Showing papers on "Electroless nickel plating published in 2005"

Electroless nickel plating on hollow glass microspheres

Abstract: Electroless nickel plating on hollow glass microspheres with hypophosphite as a reducing agent in an alkaline bath was studied. Three pretreatment methods were used. The hollow glass spheres via coupling agent solution pretreatment adsorbed more palladium catalytic active centers on their surfaces, hence continuously and uniformly covered microspheres were achieved. The magnetic property of microspheres was improved by adjusting the pH and the concentration of the reducing agent in a certain range. The morphology, composition and structure of deposits were investigated. It was found that the deposits on hollow glass microspheres grew thicker with prolonged plating time. Posttreatment of the coated Ni glass spheres improved the crystalline structure of the plated Ni layer.

Synthesis and characterization of a porous amorphous Ni–B catalyst on titania by silver-catalyzed electroless plating

Abstract: An amorphous Ni–B/TiO2 catalyst has been synthesized by silver-catalyzed electroless nickel plating. The amorphous structure of Ni–B nanoparticles was characterized by X-ray diffraction (XRD) and selected area electron diffraction (SAED). A transmission electron micrograph (TEM) of the Ni–B/TiO2 showed particles with size ranging from 30 to 50 nm were homogeneously dispersed over TiO2 support. High-resolution transmission electron microscopy (HRTEM) indicated that the Ni–B nanoparticles presented a porous and flower-like morphology, which was different from the solid sphere of conventional Ni–B particles prepared by impregnation–reduction method. To investigate the formation process of the porous Ni–B particles, the diffusion of nickel nuclei and the growth of Ni–B particles were characterized. The as-prepared porous Ni–B/TiO2 catalyst exhibited superior catalytic activities in the hydrogenation reactions to those of catalysts prepared by conventional methods.

Study of Optimized Complexing Agent for Low-Phosphorus Electroless Nickel Plating Bath

Abstract: The two mechanisms of phosphorus incorporation with nickel in electroless plating nickel are studied using X-ray fluorescence spectrometer (XRF) and cyclic voltammetry (CV). The results of XRF and CV data on the effect ofsingle and double complexing agents on deposition rate and deposit composition indicate that nickel chelates can catalyze phosphorus generation, i.e., the mechanism of interface complex heterocatalysis on phosphorus incorporation with nickel. Furthermore, the choice principle to complexing agents for low-phosphorus electroless nickel bath was proposed based on it. Additionally, the direct mechanism of phosphorus generation can explain how single sodium hypophosphite can be reduced on nickel substrate on the CV curve. Finally, the optimal condition for low-phosphorus electroless nickel plating baths was determined. The experimental results support the explanation of the proposed mechanism.

Influence of Electroless Nickel Plating on Multilayer Ceramic Capacitors and the Implications for Reliability in Multilayer Ceramic Capacitors

Abstract: The influence of electroless nickel plating on lead-based relaxor ferroelectric multilayer ceramic capacitors (MLCs) was studied by a comparison experiment. It was found that the influence is related to reactions in the electroless plating. It is proposed that adsorbed hydrogen atoms generated in electroless plating can diffuse into the ceramic bodies of MLCs and undergo some reduction reaction with them, resulting in the failure of electroless nickel plating. The implications for the negative influence of electroplating on MLCs and for the degradation in MLCs are also included, in which much attention is paid to the reduction reaction of hydrogen atoms generated by electrolysis of water.

