Showing papers on "Electroless nickel plating published in 2007"

Electrochemical Performances of Ni-Coated ZnO as an Anode Material for Lithium-Ion Batteries

Abstract: Ni-coated ZnO was prepared by electroless nickel plating as an anode material for lithium-ion batteries. The microstructure of the Ni-coated ZnO was characterized by means of X-ray diffraction, transmission electron microscopy, and energy dispersive X-ray spectroscopy. The electrochemical properties of the anodes were measured by galvanostatic charge-discharge tests and electrochemical impedance spectroscopy. The results show that the Ni-coated ZnO delivered a higher reversible discharge capacity (490 mAh g -1 ) than the raw ZnO (130 mAh g -1 ), exhibited good cyclability, and the initial coulombic efficiency of the ZnO was significantly improved after coating (from 49.5% to 75%). The presence of the nickel membrane plays three important roles in the improvement of initial coulombic efficiency and the cycling performance of ZnO. First, nickel as a conductor can improve the high rate properties of ZnO. Second, nickel acts as a buffer to alleviate the stress during cycling. Third, nickel also has the catalytic activity to facilitate Li 2 O decomposition.

Electroless nickel–phosphorus plating on graphite powder

Abstract: Electroless deposition technique was used to coat Ni–P on graphite particles with high deposition rate and bath stability by activating the graphite powder in a furnace at 380 °C for 1 h. The effect of plating time, size of the powder and weight of the powder were studied. It was found that by a simple and controlled plating method a uniform and continuous layer of nickel could be deposited on the surface of graphite particles. Scanning electron microscopy images and EDS spectra before and after electroless nickel plating confirm that nickel is deposited on the surface of graphite particles. The rate of increase in weight percent nickel over graphite decreases with time and reaches a plateau. Further increase in weight is attained by plating the same powders in a fresh bath to obtain desired Ni–P alloy mass.

The preparation and structural characterization of Al2O3/Ni–P composites with an interpenetrating network

Abstract: This paper reports on the possibility of obtaining 3D interpenetrating ceramic–metal composites by using an electroless chemical plating method. Alumina powder was coated with a homogenous Ni–P alloy layer to obtain Al2O3/Ni–P composites. The coated powders were consolidated via hot pressing (HP) under high pressure at different temperatures below the melting point of the metal phase. High-resolution scanning electron microscope (HRSEM) and X-ray diffractometry (XRD) techniques were used to study the influence of the consolidation conditions (temperature and pressure) on the microstructure of the composites. The percolation of the interpenetrating phases was evaluated by computer-aided image analysis and electrical conductivity measurements. The results indicate that the use of electroless nickel plating allows for the fabrication of uniform 3D interpenetrating, continuous metal–ceramic composites. The metal phase fills the open pores and also interpenetrates the spaces between the ceramic grains. Depending on the consolidation conditions it is possible to obtain dense or porous materials with a promising metal phase nanostructure.

Flux for soldering and circuit board

Abstract: A flux contains resin having film forming ability, activator, solvent and at least one complex selected from silver complex and copper complex. The flux is used when soldering is performed onto a circuit having electroless nickel plating or further having gold plating on the electroless nickel plating. Allowing a barrier layer of silver or copper to deposit on the surfaces of lands suppresses the diffusion of nickel into the melted solder alloy during soldering, and also prevents phosphorous concentration. This improves the bonding strength of soldering and suppresses the reduction deposition of silver and/or copper to portions other than circuit patterns.

