Showing papers on "Electroless nickel plating published in 2012"

On the Influence of Surfactant Incorporation during Electroless Nickel Plating

Abstract: The effects of surfactants on the dynamics and characteristics of plain and composite electroless nickel plating (ENP) are highlighted and discussed herein. An outline of the rudiments of surfactants and some underlying selection criteria is presented at the outset, before emphasis is laid on the salient benefits of introducing such external agents during the plating process. Evidence suggests that their influence on key coating characteristics such as the rate of deposition, structure, corrosion resistance, and the degree of second-phase particle incorporation into the nickel matrix is significant, and depending on the nature and concentration of surfactant employed, can be of immense value to the system.

Dynamic behavior of electroless nickel plating reaction on magnesium alloys

Abstract: In order to obtain better control over the quality of electroless nickel–phosphorous (EN) coatings on magnesium AZ91D alloy, the effects of metal salt concentrations, reducing agent, pH, and temperature on deposition rate were studied. The reaction orders and activation energy of the deposition were determined. The results show that the apparent activation energy (E a) in the EN plating reaction is approximately 38.03 kJ/mol. The deposition rate increased with increasing temperature, concentration of H2PO2 −, and pH, and decreased with increasing concentration of complexing agents. For nickel ions, the deposition rate increased gradually with increasing concentration (x) when x < 4.69 g/L. However, it decreased when the concentration exceeded 4.69 g/L. Finally, various types of the deposition reaction were also discussed. The results indicate that nickel was first deposited by replacement deposition in the initial 0.5 min, then by both replacement deposition and autocatalytic deposition in plating, and finally by autocatalytic deposition after 5 min of plating.

Electroless nickel plating on polypropylene via hydrophilic modification and supercritical carbon dioxide Pd-complex infusion

Abstract: A supercritical carbon dioxide (scCO2)-assisted electroless Ni–P plating technique on a polymer substrate was modified and improved for polyolefin polymers. The technique consists of two steps: the first step is the scCO2-assisted impregnation of the polymer substrate with Pd(hfa)2 and the second step is the electroless plating reaction. The high solubility of CO2 in thermoplastic polymers is advantageous to infuse the catalyst precursor, Pd(hfa)2, to polypropylene (PP), however, the hydrophobic nature of PP makes the electroless plating reaction difficult. The hydrophobicity hinders the diffusion of the aqueous plating solution in the polymer, consequently resulting in a weak adhesion of the metal layer to the substrate. In this study, a polypropylene (PP)–polyethyleneoxide (PEO) block copolymer was blended with PP to increase the hydrophilicity of the PP. Blending the copolymer with PP increased the diffusion of the plating solution in the PP substrate and the Ni–P metal layer was successfully formed onto PP with an average adhesive strength of 7.9 ± 0.5 N/cm to the polymeric substrate.

Effects of pretreatments of magnesium alloys on direct electroless nickel plating

Abstract: The effects of two different pretreatments on direct electroless nickel plating of magnesium alloys have been studied in order to obtain an environmentally friendly process of pretreatment. The surface morphology, chemical composition and corrosion resistance were characterised using SEM, energy dispersive X-ray and polarisation curves. An environmentally friendly pretreatment has been finally established by the procedure of pickling with nitric acid plus phosphoric acid, twice activating with K4P2O7 and NH4HF2. It is found that a coarse surface was produced on the Mg substrate via the researched pretreatment. The adherence between the coating and the substrate was improved. A compact Ni–P alloy coating with better adhesion and corrosion resistance was fabricated. The phosphorus content in the coating was ∼11·24%.

Electroless plated fluid flow conditioner and pipe assembly

Abstract: A method and system for electroless nickel plating of fluid flow measurement components used in oil and gas pipelines provides uniformly and consistently plating of all surfaces of the fluid flow components, including flow conditioners, with an electroless nickel plating that imparts the component with desirable characteristics related to hardness, smoothness, wear and abrasion resistance, and corrosion and oxidation resistance, such that the build up of contaminant deposits on the component is reduced and repeatable and accurately fluid flow measurements can be made.

