticles within polyelectrolyte multilayers of poly(allylamine hydrochloride) (PAH) and poly(acrylic acid) (PAA) were prepared as seeds for further growth by electroless nickel deposition.
Abstract: Palladium nanoparticles within polyelectrolyte multilayers of poly(allylamine hydrochloride) (PAH) and poly(acrylic acid) (PAA) were prepared as seeds for further growth by electroless nickel deposition. The seeds were generated by binding tetraaminepalladium from aqueous solution to PAA carboxylic acid functionalities in the polymer film and subsequent reduction. Nickel was electrolessly deposited on the small, 2-nm-diameter catalytic particles. By manipulation of the rate and duration of the electroless deposition, a nickel shell of arbitrary thickness could be grown; up to 14-nm-diameter particles were obtained. Elemental analyses showed that the composition of the electrolessly deposited material, nickel with several weight percent boron, was similar to that obtained from macroscopic surface electroless nickel plating. The electroless chemistry facilitated control over nanoparticle size independent of the process of nanoparticle nucleation and hence particle concentration.

63 citations


Journal ArticleDOI
TL;DR: A one-dimensional diffusion model is proposed to explain the dependence of the bath stability on the plating time under different bath loadings and an adsorption model was created to describe the temperature effect.

43 citations


Patent
George Edward Shahin1
13 May 2003
TL;DR: In this paper, aqueous electroless nickel plating solution based on nickel salts of alkyl sulfonic acids as the source of nickel ions is described. But the plating solutions are free of added nickel hypophosphite, and free of alkali or alkaline earth metal ions capable of forming an insoluble orthophosphate.
Abstract: This invention relates to aqueous electroless nickel plating solutions, and more particularly, to nickel plating solutions based on nickel salts of alkyl sulfonic acids as the source of nickel ions. The plating solutions utilize, as a reducing agent, hypophosphorous acid or bath soluble salts thereof selected from sodium hypophosphite, potassium hypophosphite and ammonium hypophosphite. The electroless nickel plating solutions of the invention are free of added nickel hypophosphite, and free of alkali or alkaline earth metal ions capable of forming an insoluble orthophosphite.

40 citations


Journal ArticleDOI
TL;DR: In this article, the authors investigated the effect of some of the most important operating parameters on the formation of intrinsic stress during plating and found that the intrinsic stress was probably related to the Ni-P microstructure as a result of the deposition rate.
Abstract: With the increasing application of electroless nickel (EN) as a bumping or under-bumping metalization material, the microelectronic packaging engineers are required to have a deeper understanding and control of intrinsic stress in EN plating. The purpose of this work is to investigate the effect of some of the most important operating parameters on the formation of intrinsic stress during plating. The analysis of variances method was applied to obtain both single effects and compound effects of selected factors. Results indicate that high pH value and aged solution affect the intrinsic stress significantly, while surface roughness does not have much influence on the intrinsic stress for the range investigated. Aging at 190 °C for 170 h changes neither the Ni–P structure nor the intrinsic stress to a significant degree. Further investigation indicated that the intrinsic stress was probably related to the Ni–P microstructure as a result of the deposition rate. It was found that the higher the deposition rate, the higher the intrinsic stress.

36 citations


Journal ArticleDOI
TL;DR: The increase in pH promoted by metabolic activity of some microbial components is likely to promote nickel desolubilisation by others, and the definitive role of specific components of the mixed population is undefined.
Abstract: Efficient removal of dissolved nickel was observed in a biologically active moving-bed `MERESAFIN' sand filter treating rinsing water from an electroless nickel plating plant. Although nickel is fully soluble in this waste water, its passage through the sand filter promoted rapid removal of approximately 1 mg Ni/l. The speciation of Ni in the waste water was modelled; the most probable precipitates forming under the conditions in the filter were predicted using PHREEQC. Analyses of the Ni-containing biosludge using chemical, electron microscopical and X-ray spectroscopic techniques confirmed crystallisation of nickel phosphate as arupite (Ni3(PO4)2.8H2O), together with hydroxyapatite within the bacterial biofilm on the filter sand grains. Biosorption contributed less than 1% of the overall sequestered nickel. Metabolising bacteria are essential for the process; the definitive role of specific components of the mixed population is undefined but the increase in pH promoted by metabolic activity of some microbial components is likely to promote nickel desolubilisation by others.