Control of Specular and Diffuse Reflection of Light Using Particle Self-Assembly at the Polymer and Metal Interface**

Abstract: We present a novel method of controlling the specular and diffuse reflection of light by the electrostatic deposition of a spherical particle monolayer followed by electroless plating. Charged polystyrene colloidal particles, ranging in size from 100 nm to 5 lm, were adsorbed from solution onto oppositely charged polyelectrolyte multilayers (PEM). The monodisperse particle monolayers were coated with nickel in a two-step electroless plating process using palladium catalysts. These surfaces can be used as diffusive metal reflectors with a uniformly controlled surface roughness due to the uniform size of deposited particles. In addition, the self-assembled particles at the polymer and metal interface deflected the internal stresses that build-up at the interface while the metal was being deposited. This allowed a thicker metal film to be deposited before delamination occurred. A UV-VIS spectrometer with movable fiber optic cables was employed to characterize the optical properties of the reflectors. The optical fibers permit versatile and precise measurements of specular and diffuse reflectance. By measuring the angular dependent reflectance, we demonstrate how to estimate the distribution of reflected light from the nickel coated surface and how to calculate the ratio of specular and diffuse reflection in the total reflected light. Optical measurements of our nickel samples showed that this approach could be used to control the portion of diffuse reflection from 8.25 to 59.97%. Additionally, a quartz crystal microbalance was employed to study the electroless nickel plating rate on PEM. Our proposed method is simple, costeffective and convenient for mass production because the process consists of a series of simple immersion steps without vacuum technology or special equipment.

Characterization of electroless nickel plating on silicon solar cells for the front side metallization

Abstract: The selective deposition of nickel on silicon wafers from an electroless bath is a very attractive process for the front side metallization of silicon solar cells. The anti-reflection coating (ARC) at the front side of the wafers is used as a mask for the deposition. Nickel is plated from an alkaline nickel sulfate bath with sodium hypophosphite as a reducing agent and ammonia for pH control. Characterization of the deposition depending on bath conditions, substrate doping and light application will be presented in this paper. Silicon solar cells with SiO2 and SiNx as ARC have been processed featuring dielectric passivation and Laser Fired Contacts (LFC) at the back side. Efficiencies up to 18.9% have been achieved using this technology. The samples have been characterized by SEM and measurement of the IV curves.

Electroless gold-plating method and electronic component

Abstract: PROBLEM TO BE SOLVED: To provide a method of efficiently depositing an electroless gold-plating film of a plating film laminate on which an electroless nickel plating film, an electroless palladium plating film and an electroless gold-plating film are deposited. SOLUTION: A part of or the entire of an electroless gold-plating film of a plating film laminate on which an electroless nickel plating film, an electroless palladium plating film and an electroless gold-plating film are deposited, is formed by the electroless gold plating using an electroless gold plating bath containing a water-soluble gold compound, a complexing agent, a formaldehyde and/or formaldehyde bisulfite additive, and an amine compound expressed by a general formula R 1 -NH-C 2 H 4 -NH-R 2 or R 3 -(CH 2 -NH-C 2 H 4 -NH-CH 2 ) n -R 4 . In this method, two kinds of baths of a flash gold plating bath and a heavy-deposition gold plating bath need not be prepared. The gold-plated film of various kinds of thickness suitable for soldering or wire bonding can be deposited by one kind of gold plating bath. In particular, the electroless gold plating film of the thickness of ≥0.15 μm can be efficiently and effectively deposited in one process by using one kind of plating bath, the process can be simplified favorably in the cost aspect. COPYRIGHT: (C)2009,JPO&INPIT

Reduction precipitation type electroless gold plating liquid for palladium film

Abstract: PROBLEM TO BE SOLVED: To provide a reduction precipitation type electroless gold plating liquid which can be directly precipitated on a palladium film, and is favorable, in particular, for the surface treatment of a conductor circuit of a printed circuit board. SOLUTION: The reduction precipitation type electroless gold plating liquid which is used to directly deposit a gold plating film on a palladium film consists of an aqueous solution containing a water-soluble gold compound, a reducing agent and a complexing agent, and contains at least one kind of compound selected from a group consisting of formaldehyde bisulfites, rongalit, and hydrazines as the reducing agent. An electroless nickel plating film, an electroless palladium plating film, and an electroless gold plating film deposited by using the reduction precipitation type electroless gold plating liquid are successively deposited on the conductor part of the printed circuit board. COPYRIGHT: (C)2008,JPO&INPIT

Improvement in corrosion properties of carbon-coated Fe-based metals for PEFC bipolar plate

Abstract: Low cost metals are quite attractive as bipolar plate of polymer electrolyte fuel cell (PEFC). However, low cost metals easily corrode due to the absence of good passivation films. In order to give high electrical conductivity and corrosion resistance to low cost metals such as carbon steel (S25C), carbon-coat was carried out by plasma-assisted chemical vapor deposition. Carbon-coated samples were characterized by XRD, Raman spectroscopy, and interfacial contact resistance. Based on the results of polarization measurement, the combination of carbon-coat and electroless nickel plating was found to be effective for decreasing of anodic dissolution of base metal.

