Electroless nickel plating

About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.

Pretreatment solution for electroless nickel plating or electroless nickel alloy plating, and plating method

Abstract: A pretreatment solution which is brought into contact with a non-conductive substrate for pretreatment, said substrate being to be subjected to electroless nickel plating or electroless nickel alloy plating. The pretreatment solution is obtained by dispersing nickel particles in a solvent. The nickel particles have an average particle diameter of 1-200 nm, and are contained in an amount of 1-80% by weight relative to the pretreatment solution. By performing electroless nickel plating or electroless nickel alloy plating after immersing the non-conductive substrate into the pretreatment solution, a uniform plating film is formed over the entire surface of the non-conductive substrate.

Effect of plating time on growth of nanocrystalline Ni–P from sulphate/glycine bath by electroless deposition method

Abstract: Nanocrystalline nickel phosphorus (NC-Ni–P) deposits from sulphate/glycine bath using a simple electroless deposition process is demonstrated. In the present investigation, nanoporous alumina films are formed on the aluminium surface by anodization process followed by deposition of nickel onto the pores by electroless plating method. Anodic aluminium oxide surface was first sensitized and activated by using palladium chloride solution before immersing into the electroless nickel bath. Electroless nickel plating was carried out from the optimized bath by changing the deposition time from 20 to 1800 s at a constant temperature of 80 °C and a pH of 4·0. Surface morphology, elemental composition, structure and reflectance of the deposits have been analysed by using scanning electron microscopy, atomic force microscopy, energy dispersive X-ray analysis, X-ray diffractometry and UV-visible spectroscopic studies, respectively. Electroless nickel deposits formed at an early stage produces dense uniform nanocrystals containing higher percentage of atomic phosphorus with cubic Ni (111) structure. As the deposition time increased, nanocrystalline sharp peak became amorphous and dimension of the crystal size varied from 54 to 72 nm.

Flexible printed circuit board manufacturing method, and base material for circuit used therefor

Abstract: PROBLEM TO BE SOLVED: To provide a flexible printed circuit board manufacturing method with which activation of a surface can be omitted when electroless nickel plating is applied to a polyimide resin film, and the adhesion reliability of an electroless nickel plating layer to a copper plating layer deposited on a surface thereof can be enhanced, and a base material for a circuit to be used therefor. SOLUTION: Electroless nickel plating is applied to the surface of a polyimide resin film 1. Electrolytic copper plating or electroless copper plating is applied to the surface of an electroless nickel plating layer 2 while maintaining wetness of the surface of the electroless nickel plating layer 2, and a thin copper plating layer 3 of 0.1-1.0μm thick is deposited thereby to manufacture the base material A for the circuit. Thereafter, a thick electrolytic copper plating layer 4 for forming the circuit is deposited on the surface of the thin copper plating layer 3. COPYRIGHT: (C)2005,JPO&NCIPI

The temperature sensitivity of fiber bragg gratings embedded in an Al 6061 matrix by ultrasonic welding

Abstract: The low temperatures and low pressure employed in ultrasonic welding make it suitable for embedding optical fiber gratings (fiber Bragg gratings (FBGs)) in the fabrication of 3D smart composites. However, FBG sensors embedded in metal matrices are easily damaged and broken. A method is therefore presented for the metallization of FBG by the combination of electroless nickel plating and electro nickel plating, followed by embedding the coated FBG in an aluminum alloy 6061 matrix in order to fabricate smart metal structures. Experimental results show that nickel plating can protect the FBG and provide benefits in the fabrication of aluminum alloy smart structures using ultrasonic welding. The temperature-sensing properties of smart metal structures fabricated in this way are analyzed, and the results show that the temperature sensitivity has been improved twofold. Also, the temperature sensing shows good linearity, and the temperature cross-sensitivity has been effectively controlled; the temperature resolu...

A new low-temperature electroless nickel plating process

Abstract: A new low-temperature electroless nickel plating process was developed by adding some inorganic agents to the plating solution, in which citrate acted as complexing agent. With the optimum process determined, high deposition rate was obtained, resulting in a bright deposit with excellent adhesion.