A Simple Nickel Activation Process for Electroless Nickel-Phosphorus Plating on Carbon Fiber

Abstract: A new nickel activation process was developed for metalizing the carbon fiber (CF) surface with electroless nickel plating. The oxidation and activation processes were examined using X-ray Photoelectron Spectroscopy (XPS), Scanning Electron Microscopy (SEM), Energy Dispersive X-ray Spectrometry (EDS), and X-ray Diffractometry (XRD). XPS analysis showed that HNO3 oxidation improved the O/C ratio of the CF surface, which resulted in an increase in the amount of oxygen-containing groups. As activation time increased, both Nio cluster and Ni-P deposits increased. More than 50 mg of Nio clusters formed on the surface of 1g CF. SEM observations illustrated that particles and island-like shapes were developed from the Nio cluster, which helped to initiate the electroless nickel-plating on the CF surface. A continuous and compact coating with a thickness of about 2 to 3 μm was obtained. EDS results showed that the nickel and phosphorus content in the deposits was 97.34 wt.% and 2.66 wt.%, respectively. XRD indicated that the Ni-P coating was crystalline and the maximum deposition on 1 g CFs was as high as 9000 mg. As the results of the observations reveal, the activation method is a feasible alternative to Pd activation.

Characterisation of electroless nickel plated titanium powder

Abstract: In this study, pure titanium powder with an average size of 20 μm was treated by electroless nickel plating to obtain titanium–nickel composite/duplex powder. Two plating procedures were applied; continuous short period (CSP) and discontinuous long period (DLP) processes. The plated titanium powder particles as well as unplated ones were characterised by energy dispersive spectrometry (EDS), scanning electron microscopy (SEM), particle size analysis and X-ray mapping analysis methods. The nickel plated titanium powder was sprayed on the steel substrate by atmospheric plasma spray technique. Furthermore, the mixed titanium–nickel powder was also sprayed. The morphology of sprayed powders was compared with each other. It was found that nickel forms fine dispersed nodules on the surface of titanium powder particles in the CSP process, whereas it appeared as homogeneous layers on the surface of all the particles in the DLP process. Also, it was found that the mass deposited on the powder increased wit...

The electroless nickel plating of catalytically graphitized electrospun carbon nanofibers

Abstract: Catalytically graphitized electrospun carbon nanofibers were plated with nickel using a commercial electroless bath for the first time. The nanofiber fabrication process was performed in the presence of nickel as the graphitization catalyst at a temperature of 1400 °C. Raman spectroscopy and X-ray diffraction studies confirmed the achievement of a satisfactory degree of graphitization for the carbon nanofibers. After sensitization and activation processes, the nanofibers were submerged for 20 min in the electroless bath at a temperature of 45 °C and a pH value of 9. Results from scanning electron microscopy and X-ray diffraction showed that a pure, crystalline and uniform nickel coating of 186 nm thickness was formed on the surface of the nanofibers.

Iodine-aided palladium-free catalyzation process for durable electroless nickel plating on Kevlar® fiber

Abstract: We report here a highly durable electroless nickel plating on Kevlar fiber through iodine-aided palladium-free catalyzation process. Kevlar was first treated with an iodine–potassium iodide aqueous solution to impart iodide component into the near fiber surface. The doped iodine was converted to silver iodide particles by treatment with silver nitrate aqueous solution, and subsequently silver iodide was reduced to silver metal particles. After electroless plating, a smooth nickel layer was evenly deposited on the fiber surface, which was resistant against sonication, tape peel-off, and alkaline corrosion tests. The silver particles formed on and near the fiber surface act as an anchor for the plated layer as well as a catalyst for electroless plating. Further investigation revealed that the use of an anionic surfactant during the catalyzation process enhanced the adhesive force of the plated layer with fiber surface. The plated fibers possessed high tensile strength, electrical conductivity, and ferromagnetic properties.