34 citations


Patent
25 Apr 2003
TL;DR: In this article, the authors proposed a method of producing a flexible printed circuit board where, even in the case electroless nickel plating is applied to both the faces of a polyimide resin film, the content of moisture remaining in the polyimides resin film is reduced, and also, the thickness of the electroless Nickel plated layer can be increased.
Abstract: PROBLEM TO BE SOLVED: To provide a method of producing a flexible printed circuit board where, even in the case electroless nickel plating is applied to both the faces of a polyimide resin film, the content of moisture remaining in the polyimide resin film is reduced, and also, the thickness of the electroless nickel plated layer can be increased. SOLUTION: First, a thin first nickel plated layer 2a is formed on both the faces of a polyimide resin film 1 by electroless nickel plating, and is thereafter dried. Next, a second nickel plated layer 2b is formed on the surface of the thin first nickel plated layer 2a by electroless nickel plating or nickel electroplating. Thereafter, a copper plated layer 3 for forming a circuit is formed on the surface of the second nickel plated layer 2b. COPYRIGHT: (C)2005,JPO&NCIPI

22 citations


Patent
11 Sep 2003
TL;DR: In this article, the authors proposed a new electroless nickel plating liquid which contains an alkylene diamine compound which is expressed by a general formula (I), in which each atom is a hydrogen atom or a group (in the formula, Ris a straight-chain or branched-chain group having carbon atoms of 1-5, and m denotes an integer of 1 -10).
Abstract: PROBLEM TO BE SOLVED: To provide a new electroless nickel plating liquid enabling a nickel plating film having excellent folding resistance to be deposited.SOLUTION: The electroless nickel plating liquid contains an alkylene diamine compound which is expressed by general formula (I). In the formula (I), R, R, Rand Rare identical to or different from one another, and each is a hydrogen atom or a group (in the formula, Ris a straight-chain or branched-chain alkylene group having carbon atoms of 1-5, and m denotes an integer of 1-10), and n is 2 or 3.

14 citations


Journal ArticleDOI
TL;DR: In this paper, an electroless plating process was used to add phosphorus to Fe-50 wt.% Ni in order to increase the density and grain size, which was beneficial to magnetic performance.
Abstract: Phosphorus was added to Fe-50 wt.% Ni in the form of a coated composite powder via an electroless plating process. Addition of phosphorus to Fe-50 wt.% Ni facilitated increases in density and grain size, both of which were beneficial to magnetic performance. Because of the homogeneous distribution of phosphorus in the powder, the optimal phosphorus addition was much lower than for those using Fe3P as the phosphorus precursor. The optimal phosphorus addition was close to its maximum solubility in Fe-50 wt.% Ni (about 0.5 wt.%), above which precipitation of excessive phosphorus in the form of iron nickel phosphide, (Fe,Ni)3P, effectively degraded the magnetic properties of Fe-50 wt.% Ni. Without the addition of phosphorus, good magnetic properties could be achieved only when the sintering temperature was high enough (>1200 °C) to result in a high sintered density and large grains in the sintered structure.


Patent
30 Jul 2003
TL;DR: In this paper, a method of connecting an electronic part with an electroless nickel plating coat containing phosphorous on a substrate metal layer which constitutes a connecting terminal of an electronic component was proposed.
Abstract: A method of connecting an electronic part, containing: forming an electroless nickel plating coat containing phosphorous on a substrate metal layer which constitutes a connecting terminal of an electronic part; and carrying out connecting to the nickel plating coat through a lead-free solder, wherein a half-width of X-ray diffraction of a (111) plane of Ni crystal in the nickel plating coat is 5 degrees or less.

