Topic
Electroless nickel plating
About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.
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TL;DR: In this paper, the authors studied the submicron size dependence of electroless nickel plating under ultrasonic irradiation with a frequency of 1 MHz to fabricate a near-field apertured probe.
Abstract: We have studied the submicron size dependence of electroless nickel plating under ultrasonic irradiation with a frequency of 1 MHz to fabricate a near-field apertured probe. Using a new ultrasonic bath with a small water depth of 80 mm, we found that a nickel film with a hollow structure is coated on the flat clad end of a fiber probe. The diameter of the hollow is 12 µm much smaller than the ultrasonic wavelength in water.
7 citations
Patent•
23 Jul 1982
TL;DR: Nickel-phosphorus deposits are electrolessly coated onto substrates at a commercially acceptable rate of deposition in a manner that enhances corrosion resistance and reduces the internal tensile stress of the electroless deposit on the substrate.
Abstract: Nickel-phosphorus deposits are electrolessly coated onto substrates at a commercially acceptable rate of deposition in a manner that enhances corrosion resistance and reduces the internal tensile stress of the electroless deposit on the substrate. This is done by plating from a bath that is sulfur-free (or free of sulfur except at its highest oxidation state) and that includes an unsaturated carboxylic acid of the formula R(COOH) n wherein R is an unsaturated alkyl group of at least 2 carbon atoms and n is at least 1, or a derivative thereof. Such compounds include aconitic, citraconic, fumaric, itaconic and maleic acids. The reducing agent of the bath may also be its phosphorus source e.g. an alkali metal hypophosphite.
7 citations
Patent•
05 Jul 2011
TL;DR: In this article, an electroless nickel plating solution that can suppress the mixing of environmentally hazardous substances other than nickel into a plating film as much as possible, and can provide an excellent stability and excellent mechanical properties.
Abstract: Disclosed is an electroless nickel plating solution that can suppress the mixing of environmentally hazardous substances other than nickel into a plating film as much as possible, and can provide a plating film having excellent stability and excellent mechanical properties. about. An electroless nickel plating film containing 0.5 to 4% by weight of phosphorus, 0.01 to 2% by weight of boron and 0.1 to 5% by weight of tin. This electroless nickel plating film has a nickel ion of 0.04 to 0.2 mol / L, a hypophosphite ion of 0.09 to 0.5 mol / L, a tetrahydroborate ion of 1 to 80 mmol / L, and bivalent. Can be obtained using an electroless nickel plating solution containing 50 to 1000 μmol / L of tin ions. [Selection figure] None
7 citations
Patent•
12 Dec 1996
TL;DR: In this article, a base material made of a liquid crystal polymer as a blank is subjected to an etching treatment, then is added with a catalyst and subjected to electroless copper plating 2.
Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing plated parts which are excellent in heat resistance and generate no peeling even in a process of high temp. soldering. SOLUTION: A base material 1 made of a liquid crystal polymer as a blank is subjected to an etching treatment, then is added with a catalyst and is subjected to an electroless copper plating 2. After an upper surface of the electroless copper plating 2 is pattern-processed, electro-copper-plating 3 is executed thereon. A circuit pattern is formed, electroless nickel plating 4 is executed on the electro-copper-plating 3 and then heat treatment for hardening the nickel is executed. Thereafter, final surface platings 5, 6, 7 are executed thereon and finally heat treatment is executed for removing moisture in the base material 1. COPYRIGHT: (C)1998,JPO
7 citations
TL;DR: In this paper, an electroless plated nickel layer was prepared on the surface of microarc-oxidation-fabricated porous magnesium oxide film in a conventional electroless nickel plating solution,consisted of nickel sulfate as main salt and sodium hypophosphite as reducing agent.
Abstract: Generally,the surface pretreatments such as sensitization and activation are necessary for depositing a nickel metal layer on oxide surface by electroless plating,however,for an oxide surface with porous structure it is possible that the pretreatment is not necessary.In this paper,only by use of the surface activity of porous structure,an electroless plated nickel layer can be prepared on the surface of microarc-oxidation-fabricated porous magnesium oxide film in a conventional electroless nickel plating solution,consisted of nickel sulfate as main salt and sodium hypophosphite as reducing agent.Furthermore,the phase,microstructure,electrical conductivity and corrosion resistance of the obtained nickel layer were characterized.The results indicate that the 5μm-thick nickel layer is composed of fine and homogeneously distributed nickel particles,at the same time the microstructure of nickel layer is dense.Nickel layer spreads into the micropores on the surface of porous magnesium oxide film,so that an interleaving interface is formed at nickel/oxide interface.XRD results reveal that the nickel layer contains crystalline Ni and amorphous Ni-P.Four-point probe measurement indicates that the nickel layer exhibits well electrical conductivity.Meanwhile,polarization curve reveals that corrosion potential elevates notably due to the presence of nickel layer.During electroless nickel plating the nickel ions in solution were reduced and deposited in the micropores of porous magnesium oxide film under the action of reducing agent ions,so as to generate tiny primary nickel particles, subsequently,these primary nickel particles continuously grew and spread,and finally formed an entire nickel layer on oxide surface.
7 citations