Weldable electroless nickel plating method for SiC/Al composite material

Abstract: Belonging to the welding technical field of metal-based composite materials, the invention provides a weldable electroless nickel plating method for an SiC/Al composite material. The method comprises: first conducting pretreatment on the SiC/Al composite material, then carrying out electroless nickel plating, the temperature of which is controlled at 83DEG C-90DEG C, the pH of which is maintained at 4.5-5.0, and the time of which is controlled at 30min-120min, and finally performing post-treatment. On the surface of the SiC/Al composite material undergoing electroless nickel plating of the invention, when using a lead-tin solder to weld an aluminum nitride electronic ceramic substrate, the welding porosity can be lower than 5%, thus substantially lowering the cost brought about by gold plating. And a nickel plating sample of the obtained SiC/Al composite material can be stored for a long-term without declination in welding performance.

Deposition of a Ni 3 P nano-scale layer on B 4 C nanoparticles by simple electroless plating in an acidic bath

Abstract: In this study, deposition of a Ni3P nano-scale layer on B4C nanoparticles via simple electroless plating in an acidic bath was investigated. B4C nanoparticles were produced by mechanical milling with the average size of about 95 nm. Electroless nickel plating was carried out at temperature and pH of 85°C and 5.5, respectively. The uncoated and composite powders were characterized by transition electron microscope and the phases present were revealed by X-ray diffraction. Also, nickel and phosphorous contents of the coating were measured by inductively coupled plasma analysis. The results confirmed deposition of a Ni3P layer with the average thickness of about 25 nm on B4C nanoparticles.

Recycling Valuable Metals via Hydrometallurgical Routes

Abstract: The hydrometallurgical method is one of the key technologies in metal recycling, because it enables the fine separation between chemically-similar metals and a small-scale operation. In this paper, the recent results of our hydrometallurgical recycling studies are outlined. The topics include (i) noble extractants for precious metal separation, (ii) recovery of rare-earth elements from neodymium magnet scrap, (iii) nickel recovery from spent electroless nickel plating baths, and (iv) an energy-saving copper recycling process. In (i), new amide-type solvent extraction reagents have been developed for precious metals, one of which, thiodiglycolamide, rapidly and selectively extracts palladium from platinum and has a high durability against oxidation. In (ii), a process consisting of oxidative roasting – selective acid leaching followed by solvent extraction separation of dysprosium from neodymium has been proposed. In (iii), solvent extraction using a chelating reagent is used to extract nickel ions from spent electroless nickel plating baths, and the nickel ions are recovered as a nickel sulfate solution which can be reused in the plating process. In (iv), a copper recycling process utilizing monovalent copper in an ammoniacal alkaline solution is described, which would significantly reduce the energy requirement for copper electrowinning.

Influence of polyethylene glycol 6000 and potassium ferrocyanide on electroless copper plating at the nickel-modified surface of para-aramid fibers

Abstract: Influence of polyethylene glycol 6000 (PEG6000) and potassium ferrocyanide (K4Fe(CN)6) on electroless copper plating at the nickel-modified surface of para-aramid fibers was investigated in the present work. The surface of para-aramid fibers was roughened using sodium hydride/dimethyl sulfoxide (NaH/DMSO) to guarantee successful electroless plating. Then, electroless copper plating at the nickel-modified surface of para-aramid fibers was adopted because nickel had catalytic activity during the electroless copper-plating process. Meanwhile, PEG6000 can regulate the growth rate of the crystalline grain to produce a morphology-controlled deposit and K4Fe(CN)6 is a brightener and leveling agent for deposit during electroless-plating process. Hence, both PEG6000 and K4Fe(CN)6 were selected as the additives together. On adding PEG6000 to the plating solution, the copper grains turned fine and sleek. Copper deposits became homogeneous, smooth, and compact, and the appearance of deposits changed from dark-brown t...