Journal ArticleDOI
TL;DR: In this paper, a new electroless nickel plating technique was described which eliminates the conventional use of palladium catalyst, using a physical vapor deposition technique, layers of carbon and zinc of approximately 10 and 20 nm thickness, respectively, were deposited onto an ABS resin substrate on which had previously been adsorbed a colloidal mixed hydroxide containing nickel ions and copper ions.
Abstract: A new electroless nickel plating technique is described which eliminates the conventional use of palladium catalyst. Using a physical vapor deposition technique, layers of carbon and of zinc of approximately 10 and 20 nm thickness, respectively, were deposited onto an ABS resin substrate on which had previously been adsorbed a colloidal mixed hydroxide containing nickel ions and copper ions. The electrons released by the oxidative dissolution of the zinc layer into the plating solution were utilized to reduce the colloids to metallic nickel and copper, which served as an anchor for the subsequently plated nickel films. The peeling strengths of the electroless nickel films resulting from the application of this technique were in the order of 200 kg/m, in contrast to values of approximately 220 kg/m obtained using a conventional tin (2+) sensitizer and palladium (2+) activator.

Journal ArticleDOI
TL;DR: In this article, the possibility of removing and recovering nickel from the rinse water with di(2−ethylhexyl)phosphoric acid-impregnated supports (D2EHPA•IS) was explored.
Abstract: Electroless nickel plating technology is playing an increasingly important and indispensable role in many fields such as the electronic and automobile industries. As a result, the treatment of the rinse water containing about 50 mg/dm3 of nickel is becoming a serious environmental problem. Although this water is currently treated by the conventional precipitation method, a method without sludge generation is highly desired. This study explores the possibility of removing and recovering nickel from the rinse water with di(2‐ethylhexyl)phosphoric acid‐impregnated supports (D2EHPA‐IS). Macroporous polymer and oil adsorbents made of synthetic and natural fibers as the supporting materials were tested for the nickel removal abilities from simulated rinse water. In the batch experiments, more than 90% of the nickel can be adsorbed by these D2EHPA‐IS without pH adjustment. The adsorption of nickel reaches the equilibrium within 1.2 ks at 298K at a shaking rate of 140 rpm. The pH‐dependency of the nickel...

Patent
10 Apr 2003
TL;DR: In this paper, a method for extracting and recovering nickel from a nickel-containing aqueous solution such as used electroless nickel plating solution is proposed. But this method requires the extraction of the nickel from an organic solvent containing β-hydroxyoxime-based extracting agent and acidic organic phosphorus compound.
Abstract: PROBLEM TO BE SOLVED: To provide a method for efficiently extracting and recovering nickel from a nickel-containing aqueous solution such as used electroless nickel plating solution. SOLUTION: Nickel is recovered by bringing an organic solvent containing β-hydroxyoxime-based extracting agent and acidic organic phosphorus compound into contact with the nickel-containing aqueous solution and extracting the nickel into the organic solvent phase. COPYRIGHT: (C)2005,JPO&NCIPI

Journal ArticleDOI
TL;DR: A comparison experiment was designed and carried out to study the influence of electroless nickel plating on ZnO-based ceramic varistors as mentioned in this paper, and it was found that the influence was not caused by permeation of the plating solution; instead, it was directly related to nickel deposition.
Abstract: A comparison experiment was designed and carried out to study the influence of electroless nickel plating on ZnO-based ceramic varistors. It was found that the influence was not caused by permeation of the plating solution; the influence was directly related to nickel deposition. It is proposed that adsorbed hydrogen atoms generated in electroless plating can diffuse into ZnO ceramic varistors and undergo a reduction reaction with them, which result in a substantial increase in the leakage current of the varistors. Some implications for the influence of electroplating on I–V characteristics and for the long-term degradation of ZnO varistors are also discussed, in which much attention is paid to the reduction reaction of atomic hydrogen generated by electrolysis of water.