Surface characteristics of electroless nickel plated electromagnetic shielding wood veneer

Abstract: Wood is a kind of porous natural material with very poor electro-conductivity, and it has almost no function of electromagnetic shielding. The method of electroless nickel plating was used to produce wooden material with electrical and effective electromagnetic shielding properties. Ni−P alloy layer was obtained on wood surface. The surface feature of plated wood veneer was observed by SEM and the surface composition and microstructure of the layer under different conditions were investigated by EDS and XRD respectively. Mean-while, the relevant surface resistivity and electromagnetic shielding effectiveness were measured. Correlations of the phosphorous content in the layer to the structure of Ni−P alloy, electro-conductivity and electromagnetic shielding of plated veneers were discussed. SEM photos showed that the surface of electroless nickel plated veneers were covered with Ni−P alloy layer entirely, which made wood veneers more like metal. At the same time, the results showed that with the decreasing of the phosphorous content in the layer, the microstructure of Ni−P alloy layer transformed to be microcrystalline and electro-conductivity and electromagnetic shielding effectiveness were imrpoved. When the phosphorous content was less than 2.37wt pct in the layer, the microstructure of Ni−P alloy layer was microcrystalline structure and its surface resistivity and electromagnetic shielding effectiveness were nearly 0.5 Ω/⊥ and 55–60dB respectively.

Preflux, flux, solder paste and method of manufacturing lead-free soldered body

Abstract: There is closed a flux which is designed to be used in a soldering using a lead-free and zinc-free solder containing tin as a major component and not containing lead, the soldering being adapted to be applied to a surface portion which is constituted by a copper-based metal and/or a nickel-based metal (excluding the case where the surface portion is constituted by electroless nickel plating), wherein the flux contains at least one kind of material selected from the group consisting of a copper-based metal, a nickel-based metal, an inorganic salt of copper-based metal and/or a nickel-based metal, an inorganic complex of copper-based metal and/or a nickel-based metal, and an organic complex of copper-based metal and/or a nickel-based metal (a metal complex of an organic compound where atoms of N, O and S in amine (excluding nitrogen-containing hetrocyclic compounds), imine (excluding nitrogen-containing hetrocyclic compounds), oxime, ketone, alkoxy and thioketone are coordinated with a metal). There is also closed a method of manufacturing a lead-free soldered body wherein this flux is employed.

Low‐Pressure Flame Deposition of Nanostructured Oxide Films

Abstract: The influence of electroless nickel plating on lead-based relaxor ferroelectric multilayer ceramic capacitors (MLCs) was studied by a comparison experiment. It was found that the influence is related to reactions in the electroless plating. It is proposed that adsorbed hydrogen atoms generated in electroless plating can diffuse into the ceramic bodies of MLCs and undergo some reduction reaction with them, resulting in the failure of electroless nickel plating. The implications for the negative influence of electroplating on MLCs and for the degradation in MLCs are also included, in which much attention is paid to the reduction reaction of hydrogen atoms generated by electrolysis of water.

Wiring board and manufacturing method of the same

Abstract: PROBLEM TO BE SOLVED: To provide a wiring board permitting normal electrical connection between an electrode and a connecting pad of an electronic component all the time, and provide a manufacturing method of the same. SOLUTION: In a wiring board, a connecting pad 2a (2b) comprising copper is formed on the surface of an insulating substrate having a wiring conductor, and the surface of the connecting pad 2a (2b) is successively coated with an electroless nickel plating film 11, a reduction type electroless palladium plating film 12 and a substitutional reduction type electroless gold plating film 13. There is provided also a manufacturing method of the same. COPYRIGHT: (C)2007,JPO&INPIT

Black plating film, its forming method, and article having plating film

Abstract: PROBLEM TO BE SOLVED: To provide an electroless nickel black plating film having excellent color tone and wear resistance. SOLUTION: In an electroless nickel black plating film forming method, a plating film is formed by immersing an article to be plated for a predetermined time in an electroless nickel plating bath containing sulfur-containing compounds, the plating film is subjected to the blackening treatment, the black color of the plating film is maintained, and the plating film after maintaining the black color is heat-treated at the temperature in a range of 100-300°C. The electroless nickel black plating film has a diffraction peak at the Bragg angle 2θ = 46-49° in the X-ray diffraction spectrum. COPYRIGHT: (C)2007,JPO&INPIT

