Topic
Electroless nickel plating
About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.
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TL;DR: In this article, the effects of electroless nickel plating on resistivity-temperature (R-T) characteristics of (Ba1-xPbx)TiO3 thermistor were studied.
Abstract: Effects of electroless nickel plating on resistivity-temperature (R-T) characteristics of (Ba1-xPbx)TiO3 thermistor were studied. Comparison experiments showed that not only the permeation of plating solution, but also the reaction of electroless nickel plating influences the positive temperature coefficient (PTC) effect, and that the two effects are different in nature. It is first proposed in this paper that hydrogen atoms generated in electroless nickel plating may reduce components of PTC ceramics.
8 citations
Patent•
18 Sep 1998
TL;DR: In this paper, the authors proposed an electroless nickel plating of hard disk substrates made of the glass or the ceramics, the substrates are treated with a catalyst liquid consisting essentially of a water-soluble palladium salt and an amine-base complexing agent and not containing a tin salt after the substrate is subjected to surface adjusting treatment and are then subjected to washing and drying and thereafter, the substrate are immersed into an Electroless Nickel Plating liquid and are subjected to electroless Nickel plating.
Abstract: PROBLEM TO BE SOLVED: To form electroless nickel plating films which are free from defects, such as pits, and have a good adhesion property on hard disk substrates made of glass and ceramics. SOLUTION: In the electroless nickel plating of hard disk substrates made of the glass or the ceramics, the substrates are treated with a catalyst liquid consisting essentially of a water-soluble palladium salt and an amine-base complexing agent and not containing a tin salt after the substrate is subjected to surface adjusting treatment and are then subjected to washing and drying and thereafter, the substrates are immersed into an electroless nickel plating liquid and are subjected to electroless nickel plating.
8 citations
Patent•
14 Jul 1995
TL;DR: In this article, valuable substances are recovered from a spent electroless nickel plating solution containing a water-soluble nickel salt, organic complexing agent, hypophosphite, phosphite, and alkali metal ion.
Abstract: Valuable substances are recovered from a spent electroless nickel plating solution containing a water-soluble nickel salt, organic complexing agent, hypophosphite, phosphite, and alkali metal ion by adding oxalic acid to the plating solution for causing a nickel ion to precipitate as nickel oxalate for removal and recovery; optionally adding a sulfide to the plating solution for causing a heavy metal ion to precipitate as a heavy metal sulfide for removal; adding a mineral acid and calcium oxide, calcium hydroxide, calcium carbonate, calcium sulfate, calcium chloride or a calcium salt of organic acid to the plating solution from which the nickel ion has been removed; firing solids of the solution in air for converting the alkali metal ion into an alkali metal salt of mineral acid, converting phosphorus into hydroxyapatite, and pyrolyzing off the organic material; and pouring a solid mixture of the alkali metal salt of mineral acid and hydroxyapatite into water for dissolving the alkali metal salt of mineral acid in water for separate recovery of hydroxyapatite and the alkali metal salt of mineral acid.
8 citations
TL;DR: In this paper, organic additives to electroless plating baths are shown to affect the surface reaction by changing the catalytic activity of the surface and the presence of a thioketone group in the additive increases the surface activity.
Abstract: Organic additives to electroless plating baths are shown to affect the surface reaction by changing the catalytic activity of the surface. The presence of a thioketone group in the additive increases the surface activity, which results in acceleration of the target reaction. The presence of the iminogroup favors the formation of complexes and alters the rates of concurrent reactions, which weakens the surface activity. The reaction in the volume is governed by the inhibiting properties of additives dependent on the identity of functional groups. The greater the electron-donor properties of the additive, the higher their adsorbability and the stronger the blocking effect, which stabilizes the electrolyte.
8 citations
Patent•
20 May 2008
TL;DR: In this article, a method of soldering a magnesium alloy workpiece is described, which includes modifying a surface of the workpiece and performing a high phosphorous (7 to 12 wt% of P) electroless nickel plating process on the surface.
Abstract: The present application relates to a method of soldering a magnesium alloy workpiece. The method includes providing a magnesium alloy workpiece; modifying a surface of the magnesium alloy workpiece; performing a high phosphorous (7 to 12 wt% of P) electroless nickel plating process on the surface of the magnesium alloy workpiece; preparing a solder flux for different lead-free tin alloy solder; and performing a tin soldering process to solder the magnesium alloy workpiece with the lead-free tin alloy solder containing its corresponding solder flux.
7 citations