Showing papers on "Electroless nickel plating published in 2008"
TL;DR: In this article, a low-cost and environment-friendly process of surface activation on ABS plastic was carried out by employing a kind of biopolymer to fix catalyst metal on the substrate by chemical sorption.
93 citations
Patent•
19 Jun 2008
TL;DR: In this paper, a process for chrome plating magnesium and its alloys is described, which uses a combination of electroless nickel plating, a multi-stage copper coating transition system and multiple layers of electrodeposited nickel to form a corrosion resistant system of substantial impermeability and interlayer adherence suitable for direct chromium electroplating.
Abstract: A process for chrome plating magnesium and its alloys. The process uses a combination of electroless nickel plating, a multi-stage copper coating transition system and multiple layers of electrodeposited nickel to form a corrosion resistant system of substantial impermeability and interlayer adherence suitable for direct chromium electroplating.
56 citations
TL;DR: In this article, a palladium-free activation electroless nickel (EN) plating process, by which a TiB(2) powders contained intermediate film was used as catalyst, was introduced for anodized magnesium alloy AZ91D.
56 citations
TL;DR: In this article, the effects of added rare earth elements (RE) in the acidic hypophosphite plating bath on the plating rate, bath stability and microstructure of the electroless nickel-phosphorus (EN) deposits were studied.
Abstract: Effects of added rare earth elements (RE) in the acidic hypophosphite plating bath on the plating rate, bath stability and microstructure of the electroless nickel–phosphorus (EN) deposits were studied. The surface appearance and microstructure were examined under a reflection optical microscope and a scanning electron microscope equipped with an in-situ energy dispersive X-ray spectroscopy, which can evaluate the elemental analysis of deposits. It was demonstrated that the rare earth elements can decrease grain size and refine microstructure. The deposition rate of the Ni–P deposits was estimated by gravimetric, polarization and quartz crystal microbalance (QCM) methods. Results revealed that up to an optimum concentration of rare earth elements, the deposition rate increases. The stability test method was used to determine the stabilization effect of RE on the stability of the bath. It was found that the addition of RE significantly improved the Pd stability of the EN bath.
47 citations
TL;DR: In this paper, the performance of nickel-plated polyester fabrics was confirmed to be dependent on the amount of nickel particles adhering to the fabric surface, and the properties of the optimized polyester were enhanced in terms of the fabric weight, fabric thickness, and tensile strength.
Abstract: The optimization of the electroless nickel plating process used for textile applications was investigated with the orthogonal array testing strategy. It was found that the electroless nickel plating process conducted at 40°C and pH 10 for 20 min was the most effective method for improving the metal adhesion performance. The performance of nickel-plated polyester fabrics was confirmed to be dependent on the amount of nickel particles adhering to the fabric surface. The properties of the optimized nickel-plated polyester were enhanced in terms of the fabric weight, fabric thickness, and tensile strength. However, there was a moderate decrease in the tearing strength and crocking fastness. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008
46 citations
Patent•
23 Apr 2008TL;DR: In this article, the connection reliability of connecting terminals with displacement gold plating films is improved by connecting terminals comprising a conductive layer, an electroless nickel plating film, a first palladium plating material which is a displacement or electroless palladium material with a purity of at least 90% by mass and less than 99% bymass, and a displacement gold material.
Abstract: The connection reliability of connecting terminals with displacement gold plating films is improved by connecting terminals comprising a conductive layer, an electroless nickel plating film, a first palladium plating film which is a displacement or electroless palladium plating film with a purity of 99% by mass or greater, a second palladium plating film which is an electroless palladium plating film with a purity of at least 90% by mass and less than 99% by mass, and a displacement gold plating film, wherein the electroless nickel plating film, the first palladium plating film, the second palladium plating film and the displacement gold plating film are laminated in that order on one side of the conductive layer, and the displacement gold plating film is situated on the uppermost surface layer on the opposite side from the conductive layer.
43 citations
TL;DR: In this article, an electroless nickel plating and sol-gel combined technique was used to prepare the Ni-P/TiO2 composite film on sintered NdFeB permanent magnet.
