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Showing papers on "Electroless nickel plating published in 2011"


Journal ArticleDOI
TL;DR: In this article, a palladium and etchant-free process for the electroless nickel plating of poly(ethylene terephthalate) (PET) fabric has been developed, which can be prepared in three steps: (i) the grafting of thiol group onto PET, (ii) the silver Ag0 seeding of the PET surface, and (iii) the nickel metallization using electroless plating bath.

45 citations


Journal ArticleDOI
Ping Lu1, Yin Liu, Meiqing Guo1, Haidong Fang1, Xinhua Xu1 
TL;DR: The electroless nickel plating/poly(dl -lactide-co-glycolide) composite coating (EN-plating/PLGA composite coating) was fabricated on the surface of the micro-arc oxidation (MAO) film of the magnesium alloy AZ81 to double control the corrosion and drug release in the hanks' solution as discussed by the authors.

36 citations


Journal ArticleDOI
TL;DR: In this article, the microstructure and corrosion behavior of electroless Ni-P alloy plating on 6061 aluminum alloys substrate in an alkaline plating bath with sodium hypophosphite as reducing agent were investigated.
Abstract: The microstructure and corrosion behavior of electroless Ni–P alloy plating on 6061 aluminum alloys substrate in an alkaline plating bath with sodium hypophosphite as reducing agent were investigated. The effects of bath temperature on the plating rate, compositions, and microstructure of the electroless Ni–P deposits were studied. The results showed that the deposition rate and the P content of the electroless Ni–P deposits increased with the rise of the bath temperature. Scanning electron microscopy (SEM) of the deposits showed nodular structure for binary deposits. X-ray diffraction patterns of all the deposits revealed a single and broad peak which indicated the amorphous structure of the deposits. Corrosion resistance of the Ni–P coatings was evaluated by potentiodynamic polarization. The results indicated that electroless Ni–P plating could obviously improve the corrosion resistance of 6061 aluminum alloy.

36 citations


Journal ArticleDOI
TL;DR: In this article, a solid phase extraction (SPE) system using a molecular recognition technology (MRT) gel was used for the selective separation of trace levels of lead (Pb) from the waste discharge of ENP operations, followed by subsequent analysis with inductively coupled plasma optical emission spectrometry (ICP-OES).

26 citations


Journal ArticleDOI
TL;DR: In this paper, a chromium-free pickling process of magnesium alloys in H 3 PO 4 + Na 2 MoO 4 solution for electroless Ni-P plating was described.
Abstract: A chromium-free pickling process of magnesium alloys in H 3 PO 4 + Na 2 MoO 4 solution for electroless Ni–P plating was described. The dosage of Na 2 MoO 4 was established by detecting adhesion and corrosion resistance of chemical nickel coatings. Electrochemical behaviors of pickling solution of H 3 PO 4 + Na 2 MoO 4 and NH 4 HF 2 activation solution were investigated with the open circuit potential curves and the polarization curves. The results show that the Na 2 MoO 4 has strong inhibition ability. Na 2 MoO 4 in H 3 PO 4 solution can reduce active sites of microcathodic and microanodic zones in the corrosion cells of the substrate surface of magnesium alloys and plays an inhibition role. The activation film with some oxides and fluorides can prevent the substrate magnesium from the fierce displacement and corrosion reaction of electroless plating bath. The chemical Ni–P coating with good adhesion and corrosion resistance was obtained by the pretreatment of 200 cm 3 dm −3 85% H 3 PO 4 + 5 g dm −3 Na 2 MoO 4 pickling bath and activation in 200 g dm −3 NH 4 HF 2 solution. This procedure of surface pretreatment before electroless nickel plating can replace the existing acid pickling containing chromium and HF activation.

26 citations


Journal ArticleDOI
TL;DR: In this article, the corrosion resistance of black electroless nickel-phosphorus coatings with or without heat treatment, with five types of top organic coatings, and with three conversion coatings was investigated by the polarization measurements and the salt spray test.

