scispace - formally typeset
Search or ask a question
Topic

Electroless nickel plating

About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.


Papers
More filters
Patent
12 Dec 1991
TL;DR: In this paper, a composite electroless nickel plating solution is prepared, and the electroless n-coloring solution is incorparated with a polyvinylpyridine water-soluble derivative.
Abstract: PURPOSE: To prevent defective appearance and bubbling, to prolong a bath life and to improve workability by dispersing polytetrafluoroethylene in an electroless nickel plating solution incorporating polyvinylpyridine water-soluble derivative. CONSTITUTION: Polytetrafluoroethylene(PTFE) is dispersed in electroless nickel plating solution to obtain composite nickel plating film containing a PTFE particulate. When the composite electroless nickel plating solution is prepared, the electroless nickel plating solution is incorparated with a polyvinylpyridine water-soluble derivative. The derivative has preferably weight-average molecular weight of about 1500-400000 and its added amount of about 1000mg/l is appropriate. On the other hand, PTFE particulate of about 0.01-100μm diameter and its added amount of about 0.1-100g/l are preferable. Thereby PTFE is uniformly dispersed with no surfactant to get a good nickel plating film with which PTFE uniformly forms a eutectoid and a solution life is prolonged without bubbling. COPYRIGHT: (C)1993,JPO&Japio

6 citations

Patent
08 Jul 1994
TL;DR: In this paper, the color filter pattern on the inert plate of a liquid crystal display device is formed by using one or plural pieces of silane single layers by using silanes, such as hexamethyl disilasane.
Abstract: PURPOSE: To produce a black matrix by an electroless method between the color filter patterns on the inert plate of a liquid crystal display device. CONSTITUTION: A glass plate 1 is provided with one or plural pieces of silane single layers 3 by using silanes, such as hexamethyl disilasane. These layers are then treated with an aq. Pd sol stabilized by a water-soluble polymer, such as PVA and PVP. Pd nuclei 5 having a catalytic effect are formed by this treatment. Since the Pd nuclei 5 have the extremely high catalytic effect, the starting of elecrtroless nickel plating is possible by using all of electroless nickel plating baths low in reactivity which contain a stabilizer and are available on the market. The need for using a curable coating material contg. a photoinitiator or thermal initiator as an activated layer is eliminated.

6 citations

Journal ArticleDOI
TL;DR: In this paper, two sulfur-containing amino acids, cysteine and methionine, were employed as stabilizers in place of lead(II) acetate in the electroless nickel plating (ENP) system.
Abstract: Typical sulfur-containing amino acids, cysteine and methionine, were employed as stabilizers in place of lead(II) acetate in the electroless nickel plating (ENP) system. Each of these compounds presents a critical stabilizing concentration of ca. 10−5 mol/L, below which the ENP rate is slightly promoted with increasing concentration but above which it is significantly suppressed. Their role in stabilizing the ENP bath was found to involve inhibition of the anodic reaction of hypophosphite. The chemical adsorption of these two amino acids on active nickel sites at the Ni plating surface was studied via their adsorption on an in situ generated Ni powder. In addition, the stabilization mechanism was investigated by using potentiometry, X-ray photoelectron spectroscopy (XPS), and UV−vis/infrared spectroscopy. Finally, the bath stabilizing capabilities of these two amino acids and the change in ENP properties with time were assessed through a continuous operation comprising four metal-turnover (MTO) runs.

6 citations

Journal ArticleDOI
TL;DR: In this paper, the conditions required for forming a hybrid coating consisting of an outer nickel aluminide layer and an inner nickel layer on alloy steels were investigated and the effect of phosphorus or boron content in the initial nickel layer was investigated in relation to the spallation tendency of the coating either immediately after the aluminizing process or during the thermal annealing post-aluminising process.
Abstract: The present study investigates the conditions required for forming a hybrid coating consisting of an outer nickel aluminide layer and an inner nickel layer on alloy steels. A commercial alloy steel of 9Cr–1Mo was used as a substrate. Electroless and electronickel plating processes were used to form an initial nickel layer on the steel. The AlCl3 activated packs containing pure Al as a depositing source were then used to aluminise the nickel deposit at temperatures ≤650°C. The effect of phosphorus or boron content in the initial nickel layer deposited with the electroless nickel plating solutions using hypophosphite or boron–hydrogen compound as reducing agent was investigated in relation to the spallation tendency of the coating either immediately after the aluminising process or during the thermal annealing post-aluminising process. Under the aluminising conditions used, the outer nickel aluminide layer formed was Ni2Al3. For the electroplated nickel deposit, the growth kinetics of the outer Ni2A...

6 citations

Patent
25 Sep 1998
TL;DR: In this paper, the problem of forming a bump electrode only on an aluminum electrode requiring the bump electrode in a semiconductor device and also to enable suppression of deterioration of a plating solution is addressed.
Abstract: PROBLEM TO BE SOLVED: To enable easy formation of a bump electrode only on an aluminum electrode requiring the bump electrode in a semiconductor device and also to enable suppression of deterioration of a plating solution. SOLUTION: A native oxide film 2 on a surface of an aluminum electrode 1 is removed. Thereafter, in order to prevent re-formation of a native oxide film, a semiconductor device 3 is immersed into an alkaline solution containing Ni, a laser beam 9 is emitted on the aluminum electrode 1 requiring a bump electrode to locally heat only the vicinity of the electrode and to form an Ni particle film 5. The device is washed with pure water, immersed into an electroless nickel plating solution, the laser beam 9 is emitted on the aluminum electrode 1 requiring a bump electrode, and then an Ni film 6 is formed by an electroless nickel plating process. The device is washed with pure water. Thereafter the device is immersed into an electroless Au-plating solution, the laser beam 9 is emitted on the Al electrode 1 requiring the bump electrode, and then an Au film 7 is formed by the electroless plating process. Local heating by irradiation with the laser beam 9 enables a plating reaction to advance only on the Al electrode 1 requiring the bump electrode, whereby the bump electrode can be formed and also deterioration of the plating solution can be suppressed.

6 citations


Network Information
Related Topics (5)
Corrosion
152.8K papers, 1.9M citations
77% related
Coating
379.8K papers, 3.1M citations
76% related
Alloy
171.8K papers, 1.7M citations
74% related
Anode
139.4K papers, 2.1M citations
71% related
X-ray photoelectron spectroscopy
63.3K papers, 1.6M citations
71% related
Performance
Metrics
No. of papers in the topic in previous years
YearPapers
20233
202223
202124
202033
201957
201832