Abstract: In this paper, an electroless nickel plating and sol–gel combined technique used to prepare the Ni-P/TiO2 composite film on sintered NdFeB permanent magnet is described and the composite film was characterized by X-ray diffraction (XRD), environmental scanning electron microscopy (ESEM), and energy dispersive X-ray spectrometer (EDX). The corrosion resistance of Ni-P/TiO2 film was studied by potentiodynamic polarization and electrochemical impedance spectroscopy (EIS) techniques. The self-corrosion current density (icorr) of Ni-P/TiO2 composite film is 2.38μA/cm2 in 0.5mol/L H2SO4 solution about 33% of that of Ni-P coating and 0.22μA/cm2 in 0.5mol/L NaCl solution about 14% of that of Ni-P coating, respectively. In 0.5mol/L H2SO4 and 0.5mol/L NaCl solutions, the polarization resistance (Rp) of the composite film is 12.5kΩ cm2 and 120kΩ cm2, about 1.6 and 2 times that of Ni-P coating, respectively. The results indicate that Ni-P/TiO2 composite film has a better corrosion resistance than Ni-P coating.
42 citations
TL;DR: In this paper, the authors used 2-hydroxy-5-nonylacetophenone oxime (LIX84I) and 2-ethylhexylphosphonic acid mono-2-hexyl ester (PC88A) as extractant and the accelerator, respectively, for continuous extraction and stripping of nickel in the spent baths.
40 citations
TL;DR: A computer neural network has been developed for the simulation and prediction of plating rate and phosphorus content in the coatings, as a function of electroless plating bath composition and process parameters.
24 citations
Patent•
14 Apr 2008
TL;DR: In this article, an electroless gold plating bath is used to form a plated laminate with a thickness of not smaller than 0.15 μm, which can be used for wire bonding or wire bonding.
Abstract: Part or whole of an electroless gold plating film of a plated film laminate including an electroless nickel plating film, an electroless palladium plating film and an electroless gold plating film is formed by an electroless gold plating using an electroless gold plating bath including a water-soluble gold compound, a completing agent, formaldehyde and/or a formaldehyde-bisulfite adduct, and an amine compound represented by the following general formula R 1 —NH—C 2 H 4 —NH—R 2 or R 3 —(CH 2 —NH—C 2 H 4 —NH—CH 2 ) n —R 4 . The method of the invention does not need two types of baths, a flash gold plating bath and a thick gold plating bath for thickening. Gold plating films of different thicknesses suited for solder bonding or wire bonding can be formed using only one type of gold plating bath. Especially, an electroless gold plating film having a thickness of not smaller than 0.15 μm can be efficiently, effectively formed by use of one plating bath in one step, thereby enabling the process to be simplified along with an attendant advantage in cost.
17 citations
TL;DR: In this article, the effects of Cd 2+ as a stabilizer on the plating rate, bath stability, and phosphorus content, corrosion resistance and microstructure of the deposits were investigated.
Abstract: Bath decomposition is a major problem in the electroless nickel (EN) plating system. Although the stabilization mechanism is far from being fully understood, bath stabilizers are normally added to extend the bath life in a viable EN plating solution. In this study, the effects of Cd 2+ as a stabilizer on the plating rate, bath stability, and phosphorus content, corrosion resistance and microstructure of the deposits were investigated. The deposited films were examined using a scanning electron microscope (SEM) equipped with energy dispersive X-ray (EDX) spectroscopy and the X-ray photo spectroscopy (XPS). The electronic tunneling mechanism was used to elucidate the effect of the Cd 2+ stabilizer on the plating system theoretically. The results calculated from theoretical method agreed well with the experimental data.
TL;DR: In this paper, a commercially available process of electroless nickel plating with co-deposited diamond powders was applied to a steel substrate as an intermediate layer prior to diamond deposition by MPECVD.
TL;DR: In this article, a high-energy ball milling method was used to construct Li/FeS cells, and the surface of the FeS powder was coated with metallic nickel to obtain high initial discharge capacity of 581 mAh/g-FeS.