Corrosion and wear resistant coating for magnetic steel

Abstract: A method is provided for manufacturing a magnetic steel component. An electroless nickel plating is formed on a substrate that includes magnetic steel. A thermal cycle is thereafter performed at a temperature that is sufficiently high to sinter the electroless nickel plating and thereby form a densified plating on the substrate. According to one embodiment, the thermal cycle includes a solid state diffusion sintering process wherein the substrate and the densified plating are heated to a temperature of at least about 1300° F. (about 704° C.) but.below the melting temperature of the electroless nickel plating. According to another embodiment, the thermal cycle includes a transient liquid phase sintering process wherein the substrate and the densified plating are heated at least to the melting temperature of the electroless plating.

Flux for soldering, soldering method, and printed circuit board

Abstract: A flux for soldering used when soldering is performed to a board subjected to electroless nickel plating, the flux containing resin having film forming ability, activator, and solvent, and further containing metallic salt in an amount of 0.1 to 20% by weight of the total amount of flux. The use of this flux suppresses diffusion of nickel solder in soldering portions, and prevents concentration of phosphorous, thereby improving the bonding strength of soldering.

Effect of low temperature plasma treatment on the electroless nickel plating of polyester fabric

Abstract: The present study is performed with an objective to acquire a deeper understanding of the properties of nickel-plated polyester fabric after conducing low temperature plasma (LTP) treatment. LTP treatment with oxygen and argon gases was employed to render a hydrophilic property of woven polyester fabrics and facilitate the absorption of a palladium catalyst to provide a catalytic surface for electroless nickel plating. The properties of LTP-induced electroless nickel-plated polyester fabrics were evaluated by various standard testing methods in terms of both physical and chemical performances. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007

Ultra-violet protection and water repellency of polyester fabrics treated by surface deposition of nickel under the effect of low temperature plasma

Abstract: This paper is aimed at understanding the textile properties of nickel-deposited polyester fabric after treating with low temperature plasma treatment. Low temperature plasma treatment with oxygen gas was employed in this paper to activate a hydrophilic surface for the polyester fabrics and hence facilitate the nickel deposition through an electroless plating process. The textile properties of plasma-induced electroless nickel-plated polyester fabrics were evaluated by different standard testing methods in terms of both physical and chemical performances. The electroless nickel plating with plasma treatment improved significantly the performance of nickel-plated polyester fabrics as reflected by the scanning electron microscopy, tensile strength, ultraviolet protection as well as fabric weight. On the contrary, it also enhanced the fabric thickness and colour fastness to crocking. In addition, there was no influence on the performance of colour fastness to light and colourfastness to laundering. Moreover, the application of plasma treatment adversely affected slightly the performance of contact angle and wrinkle recovery property.

Of the mechanism governing the growth of electrolessly deposited nickel-phosphorus coatings

Abstract: The electroless deposition of nickel-phosphorus coatings from acetate solutions is studied. The morphology and microrelief of the coatings’ surface are found to be defined by the nucleation and growth of spheroids. The spheroids form probably via a layered-growth mechanism and are markedly extended in the substrate’s plane. Their dimensions, which depend on the ratio between propagation rates of two-dimensional layers in the substrate’s plane and the emergence of fresh two-dimensional layers (nuclei), are measured with the aid of 3D profilography.

