Topic
Electroless nickel plating
About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.
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TL;DR: In this article, a technique for nickel recovery from spent electroless nickel-plating solutions was developed, which yields nickel sulfate, a source for preparing an electroless metallic plating solution, and a nickel-containing concentrate.
Abstract: A technique for nickel recovery from spent electroless nickel-plating solutions was developed. The process yields nickel sulfate, a source for preparing an electroless nickel-plating solution, and a nickelcontaining concentrate.
6 citations
TL;DR: In this paper, the surface of the activated carbon was covered by a Ni-P coating, which was uniform, compact, and continuous and had an obvious metallic sheen, and the content of P and Ni was 2.73% and 97.27% in the coating.
Abstract: Nickel-based activated carbon was prepared from coconut shell activated carbon by electroless plating with palladium-free activation. The materials were characterized by scanning electron microscopy (SEM), X-ray energy dispersion spectroscopy (EDS), vibrating sample magnetometry (VSM), and vector network analyzer, respectively. The results show that the surface of the activated carbon was covered by a Ni-P coating, which was uniform, compact, and continuous and had an obvious metallic sheen. The content of P and Ni was 2.73% and 97.27% in the coating. Compared with the untreated activated carbon, the real permeability μ′ and imaginary permeability μ″ of Ni-based activated carbon became greater, whereas the real permittivity e′ and imaginary permittivity e″ became smaller. Also, the plated activated carbon was magnetic, making it suitable for some special applications. In general, the method reported here might be a feasible procedure to coat activated carbon with other magnetic metals, which may find application in various areas.
6 citations
Patent•
17 Jul 2013
TL;DR: An aqueous electroless nickel plating bath for forming electricless nickel coatings includes nickel, a hypophosphorous reducing agent, zinc, a bismuth stabilizer, and at least one of a complexing agent, a chelating agent, or a pH buffer as mentioned in this paper.
Abstract: An aqueous electroless nickel plating bath for forming electroless nickel coatings includes nickel, a hypophosphorous reducing agent, zinc, a bismuth stabilizer, and at least one of a complexing agent, a chelating agent, or a pH buffer, and is free of a sulfur compound.
6 citations
Patent•
06 Jan 2012
TL;DR: A ball grid array package device as mentioned in this paper includes a substrate with a copper grid array pad formed on the substrate, and a nickel layer may be formed using an electroless nickel plating process.
Abstract: A ball grid array package device includes a substrate with a copper ball grid array pad formed on the substrate. A nickel layer may be formed on the copper pad and a tin layer formed on the nickel layer. The nickel layer may be formed using an electroless nickel plating process. The tin layer may be formed using an immersion tin process. In some cases, silver may be used instead of tin and formed using an immersion silver process.
6 citations
Patent•
19 Mar 2008
TL;DR: In this paper, a method for recovering a nickel ion from an electroless plating waste solution as nickel compound, whose phosphorus content is ≤100 mg/Kg and which is recyclable as resources, is proposed.
Abstract: PROBLEM TO BE SOLVED: To provide a method for recovering a nickel ion from an electroless plating waste solution as nickel compound, whose phosphorus content is ≤100 mg/Kg and which is recyclable as resources. SOLUTION: This method for recovering the nickel source comprises: a regenerating process (A) of the selective heavy metal chelate resin filled up into a column; an adjusting process (B) of the electroless nickel plating waste solution; an adsorption-eluting process (C) for eluting the nickel with inorganic acid after absorbing the nickel ion to the chelate resin by bringing the nickel plating waste solution adjusted in the process (B) into contact with the chelate resin regenerated in the process (A); and a nickel recycling process (D), in which non-soluble nickel compound is precipitated by adding carbonate or alkali hydroxide or oxalic acid of ≥1 equivalent to the nickel salt water solution eluted in the process (C). COPYRIGHT: (C)2010,JPO&INPIT
6 citations