Abstract: In order to investigate the electrochemical properties of Li/FeS cell, FeS powder was fabricated by using a high-energy ball milling method. Then, surface of FeS powder was coated with metallic nickel. Nickel coating was conducted by using electroless nickel plating method. Nickel chloride (NiCl2 · 6H2O) was used as the nickel ion source for electroless nickel plating. The effects of nickel coating on the electrochemical properties of FeS electrode for Li/FeS cell were investigated by CV measurement and charge/discharge tests. Then, cells for electrochemical tests were assembled by stacking a lithium anode, separator containing liquid electrolyte, and FeS cathode in turn. From the results, electroless nickel plated FeS electrode showed very high initial discharge capacity of 581 mAh/g-FeS. And also, it showed higher discharge capacity than that of bare FeS electrode until the 29th cycle. Therefore, it is found that metallic nickel gives beneficial effects on enhancing the electrical conductivity of FeS cathode material. 82.47.Cb.
Patent•
10 Jan 2008
TL;DR: An electroless nickel plating bath is provided in this article that utilizes hypophosphite ions as a reducing agent and is substantially free of sulphate and sodium ions, which allows for the indefinite use of the solutions without discharging hazardous waste.
Abstract: An electroless nickel plating bath is provided that utilizes hypophosphite ions as a reducing agent and is substantially free of sulphate and sodium ions. Spent nickel in the plating bath is removed using an ion exchange resin and the remaining effluent solution is usable for manufacturing fertilizer compositions. The nickel is processed for inclusion back into the plating bath. Thus, the process of the invention allows for the indefinite use of the solutions without discharging hazardous waste.
09 Apr 2008
TL;DR: It is demonstrated that the integration of inkjetting with plating is an effective method to form high aspect patterns at the demand location.
Abstract: This paper reports on formation of high aspect micro patterns on low temperature co-fired ceramic (LTCC) substrates by integrating micro inkjetting with electroless plating. Micro inkjetting was realized by using an inkjetting printer that ejects ink droplets from a printhead. This printhead consists of a glass nozzle with a diameter of 50 mum and a piezoelectric transducer that is coated on the nozzle. The silver colloidal solution was inkjetted on a sintered CT800 ceramic substrate, followed by curing at 200degC for 60 minutes. As a result, the silver trace with a thickness of 200 nm was obtained. The substrate, with the ejected silver thin film as the seed layer, was then immersed into a preinitiator solution to coat a layer of palladium for enhancing the deposition of nickel. Electroless nickel plating was successfully conducted at a rate of 0.39 mum /min, and the thickness of traces was plated up to 84 mum. This study demonstrates that the integration of inkjetting with plating is an effective method to form high aspect patterns at the demand location.
TL;DR: In this article, the electrochemical properties of electroless nickel-plated alloy 600 specimens exposed to simulated pressurized water reactor (PWR) primary water were experimentally characterized in high temperature and high pressure water condition.
Patent•
21 Aug 2008
TL;DR: In this article, the authors proposed an electroless nickel plating bath which contains a water-soluble nickel salt, organic acid or its salt, hypophosphite or boron compound, and acetylenic compound.
Abstract: PROBLEM TO BE SOLVED: To provide a plating bath which is friendly to human bodies and the environment because no heavy metal ions of Pb, Bi, Tl, Cd or the like are not contained, and practically usable as an electroless nickel plating bath. SOLUTION: The electroless nickel plating bath contains a water-soluble nickel salt, organic acid or its salt, hypophosphite or boron compound, and acetylenic compound, and contains no metallic ions of Pb, Bi, Tl or Cd, and further the plating bath has any of following features (1) to (3), (1) the plating bath further contains sulfur-based compound, (2) the plating bath contains the organic acids or its salts which are (A) amino acid or its salt and hydroxy carboxylic acid or its salt, or (B) hydroxy monocarboxylic acid or its salt and hydroxy polycarboxylic acid or its salt, and (3) the plating bath contains phosphorous acid or its salt. The plating method using the plating bath is also provided. COPYRIGHT: (C)2005,JPO&NCIPI
Patent•
10 Jan 2008
TL;DR: In this article, an electroless nickel plating film is formed on aluminum or an aluminum alloy through a stage where an aluminum oxide film formed on the surface layer of aluminum or a aluminum alloy is removed, so as to form a first electroless n-gram plated film.
