Showing papers on "Electroless nickel plating published in 2009"
TL;DR: In this article, an appropriate molybdate pretreatment layer was proposed to reduce the potential difference between the Ni-P coating and the substrate, and enhanced the corrosion resistance of the alloy to a certain extent.
51 citations
TL;DR: In this paper, tungsten particles were coated using nickel/nickel-phosphorus electroless plating technique to achieve compact material of cylindrical shape with same porosity.
Abstract: In the present research, tungsten particles were coated using nickel/nickel–phosphorus electroless plating technique. The coated tungsten powders were pressed under constant pressure to achieve compact material of cylindrical shape with same porosity. Then, attained compacts were infiltrated/penetrated by liquid copper under the hydrogen atmosphere in order to obtain W–15 wt.% Cu composites. The coated/uncoated powders as well as its infiltrated compacts were characterized by optical microscopy (OM) as well as scanning electron microscopy (SEM), EDS and XRD methods. The microstructure, relative density and specific resistivity of composites were compared. The microstructural observations revealed that the infiltration behavior can be improved in the compacts prepared by both nickel and nickel–phosphorus coated tungsten powders, in comparison with uncoated ones. In addition, it was found that relative density may be raised from 95% by nickel electroless plating, that leads to decrease specific resistivity from 6 to 4 µΩ cm. Enhancement of electrical conductivity of infiltrated W–15 wt.% Cu compacts prepared by electroless nickel coated tungsten powders was related to its higher density.
46 citations
TL;DR: In this paper, a Ni 3 Al-hBN-Ag intermetallic matrix composite coating was prepared on Ni-based superalloy by reactive sintering, and the crystalline phase and microstructure of the coating were examined by means of X-ray diffraction (XRD), scanning electron microscopy (SEM), and energy dispersive spectroscopy (EDS).
41 citations
TL;DR: In this article, a method of fabricating roller mold with micro-structures on the surface using novel stepped rotating lithography and electroless nickel plating was proposed, which proved that the microstructures can be successfully fabricated onto the metal roller using the proposed procedure.
39 citations
TL;DR: A novel method for the preparation of ink-jet printing ink with palladium (Pd) nanoparticles reduced by styrene (St) oligomers is presented in this article.
38 citations
TL;DR: In this article, a facile surface activation for electroless nickel plating was proposed, avoiding complex surface functionalization or pretreatment, and the results indicated that the coatings of Ni/PS microspheres were smooth, compact and uniform.
26 citations
TL;DR: The effects of the operation parameters on the extraction efficiency were quantitatively studied on the basis of the pseudo-first-order interfacial extraction rate equation together with the hydrodynamic properties in the mixer.
25 citations
18 Nov 2009
TL;DR: In this paper, the results of a seed and plate technology, based on electroless nickel plating on industrial substrates, were presented, and the evaluation of the laser ablation + nickel process on high efficiency structures has delivered FF over 80%.
Abstract: This paper presents the results of a seed and plate technology, based on electroless nickel plating on industrial substrates. Through the photoassisted surface activation of the cells homogeneous NiP coatings, about 30-50 nm thick have been deposited. The combination of this step with inkjet masking and etching has been compared with laser ablation and with standard screen printed cells on industrial solar cells. An improvement of 0.5% absolute in efficiency has been achieved thanks to the use of nickel contacts. The advantages and disadvantages of each structuring process are introduced. The evaluation of the laser ablation + nickel process on high efficiency structures has delivered FF over 80%.
25 citations
TL;DR: In this paper, the effects of nickel precipitation and the cut-off voltage on the electrochemical properties of a pyrite cathode were investigated by using an electroless nickel-plating method.
22 citations
Patent•
28 May 2009TL;DR: In this article, an electroless nickel plating solution composition, a flexible printed circuit board and a manufacturing method thereof are presented. And more particularly, the authors present a manufacturing process capable of simultaneously satisfying plating characteristics respectively required for a pad unit and external connection units.
Abstract: The present invention relates to an electroless nickel plating solution composition, a flexible printed circuit board and a manufacturing method thereof, and more particularly, to an electroless nickel plating solution composition, a flexible printed circuit board and a manufacturing method thereof capable of simultaneously satisfying plating characteristics respectively required for a pad unit and external connection units of the flexible printed circuit board by forming a nickel plating layer having a vertical growth structure with the electroless nickel plating solution composition including a water-soluble nickel compound, a reducing agent, a complexing agent and a vertical growth inducer.