23 citations


Patent
02 Feb 2011
TL;DR: In this article, a method for performing electroless nickel plating on the surface of aluminum nitride ceramic, belonging to the ceramic thin-film metallization field, is described.
Abstract: The invention provides a method for performing electroless nickel plating on the surface of aluminum nitride ceramic, belonging to the ceramic thin-film metallization field The method comprises the following specific steps: 1) polishing the surface of aluminum nitride with a machinery; coarsening the aluminum nitride substrate with mixed acid or alkali, completely cleaning away the residual acid or alkali; 3) sensitizing the coarsened substrate in stannous chloride solution, activating in palladium chloride solution or performing activation without palladium; 4) weighting a certain amount of nickel sulphate, sodium hypophosphite, sodium citrate, sodium acetate, lactic acid, thiourea and sodium dodecyl sulfate in sequence to prepare a chemical plating solution; and 5) adjusting the pH value of the solution to 40-60 with acid or alkali, heating the solution to 70-95 DEG C, and placing the prepared substrate in the solution to perform electroless nickel plating The invention is characterized in that the electroless nickel plating can be performed on the surface of the aluminum nitride ceramic substrate which is difficult to plate; and a certain amount of surfactant is added so that the plating becomes denser and smoother, the binding force between the plating and the substrate is increased, and the solderability of the plating is better

20 citations


Journal ArticleDOI
Jing Jin1, Chuming Liu1, Shengli Fu1, Yanrui Gao1, Xin Shu1 
TL;DR: In this paper, a new pretreatment process for electroless Ni-P plating on Mg-10Gd-4.8Y-0.6Zr was investigated.
Abstract: A new pretreatment process for electroless Ni-P plating on Mg-10Gd-4.8Y-0.6Zr was investigated in this paper. The morphology, component, chemical composition and structure of the pretreatment layers and Ni-P coating were analyzed by scanning electronic microscopy, energy dispersive spectroscopy and X-ray diffraction spectroscopy. The structure of Ni-P coating was also detected by transmission electron microscopy (TEM). Potentiodynamic polarization analysis and salt spray test were used to test the corrosion resistance of the Ni-P coating. Experimental results indicate that: metal Cr generated in the new pretreatment process, which provided active points for later zinc immersion process, was beneficial to nickel deposition. The subsequent Ni-P coating was amorphous, in which the content of P was 9.43 wt.%. It was uniform and its thickness reached about 50 μm at 2 h deposition. Compared to Mg-10Gd-4.8Y-0.6Zr alloy substrate, the corrosion potential of the coated alloy shifted by 1090 mV positively and the corrosion current density decreased one order of magnitude in 3.5 wt.% NaCl solution. The salt spray test time of Ni-P coating was 210 h. All of these results suggest that the electroless nickel plating procedure researched in this paper is suitable for Mg-10Gd-4.8Y-0.6Zr alloy.

20 citations


Journal ArticleDOI
TL;DR: In this article, the preparation and study of composite electroless nickel-phosphorus coatings with different sizes of diamond particles on a steel substrate, for use in including being used for special tooling parts, has been presented.
Abstract: The preparation and study of composite electroless nickel–phosphorus coatings with different sizes of diamond particles on a steel substrate, for use in including being used for special tooling parts, has been presented. The parts with the above dispersed coatings possess an abrasion resistance many times higher than those without diamond particles. Investigations on the influence of size of the particle (in the range 20–80 and 110 μm) on their inclusion and the thickness of the coatings have been carried out. The elemental composition and surface morphology were determined by microbe analysis in relation to the deposition kinetics. The problem of the adhesion of the coating to the substrate has been studied and overcome by an initial strike plating of nickel–phosphorus followed by nickel–phosphorus plating with included diamond particles. The electroless technology for deposition of nickel–phosphorus coatings dispersed with diamond powder on steel substrates for the production of diamond tooling ...