Abstract: PROBLEM TO BE SOLVED: To provide a method where, when an electroless nickel plating film is formed on aluminum or an aluminum alloy, and the surface of the aluminum or aluminum alloy is treated, the surface of the aluminum or aluminum alloy can be treated in such a manner that the generation of cracks in the plating is not caused, and further, the warpage of a silicon wafer is suppressed as possible. SOLUTION: An electroless nickel plating film is formed on aluminum or an aluminum alloy through a stage where an aluminum oxide film formed on the surface layer of aluminum or an aluminum alloy is removed, so as to form a first electroless nickel plating film; and a stage where a second electroless nickel plating film is formed on the surface of the first electroless nickel plating film. COPYRIGHT: (C)2008,JPO&INPIT
Patent•
06 Jun 2008
TL;DR: In this article, a method for producing a metal-coated polyimide resin substrate, which comprises: forming an electroless nickel-plated layer containing a component (B) on both surfaces or one surface of a polyimides resin film; and forming an electrically conductive film on the surface of the electroless copper plating or the electro copper placing.
Abstract: Disclosed is a method for producing a metal-coated polyimide resin substrate, which comprises: forming an electroless nickel-plated layer containing a component (B) on both surfaces or one surface of a polyimide resin film; and forming an electrically conductive film on the surface of the electroless nickel-plated layer by the electroless copper plating or the electro copper plating. The method is characterized as follows. Prior to the electroless nickel plating, a treatment of immersing the polyimide resin substrate in a solution comprising an alkali metal hydroxide to thereby render the polyimide resin substrate hydrophilic, a catalyst addition treatment, and a catalyst activation treatment are conducted. The process for forming the electroless nickel layer is divided into two steps. In the first step, an electroless nickel-plated layer having a larger thickness than that formed in the second step is formed, and the resulting layer is subjected to a heat treatment. In the second step, a procedure for forming an electroless nickel-plated layer is conducted again. The method enables to increase the adhesion after thermal aging (i.e., after allowing to left in the atmosphere at 150°C for 168 hours) without deteriorating the initial adhesion which is a measure of the adhesion force of a non-adhesive flexible laminate.
TL;DR: In this paper, an electroless nickel plating on glass fibers was employed to enhance the electric conductivity of fibers, and the effects of metal content and plating time on the conductivity were investigated.
Abstract: In this work, we employed an electroless nickel plating on glass fibers in order to enhance the electric conductivity of fibers. And the effects of metal content and plating time on the conductivity of fibers were investigated. From the results, island-like metal clusters were found on the fiber surfaces in initial plating state, and perfect metallic layers were observed after 10 min of plating time. The thickness of metallic layers on fiber surfaces was proportion to plating time, and the electric conductivity showed similar trends. The nickel cluster sizes on fibers decreased with increasing plating time, indicating that surface energetics of the fibers could become more homogeneous and make well-packed metallic layers, resulting in the high conductivity of Ni/glass fibers.
Patent•
27 Mar 2008
TL;DR: In this paper, an element concentration analysis method of electroless nickel plating capable of performing accurate concentration analysis of a prescribed element such as lead or cadmium included in the plating by using a conventional device has been presented.
Abstract: PROBLEM TO BE SOLVED: To provide an element concentration analysis method of electroless nickel plating capable of performing accurate concentration analysis of a prescribed element such as lead or cadmium included in the electroless nickel plating by using a conventional device, which has been difficult hitherto. SOLUTION: The electroless nickel plating 2 is applied to a plate material 1, and part of the electroless nickel plating 2 is exfoliated by generating a crack thereon, and a sample for element concentration analysis is collected from the exfoliated part. The collected sample is dissolved into an acid solvent to generate sample solution 4, and the sample solution 4 is introduced into an inductively coupled plasma emission spectrometer 10 or an inductively coupled plasma mass spectrometer, to thereby perform concentration analysis of the sample in the sample solution 4, namely, a prescribed element such as lead or cadmium included in the electroless nickel plating 2. COPYRIGHT: (C)2008,JPO&INPIT
Posted Content•
TL;DR: In this paper, the formation of high aspect micro patterns on low temperature co-fired ceramic (LTCC) substrates by integrating micro inkjetting with electroless plating was reported.