20 citations
Patent•
21 Jan 2009
TL;DR: In this article, the authors provided a formulation of medium-temperature acidic electroless nickel-phosphorus alloy, which is characterized in that the formulation is as follows: 25 to 30 grams of nickel sulfate per liter, 25 to 35 grams of sodium hypophosphite per liter.
Abstract: The invention provides a formulation of medium-temperature acidic electroless nickel-phosphorus alloy, which is characterized in that the formulation is as follows: 25 to 30 grams of nickel sulfate per liter, 25 to 35 grams of sodium hypophosphite per liter, 12 to 18 grams of sodium acetate per liter, 05-13 milligrams of thiourea per liter, 7 to 13 milliliters of lactic acid per liter, 7 to 13 milliliters of acetic acid per liter, 4-10 grams of organic acid per liter, 5-16 milligrams of potassium iodide or potassium iodate per liter, and the loadage is between 05 and 15 dm /L The invention has the advantages that: the formulation improves the stability of a plating solution, obviously improves plating rate, has good corrosion resistance and the comprehensive properties of plating; the stability of the plating solution can reach over 1800 s; the stability of periodic experiments is more than ten periods; the corrosion resistance of the plating reaches over 130 s; and the hardness of the plating reaches 480 HV
TL;DR: In this article, it was shown that phosphine compounds being a typical type of coordination ligand used in homogeneous catalysis are known to possess a tunable affinity with the nickel atom.
Abstract: Phosphine (R3P) compounds being a typical type of coordination ligand used in homogeneous catalysis are known to possess a tunable affinity with the nickel atom. As such, it deserves to be studied ...
TL;DR: A simple method for the formation of palladium nanoparticles on aluminum and aluminum oxide surface is demonstrated in this article, where the method is combined with the electroless nickel plating, which facilitates two steps metallization technique on the respective surfaces.
TL;DR: In this article, the properties of composite microspheres, such as chemical composition and crystal texture of the coating, mechanical properties, density, and magnetism, were characterized by SEM, EDS, XRD, and VSM.
Abstract: PS/Ni microspheres were prepared by electroless nickel plating on PS microspheres Several parameters for plating were optimized in order to obtain integrated and uniform nickel coatings The properties of obtained composite microspheres, such as chemical composition and crystal texture of the coating, mechanical property, density, and magnetism, were characterized by SEM, EDS, XRD, and VSM It was revealed that several parameters, such as thiourea dosage, reaction temperature, and load, had significant influence on fabrication of integrated and homogeneous nickel shell It was also demonstrated that the properties of the PS/Ni microspheres, such as nickel weight ratio, density, and magnetism, can be tuned by adjusting the load POLYM COMPOS, 2009 © 2008 Society of Plastics Engineers
Patent•
30 Nov 2009
TL;DR: In this article, an electroless nickel plating bath containing at least the iron ion source and the iodide ion source was shown to suppress decomposition without using harmful metal species to stabilize the plating water.
Abstract: Disclosed is an electroless nickel plating bath not containing harmful metal species. In the electroless nickel plating bath, there are contained at least an iron ion source and an iodide ion source. With the use of the electroless nickel plating bath containing at least the iron ion source and the iodide ion source, it is possible to suppress decomposition of the plating bath without using harmful metal species to stabilize the plating bath.
Journal Article•
TL;DR: In this article, a nickel-phosphor coating was prepared on the surface of AZ91D magnesium alloy by electroless plating, which was so uniform and dense that it had no obvious surface defects.
Abstract: A nickel-phosphor coating was prepared on the surface of AZ91D magnesium alloy by electroless plating.The coating was so uniform and dense that it had no obvious surface defects.The structure of the coating was single phase (Ni) by X-ray diffraction and the adhesion was good by quenching.By dynamic potential polarization,it was shown that the free corrosion potential of the coating approached -0.4 V(SCE) and it had evident passivation.The coating had better corrosion resistance than the substrate,and had extensive application prospect.
Patent•
03 Dec 2009TL;DR: In this article, a metal wiring structure, including an electroless nickel plating layer formed on an insulation layer, and a surface treatment layer, is described, which can be easily fabricated.