19 citations


Journal ArticleDOI
TL;DR: In this paper, the development of NiAl-matrix composite and its production by reactive sintering powder metallurgy was devoted to the development and production by NiAl−Al2O3 composites, and various types of reinforcement (aluminium oxide, silicon and tungsten carbides, titanium silicide) were tested.
Abstract: This work was devoted to the development of NiAl–matrix composite and its production by reactive sintering powder metallurgy. Various types of reinforcement (aluminium oxide, silicon and tungsten carbides, titanium silicide) were tested. The best chemical compatibility and the highest hardness and wear resistance were achieved by Al2O3 fibres. Electroless nickel plating pretreatment of Al2O3 fibres improves both distribution of fibres and hardness of the composite. However, it strongly reduces the wear resistance, probably due to phosphorus content in the nickel coating. In situ formation of NiAl–Al2O3 composites by reactive sintering of a pressed powder mixture of Ni, Al and NiO was unsuccessful. Only a small amount of cubic γ-Al2O3 was detected after reactive sintering and hence no significant hardness increase was observed.

19 citations


Journal ArticleDOI
So-Young Cheon1, So-Yeon Park1, Young-Mok Rhym, Doohyun Kim, Jae-Ho Lee1 
TL;DR: In this article, the pore sizes of carbon substrates were 16-20μm and over 20μm, respectively, and the minimum concentration of PdCl 2 for the electroless nickel plating was 10-ppm in acidic bath and 5-pm in alkaline bath.

Journal ArticleDOI
TL;DR: In this paper, a microwave-assisted activation method for electroless plating on PMMA microspheres is presented, where the microwave irradiation was applied during the activation step, and the amount of the Pd species adsorbed on the PMMA surfaces was much higher than that of sample pretreated with a conventional activation process without microwave irradiated.

Journal ArticleDOI
TL;DR: In this paper, the influence of anionic surfactant on the composition of yttria stabilised zirconia (YSZ) cermet coatings applied by electroless nickel plating technique was examined.
Abstract: The influence of a surfactant on the composition of nickel – yttria stabilised zirconia (YSZ) cermet coatings, applied by electroless nickel plating technique was examined. The amphiphilic characteristics of anionic surfactant sodium dodecyl sulphate (SDS), was relied upon for enhanced dispersion of YSZ particles co-deposited for use as anodes in solid oxide fuel cell technology and potential heat absorbing layers in thermal barrier coatings. Optical microscopy was employed to study the correlation between the plating thickness, level of ceramic loading and SDS concentration while the effect of the surfactant and fineness of YSZ particles on the as-deposited coating’s ceramic to metal ratio, was analysed using energy dispersive X-ray analysis (EDXA) characterisation technique.

Patent
20 Jul 2011
TL;DR: In this paper, a method for treating a metal surface to reduce corrosion thereon and/or to increase the reflectance of the treated surface is proposed, which is useful for increasing the solderability of the metal surface in electronic packaging applications.
Abstract: A method for treating a metal surface to reduce corrosion thereon and/or to increase the reflectance of the treated surface, the method comprising a) plating a metal surface with an electroless nickel plating solution; and thereafter b) immersion plating silver on the electroless nickel plated surface, whereby corrosion of the metal surface is substantially prevented and/or the reflectance of the silver plated surface is substantially improved. The treating method is useful for increasing the solderability of the metal surface, for example, in electronic packaging applications.

Patent
26 Jan 2011
TL;DR: An electroless nickel plating solution for solar cell electrode, which comprises SiN x and Si patterned structure, is disclosed in this article, which is suitable for being used in the fabrication of the electrodes of the solar cell.
Abstract: An electroless nickel plating solution for solar cell electrode, which comprises SiN x and Si patterned structure, is disclosed. The electroless plating solution of the present invention comprises: nickel ion; a reducing agent; a first chelating agent; a second chelating agent; and water. The electroless plating solution of the present invention has high selectivity between Si and SiN x and is harmless to the aluminum-based layer, therefore is suitable for being used in the fabrication of the electrodes of the solar cell.