Abstract: This paper reports on formation of high aspect micro patterns on low temperature co-fired ceramic (LTCC) substrates by integrating micro inkjetting with electroless plating. Micro inkjetting was realized by using an inkjetting printer that ejects ink droplets from a printhead. This printhead consists of a glass nozzle with a diameter of 50 micrometers and a piezoelectric transducer that is coated on the nozzle. The silver colloidal solution was inkjetted on a sintered CT800 ceramic substrate, followed by curing at 200 degrees C for 60 minutes. As a result, the silver trace with a thickness of 200 nm was obtained. The substrate, with the ejected silver thin film as the seed layer, was then immersed into a preinitiator solution to coat a layer of palladium for enhancing the deposition of nickel. Electroless nickel plating was successfully conducted at a rate of 0.39 micrometers /min, and the thickness of traces was plated up to 84 micrometers. This study demonstrates that the integration of inkjetting with plating is an effective method to form high aspect patterns at the demand location.
Patent•
20 May 2008
TL;DR: In this article, a method of soldering a magnesium alloy workpiece is described, which includes modifying a surface of the workpiece and performing a high phosphorous (7 to 12 wt% of P) electroless nickel plating process on the surface.
Abstract: The present application relates to a method of soldering a magnesium alloy workpiece. The method includes providing a magnesium alloy workpiece; modifying a surface of the magnesium alloy workpiece; performing a high phosphorous (7 to 12 wt% of P) electroless nickel plating process on the surface of the magnesium alloy workpiece; preparing a solder flux for different lead-free tin alloy solder; and performing a tin soldering process to solder the magnesium alloy workpiece with the lead-free tin alloy solder containing its corresponding solder flux.
TL;DR: In this paper, the authors studied the submicron size dependence of electroless nickel plating under ultrasonic irradiation with a frequency of 1 MHz to fabricate a near-field apertured probe.
Abstract: We have studied the submicron size dependence of electroless nickel plating under ultrasonic irradiation with a frequency of 1 MHz to fabricate a near-field apertured probe. Using a new ultrasonic bath with a small water depth of 80 mm, we found that a nickel film with a hollow structure is coated on the flat clad end of a fiber probe. The diameter of the hollow is 12 µm much smaller than the ultrasonic wavelength in water.
TL;DR: In this paper, metal-coated fiber Bragg grating (FBG) temperature sensors were prepared via electroless nickel (EN) plating and tin electroplating methods on the surface of normal bare FBG.
TL;DR: In this article, a technique for nickel recovery from spent electroless nickel-plating solutions was developed, which yields nickel sulfate, a source for preparing an electroless metallic plating solution, and a nickel-containing concentrate.
Abstract: A technique for nickel recovery from spent electroless nickel-plating solutions was developed. The process yields nickel sulfate, a source for preparing an electroless nickel-plating solution, and a nickelcontaining concentrate.
Patent•
19 Mar 2008
TL;DR: In this paper, a method for recovering a nickel ion from an electroless plating waste solution as nickel compound, whose phosphorus content is ≤100 mg/Kg and which is recyclable as resources, is proposed.
Abstract: PROBLEM TO BE SOLVED: To provide a method for recovering a nickel ion from an electroless plating waste solution as nickel compound, whose phosphorus content is ≤100 mg/Kg and which is recyclable as resources. SOLUTION: This method for recovering the nickel source comprises: a regenerating process (A) of the selective heavy metal chelate resin filled up into a column; an adjusting process (B) of the electroless nickel plating waste solution; an adsorption-eluting process (C) for eluting the nickel with inorganic acid after absorbing the nickel ion to the chelate resin by bringing the nickel plating waste solution adjusted in the process (B) into contact with the chelate resin regenerated in the process (A); and a nickel recycling process (D), in which non-soluble nickel compound is precipitated by adding carbonate or alkali hydroxide or oxalic acid of ≥1 equivalent to the nickel salt water solution eluted in the process (C). COPYRIGHT: (C)2010,JPO&INPIT
Patent•
08 Oct 2008
TL;DR: In this article, a method for the phosphorus free and powerless nickel plating on the silicon nanowire was proposed, which is compatible with the process of the integrated circuit, the chemical wet method etching is adopted, the technology is simple and feasible, the cost is low, and the success ratio is high.