Abstract: Disclosed herein is a metal wiring structure, including: an electroless nickel plating layer formed on an insulation layer; and a surface treatment layer formed on the electroless nickel plating layer, and a method of fabricating the same. The metal wiring structure has excellent adhesivity without regard to the kind of substrate and can be easily fabricated.
TL;DR: In this paper, the conditions required for forming a hybrid coating consisting of an outer nickel aluminide layer and an inner nickel layer on alloy steels were investigated and the effect of phosphorus or boron content in the initial nickel layer was investigated in relation to the spallation tendency of the coating either immediately after the aluminizing process or during the thermal annealing post-aluminising process.
Abstract: The present study investigates the conditions required for forming a hybrid coating consisting of an outer nickel aluminide layer and an inner nickel layer on alloy steels. A commercial alloy steel of 9Cr–1Mo was used as a substrate. Electroless and electronickel plating processes were used to form an initial nickel layer on the steel. The AlCl3 activated packs containing pure Al as a depositing source were then used to aluminise the nickel deposit at temperatures ≤650°C. The effect of phosphorus or boron content in the initial nickel layer deposited with the electroless nickel plating solutions using hypophosphite or boron–hydrogen compound as reducing agent was investigated in relation to the spallation tendency of the coating either immediately after the aluminising process or during the thermal annealing post-aluminising process. Under the aluminising conditions used, the outer nickel aluminide layer formed was Ni2Al3. For the electroplated nickel deposit, the growth kinetics of the outer Ni2A...
Patent•
23 Sep 2009
TL;DR: In this article, a method of electroless nickel plating on silicon substrate microchannel, comprising of the following steps: prepared microchannel is put into aqueous solution containing 1% of polyoxyethylene octyl phenyl ether to be soaked for 10-30 seconds; hexahydrated nickel, sodium dodecyl sulfate, fluorinated ammonia, sodium citrate, ammonia water and ammonium sulfate are prepared into solution; the microchannel in step 1 is washed by deionized water and put into the solution, alkaline condition of the solution is preserved at
Abstract: The invention discloses a method of electroless nickel plating on silicon substrate microchannel, comprising the following steps: prepared microchannel is put into aqueous solution containing 1% of polyoxyethylene octyl phenyl ether to be soaked for 10-30 seconds; hexahydrated nickel, sodium dodecyl sulfate, fluorinated ammonia, sodium citrate, ammonia water and ammonium sulfate are prepared into solution; the microchannel in step 1 is washed by deionized water and put into the solution, alkaline condition of the solution is preserved at a pH value of 75-85, the temperature is controlled at 80-85 DEG C, and the solution is deposited for 5-10 minutes; the microchannel is taken out after the deposition and is washed by deionized water, thus obtaining 3D current collecting layer with high specific surface area The electroless nickel deposition technology of the silicon substrate microchannel has the advantages of low cost, simple operation and easy realization; the microchannel has uniform porosity and comparatively large specific surface area and aspect ratio
TL;DR: In this article, a relatively low-temperature alkaline plating process was developed for electroless nickel (EN) plating on n-type (100) silicon wafers, and simple ethanol pretreatment of the substrate is practicable for obtaining an EN layer with a good adhesion strength of about 9.8 to 14.7 MPa.
Abstract: In the study of electroless nickel (EN) plating on n‐type (100) silicon wafers, a relatively low‐temperature alkaline plating process is developed. Further experiments show that simple ethanol pretreatment of the substrate is practicable for obtaining an EN layer with a good adhesion strength of about 9.8 to 14.7 MPa. Both sodium tungstate and sodium fluoride can be used to decrease the threshold plating temperature from near 80°C to 65°C. The phosphorous content of the as‐plated layer is slightly higher than 7 wt.%.
Patent•
19 Feb 2009
TL;DR: In this paper, a method for manufacturing a magnetic steel component as regards magnetic steel that is used in the construction of aircraft and industrial components generally including solenoids and electric motors was proposed.
Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a magnetic steel component as regards magnetic steel that is used in the construction of aircraft and industrial components generally including solenoids and electric motors SOLUTION: An electroless nickel plating is formed on a substrate 10 that includes magnetic steel A thermal cycle is thereafter performed at a temperature that is sufficiently high to sinter the electroless nickel plating and thereby form a densified plating 16 on the substrate 10 According to one embodiment, the thermal cycle includes a solid state diffusion sintering process wherein the substrate 10 and the densified plating 16 are heated to a temperature of at least about 1,300°F (about 704°C) but below the melting temperature of the electroless nickel plating According to another embodiment, the thermal cycle includes a transient liquid phase sintering process wherein the substrate 10 and the densified plating 16 are heated at least to the melting temperature of the electroless nickel plating COPYRIGHT: (C)2009,JPO&INPIT
Patent•
19 Aug 2009
TL;DR: In this paper, a pole plate material of a super-capacitor is used to make a silicon micro-channel, which is then used as a substrate for the micro-electro-mechanical system silicon process.
Abstract: The invention relates to a pole plate material of a super-capacitor, and a preparation method thereof, which are based on the micro-electro-mechanical-system silicon process and belong to the filed of capacitor manufacturing. In the pole plate material of the super-capacitor, a nickel protoxide thin film is wrapped on a silicon micro-channel substrate layer. The preparation method of the material comprises the following steps: an electrochemistry method is used for making a silicon micro-channel which is then taken as a substrate; after surface pretreatment is finished, a nickel layer is deposited in an electroless nickel plating solution; finally, fast thermal annealing is carried out in the atmosphere of oxygen; and nickel protoxide/silicon micro-channel compound material is formed. The pole plate material of the super-capacitor has large specific area and high chemical activity, is beneficial for electrolyte to be in better contact with active materials and can obtain relatively high charge storage capability and better capacitance characteristic; in addition, the combination of the pole plate material with the current micro-electronic processing technique can cause the super-capacitor to be easier for miniaturization and integration.
Patent•
30 Jan 2009
TL;DR: In this article, the authors propose a method of extending the lifetime of an electroless nickel plating bath by avoiding the addition of unwanted anions to the process and of improving the pH stability of the bath and minimizing additions of pH correcting additives.
Abstract: A method of extending the lifetime of an electroless nickel plating bath by avoiding the addition of unwanted anions to the process and of improving the pH stability of the bath and minimizing additions of pH correcting additives. The method includes the steps of (a) depositing electroless nickel from an electroless nickel plating bath onto a substrate, wherein the electroless nickel plating bath preferably contains a source of nickel ions and a source of hypophosphite ions; (2) immersing a nickel anode in the plating bath; (3) completing the circuit by utilizing a cathode separated from the nickel bath by an ion exchange membrane and using a catholyte comprising an acid or a salt thereof; and (4) passing a current through the bath. Nickel is dissolved into the plating bath to maintain the nickel concentration and hydrogen is discharged from the cathode.
Patent•
26 Nov 2009
TL;DR: In this paper, the back surface of the semiconductor substrate is made thin by back grinding and etching on the entire back surface thereof, and a buffer layer and a collector layer are formed on the back surfaces of the substrate.
Abstract: Provided is a process for fabricating a semiconductor device wherein an electrode is not peeled off easily from a semiconductor substrate. A front-surface electrode or the surface structure of a device is formed on the front surface of the semiconductor substrate (1). The semiconductor substrate (1) is then made thin by performing back grinding and etching on the entire back surface thereof. Subsequently, a buffer layer and a collector layer are formed on the back surface of the semiconductor substrate (1), which has been made thin, by performing ion implantation and heat treatment. Thereafter, a titanium film (12) and a nickel film are formed, as a back-surface electrode, sequentially on the back surface of the semiconductor substrate (1) by deposition or sputtering. Thereafter, electroless nickel plating and substitution gold plating are performed continuously, and a nickel plated film (14) and a substitution gold plated film (15) are formed simultaneously on the opposite sides of the front-surface electrode and the back-surface electrode of the semiconductor substrate (1), thus forming a collector electrode (9). As a preprocessing of electroless nickel plating, double zincate processing is performed on the front-surface electrode of the semiconductor substrate (1).
Patent•
03 Sep 2009
TL;DR: In this article, a method for increasing the solderability of a substrate by cleaning and removing surface contaminants was proposed, and a first nickel layer was plated directly onto the substrate by using an electrolytic or electroless nickel plating process.