Adipate adsorption and its incorporation into NiP coatings from citrate electroless nickel plating solutions

Abstract: Adipate, which is used as a buffer in a citric electroless nickel plating solution, adsorbs on the NiP surface and incorporates into coatings when the plating process takes place. The quantity of adipate incorporated into NiP coatings decreases with increase in hypophosphite and citrate concentrations in plating solution, similarly to the quantity of adipate adsorbed from corresponding solutions without Ni(II) on a freshly plated NiP surface. An increase in Ni(II) ion concentration in plating solution also diminishes the quantity of adipate incorporated into coatings, though any decrease in its adsorption on NiP coatings is not observed from the corresponding solutions without hypophosphite (when plating does not occur). The adsorption of adipate and citrate leads to the decrease in the rate of catalytic hypophosphite oxidation. The deposition of smoother and brighter NiP coatings in the presence of adipate together with Cu(II) ions, which act as a stabilizer, is determined by a stronger adipate interaction with Cu as compared with NiP.

The Effects of Bath Composition on the Morphologies of Electroless Nickel Under-Bump Metallurgy on Al Input/ Output Pad

Abstract: The electroless nickel plating on an aluminum input/output (I/O) pad was investigated. The aluminum pad was pretreated in a zincate solution prior to electroless nickel plating. Zinc particles on the aluminum pad gave a good adherent nickel layer. The adhesion and uniformity of zinc on the aluminum is the key factor in under-bump metallurgy (UBM). The electrode potential changes with and without zinc ions in the bath were measured to analyze the sequence of two competing reactions: zinc deposit and hydrogen evolution. The relationship between aluminum dissolution and the ratio of zinc and NaOH was investigated. The electroless nickel deposition rate was dependent on bath composition. The effects of complexing ligand and additive on the nickel deposit were analyzed. Electrode potential changes were measured with time to confirm nucleation and grain growth. Adhesion of the UBM was related to zinc-particle dissolution and nickel nucleation. The uniform nickel UBM was fabricated on a real Al I/O pad.

Electroless Nickel Plating onto Minute Patterns of Copper Using Ti ( IV ) ∕ Ti ( III ) Redox Couple

Abstract: The selectivity of electroless Ni plating onto submicrometer-scaled Cu patterns less than 200 nm in width was examined at 50°C using a plating solution containing Ti(III) ions as a reducing agent. The composition of the solution was 0.04 M NiSO 4 , 0.08 M TiCl 3 , 0.24 M citric acid (sodium salt, Na 3 Cit), and 0.04 M nitrilotriacetic acid (sodium salt, Na 3 NTA). A continuous and uniform Ni layer of about 10 nm in thickness was found to be epitaxially deposited only on the patterned Cu area, suggesting that the plating method is applicable to a metallizing process for ultrafine devices. The reactions that occurred in the plating solution were discussed from a thermodynamic standpoint. The plating rate was strongly influenced by the immersion potential and pH of the solution. The reduction of water proceeded in the bulk of the plating solution, and this reaction was partially responsible for the lowering of pH and the depression of the plating. Using the stability constants for the Ni 2 + -citrate and Ni 2 + -nitrilotriacetate systems, we calculated the distribution of Ni(II) complexes in the solution with various concentrations of Na 3 NTA: the analytical composition was 0.04 M NiSO 4 -0.24 M Na 3 Cit-0-0.12 M Na 3 NTA at 50°C. The concentration of Na 3 NTA affected the stability of the plating solution and the plating rate, since the abundances of Ni(II) complexes, i.e., NiCit 4 - 2 , NiNTA - , and NiNTA 4 - 2 , depended on the concentration of Na 3 NTA; the presence of NiNTA 4 - 2 , which is more stable than the others, depressed the nickel plating significantly.