Journal ArticleDOI
TL;DR: In this paper, a solvent impregnated resin (SIR) containing 2-ethylhexylphosphonic acid mono-2-hexylhexyl ester (EHPNA) extractant was tested for zinc removal from aqueous solutions, including the real electroless nickel plating bath employed for an aluminum alloy substrate, in order to extend the bath life.
Abstract: A solvent impregnated resin (SIR) containing 2-ethylhexylphosphonic acid mono-2-ethylhexyl ester (EHPNA) as the extractant was tested for zinc removal from aqueous solutions, including the real electroless nickel plating bath employed for an aluminum alloy substrate, in order to extend the bath life. The SIR effectively and selectively adsorbed zinc over nickel without any pH adjustment from the plating bath, although the adsorption was significantly suppressed by the complexation of the zinc ion by the hydrogen phosphite and dihydrogen phosphite ions. The Langmuir adsorption isotherm was used to correlate the zinc adsorption data and the SIR containing 30 wt% EHPNA, exhibited the maximum adsorption capacity of 0.51 mmol/g-dry-SIR corresponding to a zinc- to-EHPNA molar ratio of 1:2. Repeated column adsorption and elution tests for 15 cycles showed that the adsorption ability of the SIR gradually decreased suggesting that the durability of the resin should be improved.

Patent
26 Jan 2011
TL;DR: In this article, a method of providing solar cell electrode by electroless plating and an activator used therein is described, which can be performed without silver paste, and comprises steps: (A) providing a silicon substrate; (B) contacting the silicon substrate with an activators, wherein the activator comprises: a noble metal or a noble metals compound, a thickening agent, and water; (C) washing the substrate by a cleaning agent; and (D) dipping the substrate in an electroless nickel plating solution.
Abstract: A method of providing solar cell electrode by electroless plating and an activator used therein are disclosed. The method of the present invention can be performed without silver paste, and comprises steps: (A) providing a silicon substrate; (B) contacting the silicon substrate with an activator, wherein the activator comprises: a noble metal or a noble metal compound, a thickening agent, and water; (C) washing the silicon substrate by a cleaning agent; (D) dipping the silicon substrate in an electroless nickel plating solution to perform electroless plating. The method of providing solar cell electrode by electroless plating of the present invention has high selectivity between silicon nitride and silicon, large working window, and is steady, easily to be controlled, therefore is suitable for being used in the fabrication of the electrodes of the solar cell substrate.

Patent
05 Jul 2011
TL;DR: In this article, an electroless nickel plating solution that can suppress the mixing of environmentally hazardous substances other than nickel into a plating film as much as possible, and can provide an excellent stability and excellent mechanical properties.
Abstract: Disclosed is an electroless nickel plating solution that can suppress the mixing of environmentally hazardous substances other than nickel into a plating film as much as possible, and can provide a plating film having excellent stability and excellent mechanical properties. about. An electroless nickel plating film containing 0.5 to 4% by weight of phosphorus, 0.01 to 2% by weight of boron and 0.1 to 5% by weight of tin. This electroless nickel plating film has a nickel ion of 0.04 to 0.2 mol / L, a hypophosphite ion of 0.09 to 0.5 mol / L, a tetrahydroborate ion of 1 to 80 mmol / L, and bivalent. Can be obtained using an electroless nickel plating solution containing 50 to 1000 μmol / L of tin ions. [Selection figure] None

Journal ArticleDOI
TL;DR: In this paper, a method for the metallization of fiber bragg gratings (FBGs) by the combination of electroless nickel plating and electro nickel plate was presented, followed by embedding the coated FBG in an aluminum alloy 6061 matrix to fabricate smart metal structures.
Abstract: The low temperatures and low pressure employed in ultrasonic welding make it suitable for embedding optical fiber gratings (fiber Bragg gratings (FBGs)) in the fabrication of 3D smart composites. However, FBG sensors embedded in metal matrices are easily damaged and broken. A method is therefore presented for the metallization of FBG by the combination of electroless nickel plating and electro nickel plating, followed by embedding the coated FBG in an aluminum alloy 6061 matrix in order to fabricate smart metal structures. Experimental results show that nickel plating can protect the FBG and provide benefits in the fabrication of aluminum alloy smart structures using ultrasonic welding. The temperature-sensing properties of smart metal structures fabricated in this way are analyzed, and the results show that the temperature sensitivity has been improved twofold. Also, the temperature sensing shows good linearity, and the temperature cross-sensitivity has been effectively controlled; the temperature resolu...