Abstract: The invention discloses a method for the phosphorus free and powerless nickel plating on the silicon nanowire. The method comprises the steps that silicon nanowire arrays are made on a silicon substrate by adopting the chemical wet method etching technology, then the sedimentation of the powerless nickel thin film is performed on the silicon nanowire arrays by applying phosphorus free, and finally, the stability of a nickel-silicon nanowire structure is intensified through RTA. The method has the advantages that firstly, the method is compatible with the process of the integrated circuit, the chemical wet method etching is adopted, the technology is simple and feasible, the cost is low, and the success ratio is high; the dimension of the processed nanowire is even, the average height is 30 microns, and the diameter is approximately 60 nanometers. secondly, by adopting the chemical method of phosphorus free and powerless plating to perform the sedimentation of the nickel metal to the surface of the silicon nanowire, the generation of the nickel-phosphorus alloy in the powerless nickel plating technology is overcome, thereby improving the performances such as sensitivity of the electricity, the magnetism and the sensor of the Ni/Si nanowire structure. The technology has advantages of low temperature, simple equipment to required, even plating layer, etc.
Patent•
23 Jul 2008
TL;DR: In this paper, an electroless nickel pre-plating and hot post-galvanizing method for controlling the coating thickness of the silicon-containing reactive steel, which means first performing electroless Nickel plating and then hot dip galvanizing on a silicon-component reactive steel part, is presented.
Abstract: The invention discloses an electroless nickel pre-plating and hot post-galvanizing method for controlling the coating thickness of the silicon-containing reactive steel, which means first performing electroless nickel plating and then hot dip galvanizing on a silicon-containing reactive steel part. The electroless nickel pre-plating and hot post-galvanizing method comprises the following processes: (1) doing pretreatment on the surface of the silicon-containing reactive steel part before electroless nickel plating; (2) carry out electroless nickel plating on the surface of the silicon-containing reactive steel part, wherein, the nickel salt used is NiSO4 x 6H2 O, the reducing agent is NaH2PO2 x H2O, and the complexing agent is C6H5Na3O7 x 2H2O; (3) after drying the silicon-containing reactive steel part undergoing electroless nickel plating, conducting hot dip galvanizing on the reactive steel part. The electroless nickel pre-plating and hot post-galvanizing method for controlling the coating thickness of the silicon-containing reactive steel has the advantages of effectively controlling the coating of the hot galvanized silicon-containing reactive steel from thickening exceedingly, thus obtaining a coating with appropriate thickness, smooth surface and good adhesivity, consuming less nickel, and accomplishing the goal of preventing the hot galvanized coating of the silicon-containing reactive steel from excessively thickening by electrolessly plating a nickel coating with a thickness of 3 to 4 microns on the reactive steel part. Moreover, the pre-plate nickel coating can prevent the iron in steel part from dissolving in the zinc bath, thus greatly reducing the formation amount of zinc dross, and reducing the loss of zinc.
TL;DR: In this article, the effects of various ligands in the bath on electroless nickel plating on magnesium alloy were investigated to improve the qualities of coating and the bath stability and to decrease the plating temperature.
Abstract: The effects of various ligands in the bath on electroless nickel plating on magnesium alloy were investigated to improve the qualities of coating and the bath stability and to decrease the plating temperature. A scanning electronic Microscopy is employed to characterise the surface morphology and an energy dispersed X-ray spectrometer is used to measure the phosphor content. Corrosion resistance and adhesion of the coating are assessed by 5% NaCl solution for 30 h and by thermal shock test, respectively. The results show that the Ni–P coating plated at 70°C in the pH 5·5 ternary ligand bath has higher coverage and better compactness. The ternary combination of citric acid, succinic acid and glycine in the plating solution has obvious synergic effects in improving the coating qualities and the bath stability. The plating temperature is successfully receded to 70°C.