Method of fabricating package substrate using electroless nickel plating

Abstract: Disclosed is a method of fabricating a package substrate using electroless nickel plating. The method includes preparing a base substrate, on which an internal layer circuit pattern is formed through a predetermined masking process; forming an insulating layer on the base substrate to achieve interlayer electric insulation; forming a first via hole through the insulating layer to achieve interlayer electric connection; forming a seed layer on the insulating layer through which the first via hole is formed; and forming an external layer circuit pattern on the seed layer through the other predetermined masking process. The seed layer is partially or selectively flash etched so as to prevent via open and undercut formed at the external layer circuit pattern.

Study on the process of electroless nickel plating on magnesium alloys

Abstract: The process of electroless nickel plating (EN) on magnesium alloys is investigated. The concentration of complexing agent, the concentration of reductant and the pH value of the EN bath for magnesium alloys influence the deposition rate. The results show that the deposition rate increases as the concentration of complexing agent decreases, the concentration of reductant and pH increase. Additionally, deposits with different phosphorus content can be obtained on magnesium alloys by varying the concentration of complexing agent and reductant, and the pH value of the bath. DSC curves of deposits reveal that the microstructure changes from crystalline to amorphous with the increment of the phosphorus content.

Electroless nickel plating bath and electroless nickel alloy plating bath

Abstract: PROBLEM TO BE SOLVED: To provide an electroless nickel (alloy) plating bath capable of achieving satisfactory formation of a plating film and satisfactory continuous use of the plating bath without substantially incorporating lead etc, which are hazardous substances therein SOLUTION: The electroless nickel plating bath contains a water-soluble nickel salt, a reducing agent, molybdenum, and bismuth and the electroless nickel (alloy) plating bath contains further an alloying metal salt in addition thereto COPYRIGHT: (C)2006,JPO&NCIPI

Noble metal surface activation liquid for electroless nickel plating

Abstract: PROBLEM TO BE SOLVED: To provide a pre-treatment liquid to a noble metal capable of depositing an excellent electroless nickel coating film only on a noble metal portion by a simple treatment method when depositing the electroless nickel coating film on a noble metal such as gold. SOLUTION: A noble metal surface activation liquid for the electroless nickel plating is composed of of aqueous solution containing (i) a complexing agent, (ii) at least one component selected from a group composed of copper salt and silver salt, and (iii) aldehydes. In the electroless nickel plating method on the noble metal, the surface of the noble metal is activated by using the activation liquid, a catalyst for the electroless plating is provided, and then, the electroless nickel plating is performed. COPYRIGHT: (C)2007,JPO&INPIT

Electroless Ni-P-TiO2-based composite coatings for surface engineering applications

Abstract: Electroless nickel plating has undergone a sea change over the last decade. These coatings find wide application in the automotive and aerospace industries. As a means of overcoming problems associated with corrosion, abrasive wear and for the metallizing of nonconducting materials, this technology is rapidly expanding. Of all the electroless nickel plating processes available, the most widely used is the nickel phosphorous alloy acid bath. The main objective of our project is to codeposit TiO 2 with Ni-P at different concentrations and to study the mechanical and corrosion properties of the deposits.

Electroless palladium plating liquid, and three layer-plated film terminal formed using the same

Abstract: PROBLEM TO BE SOLVED: To provide an electroless palladium plating liquid where, in a three layer plating film terminal of an electroless nickel plating film/ an electroless palladium plating film/a substitution gold plating film, a gold film is formed only by easily treatable substitution gold plating, and, even when electroless nickel-phosphorous having high flexibility is used, which has excellent joining strength in both of wire bonding joining and solder ball joining, and has excellent running properties as well. SOLUTION: The electroless palladium plating liquid at least comprises: a component (a): a palladium salt organic complex; a component (b): sulfide group-containing monocarboxylic acid or the salt thereof; and a component (c): hypophosphorous acid or the salt thereof. COPYRIGHT: (C)2007,JPO&INPIT

Influence of temperature and pressure on the possibility of obtaining Al2O3/Ni-P nanocomposite through hot pressing process