Journal ArticleDOI
TL;DR: In this paper, organic additives to electroless plating baths are shown to affect the surface reaction by changing the catalytic activity of the surface and the presence of a thioketone group in the additive increases the surface activity.
Abstract: Organic additives to electroless plating baths are shown to affect the surface reaction by changing the catalytic activity of the surface. The presence of a thioketone group in the additive increases the surface activity, which results in acceleration of the target reaction. The presence of the iminogroup favors the formation of complexes and alters the rates of concurrent reactions, which weakens the surface activity. The reaction in the volume is governed by the inhibiting properties of additives dependent on the identity of functional groups. The greater the electron-donor properties of the additive, the higher their adsorbability and the stronger the blocking effect, which stabilizes the electrolyte.

Patent
12 Aug 2003
TL;DR: In this paper, a flexible printed circuit board manufacturing method with which activation of a surface can be omitted when electroless nickel plating is applied to a polyimide resin film, and the adhesion reliability of an electroless Nickel Plating layer to a copper plating layer deposited on a surface thereof can be enhanced, and a base material for a circuit to be used therefor.
Abstract: PROBLEM TO BE SOLVED: To provide a flexible printed circuit board manufacturing method with which activation of a surface can be omitted when electroless nickel plating is applied to a polyimide resin film, and the adhesion reliability of an electroless nickel plating layer to a copper plating layer deposited on a surface thereof can be enhanced, and a base material for a circuit to be used therefor. SOLUTION: Electroless nickel plating is applied to the surface of a polyimide resin film 1. Electrolytic copper plating or electroless copper plating is applied to the surface of an electroless nickel plating layer 2 while maintaining wetness of the surface of the electroless nickel plating layer 2, and a thin copper plating layer 3 of 0.1-1.0μm thick is deposited thereby to manufacture the base material A for the circuit. Thereafter, a thick electrolytic copper plating layer 4 for forming the circuit is deposited on the surface of the thin copper plating layer 3. COPYRIGHT: (C)2005,JPO&NCIPI

Journal ArticleDOI
TL;DR: In this paper, an electroless nickel plating solution in which titanium ion redox system, Ti 3+ →Ti 4+ +e −, was used as a reducing agent was developed and the stability of the solution has been improved by the selection of chelating agents and their ratio to nickel and titanium ion.
Abstract: We have developed an electroless nickel plating solution in which titanium ion redox system, Ti 3+ →Ti 4+ +e − , was used as a reducing agent. The stability of the solution has been improved by the selection of chelating agents and their ratio to nickel and titanium ion, and by the addition of an amino acid and a sulfur-containing compound. A pure nickel film containing no phosphorus was obtained from the new electroless plating solution. Any other elements except nickel were not detected by inductively coupled plasma analysis. Electrolytic regeneration system of the solution has been also developed. Continuous running test for more than 100 h has been achieved in a pilot plant and the bath is believed to be stable enough to apply to a commercial production line.

Patent
15 Jan 2003
TL;DR: In this article, a method for preparing the pretreatment solution for electroless nickel plating onto copper or copper alloy is characterized by previously mixing or reacting a silane coupling agent containing a functional group having a metal capturing ability in one molecule with a noble metal compound at the weight ratio satisfying the following coequality.
Abstract: PROBLEM TO BE SOLVED: To provide a pretreatment solution which can reduce frequency of making up a catalyst solution used for electroless nickel plating onto copper or copper alloy. SOLUTION: The method for preparing the pretreatment solution for electroless nickel plating onto copper or copper alloy is characterized by previously mixing or reacting a silane coupling agent containing a functional group having a metal capturing ability in one molecule with a noble metal compound at the weight ratio satisfying the following coequality; 1/10< a silane coupling agent/a noble metal compound <5/1.

Patent
12 Mar 2003
TL;DR: In this paper, an electroless nickel plating method for a magnesium alloy material was proposed. But the plating process was performed using a weakly alkaline electroless bath.
Abstract: PROBLEM TO BE SOLVED: To form a plating film with high quality and high performance, by simplifying a surface treatment process in a direct electroless nickel plating method for a magnesium alloy material SOLUTION: This method includes a pretreatment step of etching the magnesium alloy material with chromic acid after degreasing, and then pickling or activating it, and an electroless nickel plating step, which is immediately performed after the pretreatment by using of a weakly alkaline electroless bath, to form a single layer of the plated film In the above steps, the etchant is an aqueous solution containing chromic anhydride, an inorganic acid salt, and a fluoride, the pickling solution or the activation agent is an aqueous solution containing an inorganic phosphate and a fluoride, and the electroless nickel plating solution contains nickel oxycarboxylate, a pyrophosphate, a hypophosphite and a fluoride, and is adjusted to pH in weak alkalinity with ammonia water