Abstract: A first preferred method for increasing the solderability of a substrate comprising: preparing the substrate for nickel plating by cleaning and removal of surface contaminants; plating a first nickel film of the desired thickness directly onto the substrate; preparing the nickel film comprising thoroughly cleaning the surface; depositing a substantially pure nickel film directly on the first nickel film using a suitable PVD technique; and applying solder to the substantially pure nickel film. Another preferred method for increasing the solderability of a substrate comprising plating a first nickel layer directly onto the substrate by using an electrolytic or electroless nickel plating process; depositing a substantially pure nickel film directly on the first nickel film using physical vapor deposition; and applying solder to the substantially pure nickel film.
TL;DR: The nickel sealed double-coated optical fiber as mentioned in this paper is constructed from the double-covered optical fiber sealed with a nickel layer that is fabricated using electroless plating, which exhibits good electrical conductivity, high mechanical strength, high resistance to moisture attack and microbending insensitivity.
Abstract: The nickel sealed double-coated optical fiber is constructed from the double-coated optical fiber sealed with a nickel layer that is fabricated using electroless plating. The nickel sealed double-coated optical fiber exhibits good electrical conductivity, high mechanical strength, high resistance to moisture attack and microbending insensitivity. Moreover, the external damage protection, abrasion resistance, adhesion, toughness and stripping force of coatings fit the fiber requirement. As the nickel film thickness is 68 nm, the fiber has the excellent ability to sustain thermal loading. Nickel sealed double-coated optical fibers are superior to conventional double-coated optical fibers and hermetically coated optical fibers for use as optical transmission lines.
Journal Article•
TL;DR: In this article, a composite consisting of quaternary additions, a ceramic phase, WC, within a matrix of Ni WC and etc., has been prepared at the temperature range 500°C - 900°C under Ar shroud.
Abstract: Nickel matrix reinforced with WC has been manufactured by microwave sintering at various temperatures. A uniform nickel layer on WC powders was deposited prior to sintering using electroless plating technique, allowing close surface contact than can be achieved using conventional methods such as mechanical alloying. The reactivity between WC powders to form compounds is controlled through Ni layer existing on the starting powders. A composite consisting of quaternary additions, a ceramic phase, WC, within a matrix of Ni WC and etc., has been prepared at the temperature range 500°C - 900°C under Ar shroud. XRD (X-Ray diffraction, SEM (Scanning Electron Microscope), compressive testing and hardness measurements were employed to characterize the properties of the specimens. Experimental results carried out for 900°C suggest that the best properties as σ max and Vikers Hardness (HV) were obtained at 900°C and the microwave sintering of electroless Ni plated WC powders can be used to produce ceramic reinforced Nickel composites. Key Words : Microwave sintering, Powder metallurgy, Ceramic-Metal composites and electroless Nickel plating.
Patent•
19 Feb 2009
TL;DR: In this paper, a stabilizer of non-electrolytic nickel plating solution is provided to prevent generation of bath analysis during plating in long time by using a thallic compound and a thio-compound.
Abstract: A stabilizer of non-electrolytic nickel plating solution is provided to prevent generation of bath analysis during plating in long time by using a thallic compound and a thio-compound. A stabilizer of non-electrolytic nickel plating solution comprises: 5mg/L~500mg/L of thio-compound selected from thioglycolic acid, dithioglycolic acid, thiodiglycolic acid and dithiodiglycolic acid; and 0.5mg/L~50mg/L of thallic compound selected from thallium nitrate and thallium sulfate.
TL;DR: In this article, the defects free electroless Ni-P deposits for heavy coating were examined, and the authors found that selection of complexing agent, elimination of insoluble particles from the plating solution using fine filtration, selection of pH adjustor and operating conditions are critical factors to avoid these defects.
Abstract: Deposition of a heavier coating requires more careful attention to process control to prevent nodules and pitting. Electroless nickel plating is sensitive to deficiencies such as pit, pinhole and nodules. These defects are generally caused by the bath ingredients and operating conditions. This study specifically examined that the defects free electroless Ni-P deposits for heavy coating. Results of our investigation show that selection of complexing agent, elimination of insoluble particles from the plating solution using fine filtration, selection of pH adjustor and operating conditions are critical factors to avoid these defects.