Abstract: The influence of sintering temperature and high pressure on Ni-P nanoparticles in Al2O3/Ni-P nanocomposites was investigated in this paper. The fine-grained alumina powder was covered with Ni-P nanoparticles of 20 – 50 nm size by electroless nickel plating. The material was sintered in temperatures from 900 to 1400oC using pressures above 5 GPa. It was found that sintering in such conditions give a possibility to maintain nanometrical size of Ni-P particles. In the case of 1400oC the metallic phase melts and non-uniform grain growth of ceramic was observed. Hot pressing at 900oC allowed for the metal to remain in solid state and ensured uniform microstructures of the nanocomposites, with uniform distribution of nanometrical Ni-P grains in the ceramic matrix. In this temperature the grain growth of the ceramic was not observed. The results are discussed in terms of technology for production of ceramic-metal composites for various applications.

Electroless nickel plating method and plated product thereby

Abstract: PROBLEM TO BE SOLVED: To provide an electroless nickel plating method where zinc in a nickel strike plating liquid is efficiently recovered, and the service life of the nickel strike plating liquid can be elongated while maintaining a high plating rate and high plating quality. SOLUTION: In the electroless nickel plating method where aluminum, magnesium, titanium or the alloy thereof subjected to zinc substitution treatment is dipped into a nickel strike plating liquid, is subjected to nickel strike plating, and is thereafter subjected to functional plating, the nickel strike plating liquid is brought into contact with an extract comprising an acid organic phosphorous compound to extract zinc, and thereafter, the nickel strike plating liquid subjected to the extraction treatment is reused. COPYRIGHT: (C)2005,JPO&NCIPI

Electroless plating method on aluminum surface, and catalyst for electroless plating

Abstract: PROBLEM TO BE SOLVED: To provide an electroless plating method in which conventional defects attributable to zincate treatment are solved, solution of Al or an Al alloy is small, no nodule is generated, and a plating film of uniform thickness can be obtained, and a palladium catalyst used therefor SOLUTION: Surface of Al or an Al alloy is activated, thereafter, is surface-treated with any one of a palladium solution using palladium sulfide, palladium nitride, and palladium ammine, and electroless nickel plating and substitution type gold plating are performed Concentration of palladium in the palladium solution is preferably 0005-20 g/L If the concentration of palladium is ≥ 10 g/L, it is preferably to add to the palladium solution organic acid and organic acid salts such as citric acid and citrate, malic acid and salts thereof, lactic acid and salt thereof, or a chelating agent such as salts of amino acid such as glycine and alanine, ethylene diamine and salts thereof, and amines such as ethanolamine COPYRIGHT: (C)2006,JPO&NCIPI

Synergistic Fluoropolymer Coating on Magnesium Alloys

Abstract: The synergistic fluoropolymer self-lubrication coatings on magnesium alloys were studied. Magnesium alloy was firstly treated by electroless nickel plating. Then micropores of electroless nickel plating layer was enlarged. Then the fluoropolymer particles were infused into micropores, precise vacuum heat treatment ensured thorough infusion with fluoropolymer, finally the synergistic coating was formed. The hardness of the coating reached 600HV, the dynamic coefficient of friction of the coating was less than 0.15, and the low coefficient of friction could be kept during a long duration wear to realize the permanent dry lubrication. The corrosion resistance was also excellent to endure 5% neutral salt spray test for 500 hours. Also the structure and composition of the coating were observed and studied.

A Study on the Pretreatment of Direct Electroless Nickel Plating on Magnesium Alloys AZ91D

Abstract: Magnesium alloys are considered as “difficult to plate” metal. The pretreatment processes play a key role for plating. The pretreatments of alkaline cleaning, chromic acid etching and hydrofluoric acid activating were carried out and the microstructures investigated by SEM and EDAX in detail. The hydrofluoric acid activating time of 8 minutes was determined by Potential-Time curve. The experimental results showed that the alkaline cleaning moved the grease and oils off the substrate surface, but there was no apparent surface morphology change. The chromic acid etching was a very critical step, and the optimum etching time of 1 minute was chosen; the eutectic α was severely etched, and the chromic compounds were mainly formed on the surface. During the hydrofluoric acid activating, the white activating product of magnesium fluoride was preferentially generated on the β–phase, and obvious morphology change has been observed on the alloy substrate surface.