Patent
10 Aug 2011
TL;DR: In this article, the authors presented a method of preparing solar cell and electrode by electroless nickel plating without using a silver paste and an activating solution used, the method comprises the steps of providing a silicon material; making the silicon material contact with the activating solution comprising precious metals or precious metal compounds, a thickener and water; washing the solar material by a cleaning fluid; soaking the silicon materials in a electroless Nickel plating fluid for the electrolessNickel plating.
Abstract: Provided is a method of preparing solar cell and electrode by electroless nickel plating without using a silver paste and an activating solution used The method comprises the steps of providing a silicon material; making the silicon material contact with the activating solution comprising precious metals or precious metal compounds, a thickener and water; washing the silicon material by a cleaning fluid; soaking the silicon material in a electroless nickel plating fluid for the electroless nickel plating The invention is advantageous in that the method of preparing solar cell and electrode has the selectivity of silicon nitride and silicon; the process has a wide and stable adjustable range and is easy in matching based on the surface state of the silicon material; the method is especially suitable for preparing the solar cell and electrode

Journal ArticleDOI
TL;DR: In this paper, the method of electroless nickel-plating on carbon fiber surface is introduced, and surface metallization of carbon fiber is researched, the study includes pretreatments before plating, design of the plating solution composition, microscopic analysis of coating materials, and bonding strength testing between the coating and the substrate.
Abstract: In this paper, the method of electroless nickel-plating on carbon fiber surface is introduced, and surface metallization of carbon fiber is researched. The study includes pretreatments before plating, design of the plating solution composition, microscopic analysis of coating materials, and bonding strength testing between the coating and the substrate. The study show that pretreatments on carbon fiber surface have an important impact on metallization. In pretreatments, coarsening treatment changes the surface state of carbon fiber, increases surface area; while dispersing eliminates the reunion phenomenon of the fiber. Plating solution composition is the key factor of nickel-plating on carbon fiber surface, the best components of solution are 30g/L nickel sulfate, 20g/L lactic acid, 30g/L sodium hypophosphite. The surface metallization of carbon fiber is realized by chemical nickel plating, and the coating combined well with fiber, uniformity, complete and bright. The coating gained in the experiment is Ni-P amorphous alloy.

Patent
05 Jan 2011
TL;DR: In this article, a method of manufacturing a printed circuit board (PCB) and an external circuit board manufactured by the same method is described, which includes the following steps: (a) performing a solid boring operation to a copper foil surface of a cuprum-coated laminated board, pasting a dry film containing sensitizer to exposure and visualize, then etching and peeling the dry film so as to form a external circuit; (b) forming an insulation layer between circuits; (c) performing acid treatment and/or cleaning treatment to a region required
Abstract: The present invention relates to a method of manufacturing a printed circuit board (PCB) and a printed circuit board manufactured by said method The method includes the following steps: (a) performing a solid boring operation to a copper foil surface of a cuprum-coated laminated board, pasting a dry film containing sensitizer to exposure and visualize, then etching and peeling the dry film so as to form an external circuit; (b) forming an insulation layer between circuits; (c) performing acid treatment and/or cleaning treatment to a region required for surface treatment namely to the external circuit, so as to form an electroless nickle plating layer and/or gold plating layer, an electroless nickel plating layer and/or gold plating layer or tin plating layer; (d) coating the external circuit with the gold plating layer or the tin plating layer by using metal mask printing solder; (e) attaching a spot formation circuit on the solder coated on the external circuit by using an insert machine; (f) welding the spot formation circuit on the external circuit by using a spot welding machine to joint the spot formation circuit