Quantum mechanical approach for electroless plating process

Abstract: A high speed electroless nickel plating bath has been developed with p-tolyl thiourea and diphenyl thiourea as accelerators for electroless nickel plating process. The acceleration effect of the compounds was determined by weight gain and electrochemical method. Both compounds improved the rate of deposition to considerable extent by adsorbing strongly on the steel surface. The adsorption of the accelerators was found to obey Langmuir adsorption isotherm. The Arrhenius plot and quantum mechanical parameters further justified the impressive performance of accelerators through their effective adsorption on metal surface.

Alternative surface finishes for flip-chip ball grid arrays

Abstract: A ball grid array package device includes a substrate with a copper ball grid array pad formed on the substrate. A nickel layer may be formed on the copper pad and a tin layer formed on the nickel layer. The nickel layer may be formed using an electroless nickel plating process. The tin layer may be formed using an immersion tin process. In some cases, silver may be used instead of tin and formed using an immersion silver process.

Formation of Ni electrodes on sintered N-type Mg2Si using monobloc sintering and electroless plating methods

Abstract: Ni was examined as an electrode for n-type Mg2Si. To form the Ni electrodes, two methods, monobloc sintering and a modified electroless Ni (EN) plating method, were adopted. Although the process of EN plating to Mg2Si was formerly believed to be untenable owing to degradation of the matrix during the acidity processes, a promising modified EN plating method was developed. Regarding the adhesive properties, no obvious damage was observed in either Ni/Mg2Si sample after more than 200 h. The observed electrical resistances of the EN plated and monobloc-sintered samples were comparable, with values of 10.2 and 10.5 mΩ, respectively. In addition, the results of the output power measurements gave similar values of 120.9 mW and 120.7 mW for the EN plated and sintered Ni electrodes, respectively.

Hard-film-covered member covered by hard film, and method for manufacturing same

Abstract: An embodiment of the present invention provides a hard-film-covered member in which a base material made from a soft metal is covered by an amorphous carbon film or other hard film so as to obtain better adhesion than conventionally A hard-film-covered member (1) according to an embodiment of the present invention is provided with: a base material (10) made form a soft metal; an electroless nickel plating layer (30) formed on the base material, the electroless nickel plating layer being in an amorphous state when formed on the base material; and a hard film (40) formed on the electroless nickel plating layer

Plated aluminum alloy casting and method for production thereof

Abstract: PROBLEM TO BE SOLVED: To provide a plated aluminum alloy casting having excellent strength, toughness, hardness, adhesiveness and brightness, and to provide a method for production of the aluminum alloy casting.SOLUTION: The aluminum alloy casting has an electroless nickel plating layer. The aluminum alloy contains, by weight, 1.5-5.5% Mg, 1.6-5.0% Zn, ≤0.4% Si, ≤0.4% Fe, ≤0.4% Cu, ≤0.2% Ti, ≤0.1% B, ≤0.1% Be, and the balance Al with inevitable impurities. The plated aluminum alloy casting is characterized by having a zincate treatment layer on the surface of the electrolytically polished casting and further having the electroless nickel plating layer thereon.

Electroless nickel plating bath composition

Abstract: The present invention relates to an aqueous plating bath composition for depositing a nickel phosphorous alloy having a phosphorous content in the range of to 12 wt-% The plating bath comprises a sulfur-containing organic stabilizing agent

Wear and Tribotermal Effects of Nanostructured Nickel Chemical Coatings

Abstract: The abrasive wear and the wear resistance of composite nickel + SiC coatings are investigated. The coatings are deposited by the method for electroless nickel plating EFTTOM-NICKEL developed in TU-Sofia. Nanosized particles of SiC are used as a strengthened material. The size of the particles is 35-40 [nm]. The thickness of the coatings is 50 [µm]. The investigation of the coatings deposited on the different roughness surfaces is performed. Some of the samples are thermal processed at 300°C, 6 hours after deposition process. The methods for wear resistance testing is developed and the experimental results for the dependence of the massive wear, wear speed, intensity of wear and wear resistance on the friction road and the time of a contact interaction are obtained.