Pretreatment liquid for promoting starting of electroless palladium plating reaction, electroless plating method using the pretreatment liquid, connection terminal formed by the electroless plating method, and semiconductor package using the connection terminal and its manufacturing method

Abstract: PROBLEM TO BE SOLVED: To provide a pretreatment liquid for promoting starting of electroless palladium plating reaction for forming a film of uniform thickness by suppressing non-formation of electroless palladium plating film formed on a plated body functioned as a protective layer for an electroless nickel plating alloy film or reduction in thickness, an electroless plating method using the same, a connection terminal, a semiconductor package using the connection terminal, and its manufacturing method. SOLUTION: Disclosed are the pretreatment liquid for promoting starting of electroless palladium plating reaction for immersing the electroless palladium plating film before forming to promote starting of the electroless palladium plating reaction when performing depositing the electroless nickel plating alloy film, the electroless palladium plating film, and a substitution gold plating film on the plated body, or further performing electroless plating for depositing the electroless plating film, the electroless plating method using the pretreatment liquid, the connection terminal formed by the electroless plating method, the semiconductor package using the connection terminal, and its manufacturing method. COPYRIGHT: (C)2009,JPO&INPIT

Substrate for mounting semiconductor chip, and preprocessing liquid

Abstract: PROBLEM TO BE SOLVED: To provide a substrate for mounting a semiconductor chip that sufficiently excels in insulation reliability, wire bonding reliability, and solder connection reliability by adequately preventing abnormal deposition of electroless nickel plating; and to provide a preprocessing liquid. SOLUTION: The substrate for mounting a semiconductor chip 10 comprises a substrate 20, a wire bonding connection lug 1 arranged on the first main surface of the substrate 20, a solder connection lug 12 arranged on the second main surface of the substrate located on the opposite side of the first main surface, and a connection wire 14 extending from the wire bonding connection lug 1 arranged on the first main surface. The connection lugs 1 and 12 have electroless nickel plating film that covers the metallic surface, while the connecting wire 14 has electroless nickel plating film that covers the surface of the wire as required. On the connecting lugs 1 and 12, and further the connecting wire 14 as required have the electroless nickel plating film with a thickness of no less than 0.8 μm are selectively formed to cover the surface of the metallic lug and/or metallic wiring. COPYRIGHT: (C)2008,JPO&INPIT

Activation composition for electroless palladium plating

Abstract: PROBLEM TO BE SOLVED: To provide a composition for pretreatment for electroless palladium plating where, even in the case an electroless palladium plating liquid including impurities such as copper is used, a palladium plating film can be stably precipitated over a nickel film. SOLUTION: Disclosed is an activation composition on a nickel surface for performing electroless palladium plating to the surface of nickel, which is composed of an aqueous solution comprising a palladium compound and hydrazines. Also disclosed is a method for forming a plating film onto a printed circuit board comprising a process where an electroless nickel plating film is formed on the conductor part of a printed circuit board, thereafter, activation treatment for the nickel plating film is performed using the above activation composition, and subsequently, electroless palladium plating is performed. COPYRIGHT: (C)2008,JPO&INPIT

Photochemical Deposition of Ni – Cu Patterns onto Conducting Substrates Employing TiO2 – Pd2 + Layers

Abstract: The metal photopatterning process employing a thin film of amorphous TiO 2 doped with Pd 2+ and oxalic acid has been developed. The exposure of this photolayer to UV light is believed to yield Pd(I) stabilized in a titanium oxide matrix, while subsequent washing results in formation of Pd nanoparticles through disproportionation. The Pd centers at the exposed areas are capable of inducing electroless nickel plating yielding the adhesive nickel pattern. The electroless copper deposition over patterned Ni allows generation of metal patterns with a resistivity of 4-12 μΩ cm and a resolution of 7 μm on the conducting substrates (indium-tin oxide glass, Si).

Study on electroless nickel plating activated without palladium on the surface of cenospheres

Abstract: The metal-modified cenospheres can be used as conductive composite filler to make electromagnetic shielding or microwave absorbing materials.The electroless plating Ni-P alloy on the cenospheres surface was obtained through activation process without palladium in this paper.The effects on the plating velocity and plating bath were investigated.The results of ESEM,energy dispersive X ray spectroscopy(EDS) and RXD analysis indicated that the Ni-P alloy could be plated on the surface of cenospheres homogenously,and presented amorphous phase.The activation mechanism of electroless nickel plating on the surface of cenospheres was discussed.