Journal ArticleDOI
TL;DR: In this paper, a one-step process to synthesize nickel nanoparticles dispersed on activated carbon is presented, which is widely used for the plating of metal surfaces and consists of the immersion of substrate on a stabilized bath that contains the metal precursor, a complexing agent, an additive for pH control, and chemical stabilizer to avoid the spontaneous reduction of metal in bath solution.
Abstract: This work presents a novel one step process to synthesize nickel nanoparticles dispersed on activated carbon. This technique is widely used for the plating of metal surfaces and consists of the immersion of substrate on a stabilized bath that contains the metal precursor, a complexing agent, an additive for pH control, and chemical stabilizer to avoid the spontaneous reduction of metal in bath solution. By this process, nickel was dispersed on chemical activated carbon (carbon molecular sieve, CMS) obtaining a catalyst which showed better catalytic activity on benzene dehydrogenation than the observed for unsupported nickel nanoparticles and a commercial catalyst composed by nickel nanoparticles supported in Al2O3–SiO2.

Journal ArticleDOI
TL;DR: In this article, the effect of reductant (NaH2PO2×H2O), complex agent (Na3C6H5O7×2H 2O), reaction time, and reaction temperature on the Ni loadings and the utilization of the modified metal hydride (MH) alloy was systematically studied.
Abstract: Metal hydride (MH) alloy (MmNi3.81Mn0.41Al0.19Co0.76) is modified by the electroless nickel plating and used as the electroactive material of negative electrode in Ni/MH batteries. The effect of the concentrations of reductant (NaH2PO2×H2O), complex agent (Na3C6H5O7×2H2O), reaction time, and reaction temperature on the Ni loadings and the utilization of the modified MH are systematically studied. The experimental results reveal that the appropriate reaction time and temperature of electroless nickel plating are 30 min and 70 °C in this work. The loading amount of Ni-P on MH alloy is increased and decreased by increasing the concentration of reductant and complex agent, respectively. The steady utilization of unmodified MH alloy is 94.7±1.0 % in the forming process under the charge/discharge conditions of 0.2C charge to 160% SOC (state of charge) and 0.2C discharge to 0.95V. The utilization of MH alloys modified with conditions of [NaH2PO2×H2O] = 40 g L-1 and [Na3C6H5O7×2H2O] = 20 g L-1, T = 70 °C, t = 30 min and [MH] = 2g/100 ml, respectively, is improved to 101.9±0.3 %.

Journal ArticleDOI
TL;DR: In this article, a simple and novel fabrication process is described to produce three-dimensional freestanding metal micropipes, which is based on conventional micromachining and electroless nickel plating inside a microfluidic channel of structured and stacked silicon substrates.
Abstract: In this paper, we describe a simple and novel fabrication process to produce three-dimensional freestanding metal micropipes. This process is based on conventional micromachining and electroless nickel plating inside a microfluidic channel of structured and stacked silicon substrates. The nickel micropipe resists an etching with KOH, which facilitates to fabricate freestanding, functional micropipes. The in-channel electroless plating achieves a continuous and homogeneous deposition of nickel and shows an accurate coating of small microstructures down to 20 µm. Furthermore, the deposited nickel layers possess a high tensile strength for bonding (>200–300 N mm−2), are chemically inert against fluorine gas and withstand pressures up to 6 bar. Thermal measurements have shown that released micropipes show better heat flux densities than embedded micropipes with 86% at a cooling flow rate of 16 ml h−1. Hence, released micropipes feature accurate control of the temperature in the micropipe via a variance of the cooling fluid flow rate.

Patent
18 Apr 2011
TL;DR: In this article, a method for manufacturing a positive electrode terminal for a secondary battery is provided to provide excellent weldability, solderability and corrosion resistance and to perform work using roll-to-roll plating equipment.
Abstract: PURPOSE: A method for manufacturing a positive electrode terminal for a secondary battery is provided to a positive electrode terminal with excellent weldability, solderability and corrosion resistance and to perform work using roll to roll plating equipment. CONSTITUTION: A method for manufacturing a positive electrode terminal for a secondary battery comprises the steps of: masking at least, one end of an aluminum electrode and a polymer film at an aluminum positive electrode tab for a secondary battery in which the polymer film is welded to the aluminum electrode; successively separating and removing a coating layer and a smut present on the AI surface of the aluminum positive tab and then covering a zincate coating on the AI surface of the AI positive electrode tab; treating 10% ofsodium sulfate, nitric acid, sulfuric acid or their mixture with an aqueous solution at room temperature to 50°C for 5-60 seconds to strip the zincate and again forming the zincate film on the AI surface; forming an electroless nickel plating film with more than 0.5 μm and less than 3 μm on the zincate film; and covering an anti-oxidation film on the electroless nickel plating film and removing the masking.