Study of electroless nickel plating on PerFactory TM rapid prototype model

Abstract: This paper presents an investigation of electroless nickel plating on PerFactoryTM rapid prototype model built on PerFactoryTM R05 material. PerFactoryTM R05 is acrylic based photo sensitive resin. It is a popular material in rapid prototyping using PerFactoryTM method which employs addictive manufacturing technique to build prototypes for visual inspection, assembly etc. Metallization of such a prototype can extend the application envelop of the rapid prototyping technique as they can be used in many functional applications. Unlike the electroless nickel plating on metal substrate, the process on acrylic resin substrate is not auto-catalytic. Hence, etching and activation are necessary for initiating the process. The final coating is then investigated using scanning electron microscope (SEM) together with energy dispersive spectroscopy (EDS) and x-ray diffraction (XRD) analysis to identify the morphology and structure of the coating. The SEM & EDS analysis on surface and chemical composition of model surface after each preliminary surface treatment are also presented. Finally the layer is tested on Vickers micro hardness tester.

Structure with electroless nickel plating film, semiconductor wafer, and production method thereof

Abstract: PROBLEM TO BE SOLVED: To provide a structure with an electroless Ni plating film generating no crack and few warpage, a semiconductor wafer generating no crack in the Ni plating film and few warpage when forming a UBM in a semiconductor wafer by electroless plating, and a production method thereof.SOLUTION: A structure with an Ni plating film formed on a substrate with electroless Ni plating is provided: wherein, the Ni plating film is formed with electroless Ni plating with which a columnar crystalline Ni plating film is formed, and with electroless Ni plating with which an amorphous Ni plating film is formed; and, after the columnar crystalline Ni plating film is formed to 50-90% of the total film thickness of the Ni plating film, the amorphous Ni plating film is formed on the columnar crystalline Ni plating film to 10-50% of the total film thickness of the Ni plating film. A semiconductor wafer is also provided which has a structure in which the Ni plating film is formed on electrode surfaces of the substrate.

Method for manufacturing electroless nickel plating film, and substrate for magnetic recording medium using the same

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a flaw-free electroless nickel plating film.SOLUTION: The method for manufacturing an electroless nickel plating film includes the steps of: forming an aluminum layer having a purity of 99.99% or more and a film thickness of 2.5 μm or more on a substrate by using a sputtering; and forming the electroless nickel plating film on the aluminum layer by using an electroless plating. The method may further include a step of forming a titanium layer having a purity of 99.99% or more between the substrate and the aluminum layer.

Conductively filled Poly(methyl methacrylate) composites : manufacture and testing processes for EMI shielding effectiveness