Patent
05 Dec 2003
TL;DR: In this article, the electroless nickel substituted gold plating treatment method comprises forming the nickel plating layer of -560 mV or more in the oxidation reduction potential of its surface in the aqueous alkaline solution on a substrate to be plated, then subjecting the surface of the nickel plate to gold plate treatment.
Abstract: PROBLEM TO BE SOLVED: To provide an electroless nickel substituted gold plating treatment layer having high solder connection reliability, an electroless nickel plating solution, and electroless nickel substituted gold plating treatment method. SOLUTION: The electroless nickel substituted gold plating treatment layer is obtained by subjecting the surface of a nickel plating layer of -560 mV or more in the oxidation reduction potential of its surface in an aqueous alkaline solution to the gold plating treatment. The electroless nickel plating solution used in the case of forming the nickel plating layer contains a nickel salt, a reducing agent, a complexing agent and a stabilizer as essential components. The electroless nickel substituted gold plating treatment method comprises forming the nickel plating layer of -560 mV or more in the oxidation reduction potential of its surface in the aqueous alkaline solution on a substrate to be plated, then subjecting the surface of the nickel plating layer to gold plating treatment. COPYRIGHT: (C)2005,JPO&NCIPI

Patent
08 Aug 2003
TL;DR: In this paper, the problem of preventing the fixation of a core bar and a rubber layer without performing a special treatment such as a chromic acid treatment to an electroless nickel plating surface was addressed.
Abstract: PROBLEM TO BE SOLVED: To prevent the fixation of a core bar and a rubber layer without performing a special treatment such as a chromic acid treatment to an electroless nickel plating surface, in a rubber roller having the rubber layer cross-linked on the core bar having electroless nickel plating by at least sulfur or a sulfur-containing compound, and manufactured through a process for removing a non-adhesion part of the rubber layer. SOLUTION: In this rubber roller having the plating layer formed on the core bar by an electroless nickel plating method, and the rubber layer formed on the plating layer and cross-linked by at least sulfur or the sulfur-containing compound, in a state that an exposed part free from the rubber layer is formed on a part of the core bar, the rubber layer and the exposed part are formed by removing a rubber layer part formed on the exposed part, with a part including at least a part of an uppermost layer of the plating layer composed of at least two layers, after successively forming the plating layer composed of at least two layers and the rubber layer in this order on a part on which the rubber layer and the exposed part are to be formed, of the core bar. COPYRIGHT: (C)2005,JPO&NCIPI

Journal Article
TL;DR: In this paper, a new process of electroless plating of nickel on glass substrate without using conventional palladium choride solution activator has been developed, which consists of nickel acetate, citric acid, and methanol.
Abstract: A new process of electroless plating of nickel on glass substrate without using conventional palladium choride solution activator has been developed. The activation solution consists of nickel acetate, citric acid, and methanol. Heat treatment process of activation solution has been monitored by DTA TGA and XRD. The results show that the activation solution was completely decomposed into hexagonal Ni and cubic NiO at 310 ℃. The amorphous electroless deposits was determined by XRD and it contains Ni 88 4% and P 11 6%(mass fraction) by chemical analysis.