Journal ArticleDOI
TL;DR: In this paper, an electroless nickel plate was added to NiO-YSZ composite as a coating with relevant process variables and procedures optimized during the electroless Nickel plating.

Patent
03 Aug 2011
TL;DR: In this paper, a nickel plating process method of magnesium alloy, which comprises the following steps: (1) plasma electrolytic oxidation for the magnesium alloy after being pre-treated; (2) activation and reduction, in which 0.5-1g/L of PdCl2, 1-3g /L of NaCl and 4-6g / L of EDTA (ethylenediaminetetraacetic acid) are prepared into an activation solution, heated up to 30 DEG C 35 DEGCbelow zero and activated for 5 to 10
Abstract: The invention provides a nickel plating process method of magnesium alloy, which comprises the following steps: (1) plasma electrolytic oxidation for the magnesium alloy after being pre-treated; (2) activation and reduction, in which 0.5-1g / L of PdCl2, 1-3g / L of NaCl and 4-6g / L of EDTA (ethylenediaminetetraacetic acid) are prepared into an activation solution, heated up to 30 DEG C 35 DEG Cbelow zero and activated for 5 to 10 minutes; cleaning with deionized water after the completion of activation; and then carrying out the reduction treatment with 2.5wt%-3wt% of sodium hypophosphite solution and obtaining the catalytic center of electroless nickel plating; and (3) surface nickel plating. The invention adopts the plasma electrolytic oxidation process before electroless nickel plating so as to prevent the galvanic corrosion of a substrate and a coating; nickel acetate is used to prepare a plating solution of the electroless nickel plating, and the pH value of the solution is 6.2 to 6.5, so that the defects that SO4 and Cl cause corrosion to the magnesium alloy substrate when nickel sulfate and nickel chloride are used to prepare the plating solution in the ordinary electroless plating process can be overcome.

Patent
30 May 2011
TL;DR: In this paper, a method was proposed to provide a method of forming a metal film pattern having excellent adhesion reliability and precision on a resin base material efficiently by using a low concentration metal ion solution.
Abstract: PROBLEM TO BE SOLVED: To provide a method of forming a metal film pattern having excellent adhesion reliability and precision on a resin base material efficiently by using a low concentration metal ion solution.SOLUTION: A resin base material having a metal film pattern is produced by a method including the following steps (a)-(e). (a) A step for printing a pattern of a latent image agent on the surface of the resin base material, (b) a step for generating a metal salt by bringing a solution containing metal ions into contact with a part where the latent image agent is printed, (c) a step for reducing the metal salt by bringing it into contact with an acid processing liquid containing a reductant, (d) a step for forming an electroless nickel plating film at a part where the latent image agent is printed, and (e) a step for making the electroless nickel plating film precipitate on the surface of the nickel plating film.

Patent
02 Jun 2011
TL;DR: In this article, the authors proposed a treatment method for electroless nickel plating waste liquid, which causes little waste and low environmental load, requires no large-scaled equipment or space, and is capable of recovering nickel sulfate and reproduces liquid including the nickel sulfates.
Abstract: PROBLEM TO BE SOLVED: To provide a treatment method for electroless nickel plating waste liquid, which causes little waste and low environmental load, requires no large-scaled equipment or space, and is capable of recovering nickel sulfate and reproduces liquid including the nickel sulfate from electroless nickel plating waste liquid for reuse in simple operation for a short time at low cost. SOLUTION: Phosphorous acid nickel is picked out from electroless nickel plating waste liquid as settlings, and the phosphorous acid nickel is treated with sulfuric acid to be crystallized as nickel sulfate and the nickel sulfate is recovered by magnetic separation. COPYRIGHT: (C)2011,JPO&INPIT