Abstract: Electromagnetic interference (EMI) is an escalating concern in the modern electronic climate. As such it has become a critical area to consider when designing and packaging electronics. With the growing volume of electronic devices available and with processor frequencies increasing, the electromagnetic environment is becoming ever more congested. The need for adequate EMI shielding has become an essential consideration. The desire for high performance combined with reductions in size, weight and manufacturing cost suggests that polymers should be ideal materials for parts such as electronic housings. Unfortunately polymers generally do not provide shielding from electromagnetic waves. The research detailed in this thesis investigates the manufacture and testing of conductively filled poly(methyl methacrylate) (PMMA) composites. Samples of PMMA resin and various electrically conductive filler materials were manufactured. The processing methods, electrical properties and electromagnetic behaviour were all investigated. Composite polymer coatings were printed with a K-Control Coater and evaluated for surface resistivity and EMI shielding effectiveness. Samples were produced with a range of filler materials including nickel, carbon, copper/aluminium and silver coated glass spheres. Shielding effectiveness values of approximately 70 dB were obtained for coatings of PMMA filled with silver coated hollow glass microspheres. Attempts were made to produce an alternaalternative filler material by electroless nickel plating of expanded graphite powder. Successful plating was achieved using conventional methods of surface sensitisation of the graphite. This however resulted in agglomerations of the powder and a loss of the desired physical properties. Alternative thermal surface treatments proved to be unsuccessful in activating the graphite surface with no nickel deposition occurring. Furthermore, electroless nickel plating techniques were successfully utilised in the development of an alternative manufacturing process for producing electrically conductive PMMA composites which contained a reduced metallic content, in relation to a more traditional production technique. Plaques were manufactured by compression moulding of nickel plated PMMA granules. These were compared against samples manufactured with nickel powder mixed in a Brabender Plasti-Corder. The electroless plating method produced samples that outperformed the comparative method and were shown to contain a reduced metallic content. Shielding effectiveness of the electroless plated granule samples achieved approximately 34 dB compared to a maximum of only 2.5 dB for the Brabender compounded samples. Outwith these areas of empirical testing a computer model was produced to simulate the electromagnetic shielding behaviour of composite materials using Comsol Multiphysics. This model appears to successfully simulate the waveguide testing apparatus. However the theoretical conductivity values as calculated from effective media theory resulted in disproportionate shielding effectiveness values obtained. Further research into the electroless plated and compression moulded PMMA composites would be beneficial in order to fully optimise the process. Equally the theoretical model would require further investigating and validating before more accurate simulations could be achieved.

Phosphorus-free electroless nickel plating solution and nickle-alloy plating solution and electroless plating method using the same

Abstract: PURPOSE: A phosphorus-free electroless nickel plating solution and an electroless plating method using the same are provided to reduce the costs for wastewater treatment by not using hypophosphorous acid soda as reductant CONSTITUTION: A phosphorus-free electroless nickel plating solution comprises nickel salt, dimethylamine borane and boric acid as reducing agent, ammonium acetic acid as complexing agent, and sodium citrate as stabilizer The nickel salt comprises nickel sulfate of 20-35g/l and nickel sulfate ammonium of 01-5g/l to nickel plating solution of 1 liter The reducing agent comprises dimethylamine borane of 3-10g/l and boric acid of 20-30g/l to nickel plating solution of 1 liter The complexing agent comprises ammonium acetic acid 5-15g/l to nickel plating solution of 1 liter The stabilizer comprises sodium citrate of 10-20g/l to nickel plating solution of 1 liter

Treatment of wastewater from electroless nickel plating process

Abstract: PURPOSE: A treatment method of non-electrolytic nickel plating wastewater is provided to prevent water pollution by reducing the generation amount of sludge and reusing the plating wastewater. CONSTITUTION: A treatment method of non-electrolytic nickel plating wastewater includes the following steps: sodium chloride or sodium nitrate is added into non-electrolytic nickel plating wastewater, and ethanol is mixed with the plating wastewater to precipitate organic acid salts to be removed; several components except for nickel is precipitated and removed from the plating wastewater; caustic soda is added into the treated solution to precipitate nickel as nickel hydroxide to be collected; and ethanol and water are separated from the residual solution by distillation techniques.

Study on the Surface Metallization of Aramid Fibers

Abstract: In this paper, aramid fiber surface metallization was investigated by electroless nickel plating technology. Acid nickel plating and alkaline nickel plating of aramid fiber was compared. Through experiment, it was shown that the temperature of alkaline nickel plating was lower compared with acid nickel plating, and resistance of metalized aramid fibers by alkaline nickel plating was 36.8Ω•cm, and the resistance by acid plating was 51.2Ω•cm. The surface morphology of fibers was observed using SEM