Nickel coated copper powder and process for producing the same

Abstract: An antioxidant nickel coated copper powder for conductive paste capable of forming conductive wiring parts for electronic circuits; and a process for producing the same. In particular, use is made of a nickel coated copper powder characterized by comprising a nickel coated copper powder produced by providing a copper powder as a core material, fixing a plating catalyst on the surface of copper powder through reduction reaction and applying electroless nickel plating to the outermost surface thereof. The reduction reaction is characterized in that hydrazine is used as a reducing agent.

Thin high resistance nickel-phosphorus film

Abstract: PROBLEM TO BE SOLVED: To provide a thin nickel-phosphorus film which can stably exhibit high electric resistance characteristics without being affected by heat. SOLUTION: The thin nickel-phosphorus film is deposited by an electroless plating method using an electroless nickel plating solution which contains a nickel salt, a reducing agent, and a complexing agent, wherein the complexing agent is an amino group-(-NH 2 , >NH)containing compound. The thin nickel-phosphorus film is subjected to an acid treatment to obtain the thin nickel-phosphorus film with a sheet resistance value of ≥20 Ω/square at 200°C. COPYRIGHT: (C)2005,JPO&NCIPI

Fabrication of metal-block-copolymer composite films by a palladium-catalyzed electroless nickel-plating process

Abstract: Homogeneous films of PI-b-PDMAEMA are prepared on top of silicon (100) substrates. The free film surface shows microdomains of PDMAEMA within a PI matrix. These microdomains act as templates for the highly site-selective synthesis of metal nanoparticles via palladium-catalyzed electroless nickel plating. The particle formation is studied by atomic force microscopy in tapping mode and implications for a redox reaction and a nanoparticle growth mechanism on the surface of nanopatterned films are discussed.

Electroless nickel-plating liquid and plating method using the same

Abstract: PROBLEM TO BE SOLVED: To provide an electroless nickel-plating liquid containing no lead, and to provide a plating method using the same. SOLUTION: The electroless nickel-plating liquid adopts a compound of a bismuth salt as a stabilizer, for example, bismuth ammonium citrate, bismuth potassium tartrate and bismuth sodium tartrate. Which easily dissolves in a high concentration of an electroless nickel-plating stock solution. Thus, the prepared electroless nickel-plating liquid has the bath life favorably compared with a conventional electroless nickel-plating liquid containing lead as the stabilizer, and imparts excellent electrically-resistive properties to a film 2 plated in the plating liquid. COPYRIGHT: (C)2007,JPO&INPIT

Method for recycling electroless nickel plating waste solution

Abstract: PROBLEM TO BE SOLVED: To provide a method for recycling an electroless nickel plating waste solution in which nickel and phosphorus are respectively separated and collected by a relatively small facility at a low cost SOLUTION: The recycling method comprises a first step of manufacturing an acid electroless nickel plating waste solution B below pH2 by adding inorganic acid to electroless nickel plating waste solution A, a second step of adjusting the acidity to pH2-7 by adding a calcium compound to the electroless nickel plating waste solution B to obtain an electroless nickel plating waste solution C with sediment containing calcium phosphite and calcium sulfate to be generated removed therefrom, and a third step of adjusting alkalinity to ≥ pH95 by adding alkali agent to the electroless nickel plating waste solution C to separate the sediment of nickel hydroxide to be generated from an electroless nickel plating waste solution D with nickel hydroxide removed therefrom COPYRIGHT: (C)2005,JPO&NCIPI