Multilayer plating film and printed wiring board

Abstract: PROBLEM TO BE SOLVED: To provide a novel treatment method that can be applied to electronic parts, especially a conductor or the like of a printed wiring board and can give excellent soldering property, wire bonding property, etc. thereto. SOLUTION: The printed wiring board is provided with a multilayer plating film wherein an electroless nickel plating film containing 10-13 wt.% phosphorus, an electroless palladium plating film of 0.01-1 μm in thickness and a substitutional gold plating film are piled up in this order. The multilayer plating film is formed in the conductor part of the printed wiring board. COPYRIGHT: (C)2008,JPO&INPIT

The effect factor analysis of the nickel activation techniques on the uniformity of the plating layer in wood electroless nickel plating

Abstract: To ascertain the feasibility of the nickel activation techniques in wood electroless nickel plating,the effects of nickel salt concentration,reducing agent concentration,acid and alkali concentration and the time of the activation on the uniformity of the plating layer on the wood surfaces were studied in order to get perfect activation solution composition and activation techniques for wood electroless nickel plating.It has an important meaning for the further research of the new activation techniques on the non-noble metal in wood electroless nickel plating field.

Magnesium-alloy chemical nickel coating method

Abstract: A method of electroless nickel plating on magnesium alloy, including the following steps. Step one: mechanical polishing the surface of magnesium alloy; Step two : Washing or puffing away the residue magnesium powder on the surface of magnesium alloy with water or an air gun; Step three: treating the surface of magnesium alloy with hydrofluoric acid in order to obtain the dense layer of magnesium fluoride protecting magnesium alloy from the erosion of electroless nickel solution; Step four : Washing with clean water or baking to eliminate the remnants of hydrofluoric acid solution; Step five : immersing magnesium alloy into plating solution in flash, flash plating for a period with a certain voltage. The flash plating solution was consist of nickel salt, complexing agent, reducing agent, stabilizer; Step six: Chemical Nickel Plating with alkaline bath, treating in an electroless nickel plating solution. This method utilized the protected layer of hydrofluoric acid and magnesium fluoride, with fewer technics, less time, more simple operation, easier controlling, less material, lower cost and higher performance products.

Method for chemically coating nickel by magnesium-alloy

Abstract: It is a method of electroless nickel plating on magnesium alloy which includes at least the following steps: Step one: mechanical polishing the surface of magnesium alloy; Step two : washing the surface of magnesium alloy with water; Step three : treating the surface of magnesium alloy with acid; Step four: washing the surface of magnesium alloy with water; Step five: magnesium alloy surface activation with acidic aqueous; Step Six: washing the surface of magnesium alloy with water; Steps seven: magnesium alloy coating surface covered chemical in electroless nickel solution. The invention aims to provide a method of electroless nickel plating on magnesium alloy, which involves less technics flow, shorter time, more simple operation, easier control, less required material, lower cost and products with higher performance.

Electroless Nickel Plating on the Fine Pattern Using Mixed Plating Bath Containing Hydrazine and Hypophosphite

Abstract: 近年の電子機器の高機能化に伴い, 実装部品の内部接続の高密度化が求められている。それゆえ, 無電解ニッケルめっきおよび置換金めっきは高い信頼性を有するプリント配線板を作製するための重要な工程となっている。信頼性を低下させる要因の1つは, パラジウム触媒が銅配線間の樹脂上に吸着して発生するニッケルの異常析出である。そのため, パラジゥム触媒フリーでの銅配線上への無電解ニッケルめっき法の開発が望まれている。そこで, 本研究ではパラジウム触媒フリーで銅配線上に無電解ニッケルめっきを施す手法を検討し, 銅上で触媒活性を有するヒドラジンを次亜リン酸を含む無電解ニッケルめっき浴に混合する手法を考案した。本法の適用により, パラジウム触媒フリーで銅上に無電解ニッケルめっきが可能となり, 異常析出の発生も抑制された。