Patent
06 Nov 2003
TL;DR: In this paper, a plating method for manufacturing the desired electronic parts comprises subjecting an article to be plated, which has a Cu electrode formed on the surface, to steps between a degreasing step 11 and a rinsing step 14; giving a palladium catalyst in a catalyst-giving step 15; then promptly sending it to a catalystcleaning step 16 without carrying out rinsings; cleaning the catalyst in the catalyst-cleaning process 16 with a catalyst cleaning agent containing, for instance, chloride ions and ammonium ions to selectively wash out the pall
Abstract: PROBLEM TO BE SOLVED: To efficiently form a desired plating film only on a portion to be plated. SOLUTION: This plating method for manufacturing the desired electronic parts comprises subjecting an article to be plated, which has a Cu electrode formed on the surface, to steps between a degreasing step 11 and a rinsing step 14; giving a palladium catalyst in a catalyst-giving step 15; then promptly sending it to a catalyst-cleaning step 16 without carrying out rinsing; cleaning the catalyst in the catalyst-cleaning step 16 with a catalyst-cleaning agent containing, for instance, chloride ions and ammonium ions to selectively wash out the palladium catalyst directly adhering to a ceramic workpiece except the Cu electrode; and then subjecting it to a rinsing step 17 → an electroless nickel plating step 18 → a rinsing step 19 → a dilute acid treatment step 20 →a rinsing step 21 → an Au displacement plating step 22 and a rinsing step 23. COPYRIGHT: (C)2004,JPO

Journal ArticleDOI
TL;DR: In this paper, the effect of different grades (20, 15, 10, 7 and 5%) and types (irregular and regular) of porosity of iron powder metallurgy compacts, on the properties of the electroless nickel coating: thickness, composition, deposition rate, microhardness, porosity, adhesion and corrosion resistance.
Abstract: Electroless coatings are obtained by means of an autocatalytic chemical reduction process for depositing different metals. Electroless nickel plating is an engineering coating, normally used for its excellent corrosion and wear resistance. Little information exists about the application of this type of coating on powder metallurgy products, compared with the large amount of data available on coatings on wrought metal products by means of the same technique. The present paper discusses the effect of the different grades (20, 15, 10, 7 and 5%) and types (irregular and regular) of porosity of iron powder metallurgy compacts, on the properties of the electroless nickel coating: thickness, composition, deposition rate, microhardness, porosity, adhesion and corrosion resistance. Sponge and atomised iron compacts with different porosities were obtained by pressing at different densities (5.5 - 7.0 g cm-3) and sintering at 1120 ° C in an N2 - H2 atmosphere. The sintered parts were successfully coated by e...

Patent
07 Mar 2003
TL;DR: In this article, a wiring board consisting of a conductor circuit having two or more conductor layers insulated by an insulating resin layer and electrically connected through a via hole is presented.
Abstract: PROBLEM TO BE SOLVED: To provide a wiring board having excellent connecting reliability and to provide a method for manufacturing the same SOLUTION: The wiring board comprises a conductor circuit having two or more conductor layers insulated by an insulating resin layer and electrically connected through a via hole The method for manufacturing the wiring board comprises the steps of forming the via hole in an integral laminated obtained by laminating the wiring board having conductors formed on at least on an inner wall of the via hole and constituted of electroless copper plating and copper plating, a copper foil to become first conductor circuit on both side surfaces of the first insulating layer, and a copper foil to become a second conductor circuit, electrically connecting the copper foils to become the first conductor circuit to the second conductor circuit by electroless nickel plating and copper plating, forming the first conductor circuit, and forming the second conductor circuit

Patent
30 Jul 2003
TL;DR: In this paper, the surface of a metallic base material is subjected to electroless nickel plating and a treatment solution containing trivalent chromium ions and inorganic acid ions is provided.
Abstract: PROBLEM TO BE SOLVED: To provide a treatment solution which does not substantially contain hexavalent chromium, and can improve the adhesion between an electroless nickel plated layer and a resin film or a rubber film. SOLUTION: The surface of a metallic base material is subjected to electroless nickel plating. The electroless nickel plated layer is treated with a treatment solution containing trivalent chromium ions (e.g. having a concentration of 0.001 to 2 mol/L) and inorganic acid ions (e.g. having a concentration of 0.003 to 5 mol/L). A film (a resin film or a rubber film) is formed on the treated plated layer, and the adhesion between the plated layer and the film is improved. The treatment solution ordinarily contains chromium (III) nitrate. When the electroless nickel plated layer is treated with the above treatment solution, the reduction of the adhesion of the film to the plated layer can be prevented even if time elapses. COPYRIGHT: (C)2003,JPO